From mboxrd@z Thu Jan 1 00:00:00 1970 From: Srinivas Pandruvada Subject: [PATCH] thermal: kconfig: select THERMAL_WRITABLE_TRIPS for x86 thermal Date: Sat, 1 Aug 2015 22:46:41 -0700 Message-ID: <1438494401-3984-1-git-send-email-srinivas.pandruvada@linux.intel.com> Return-path: Received: from mga02.intel.com ([134.134.136.20]:64141 "EHLO mga02.intel.com" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S1751640AbbHBFq7 (ORCPT ); Sun, 2 Aug 2015 01:46:59 -0400 Sender: linux-pm-owner@vger.kernel.org List-Id: linux-pm@vger.kernel.org To: edubezval@gmail.com, rui.zhang@intel.com Cc: linux-pm@vger.kernel.org, Srinivas Pandruvada After the commit "thermal: core: Add Kconfig option to enable writable trips", user space tools like thermal daemon and Chrome OS DPTF thermal controller can no longer receive async events for thermal thresholds. Since we need to enable the new config introduced by above commit to allow writable trips. Selecting CONFIG_THERMAL_WRITABLE_TRIPS for x86 thermal drivers. Signed-off-by: Srinivas Pandruvada --- drivers/thermal/Kconfig | 3 +++ 1 file changed, 3 insertions(+) diff --git a/drivers/thermal/Kconfig b/drivers/thermal/Kconfig index 118938e..0e3b576 100644 --- a/drivers/thermal/Kconfig +++ b/drivers/thermal/Kconfig @@ -275,6 +275,7 @@ config X86_PKG_TEMP_THERMAL tristate "X86 package temperature thermal driver" depends on X86_THERMAL_VECTOR select THERMAL_GOV_USER_SPACE + select THERMAL_WRITABLE_TRIPS default m help Enable this to register CPU digital sensor for package temperature as @@ -296,6 +297,7 @@ config INTEL_SOC_DTS_THERMAL tristate "Intel SoCs DTS thermal driver" depends on X86 select INTEL_SOC_DTS_IOSF_CORE + select THERMAL_WRITABLE_TRIPS help Enable this to register Intel SoCs (e.g. Bay Trail) platform digital temperature sensor (DTS). These SoCs have two additional DTSs in @@ -322,6 +324,7 @@ config INT340X_THERMAL select ACPI_THERMAL_REL select ACPI_FAN select INTEL_SOC_DTS_IOSF_CORE + select THERMAL_WRITABLE_TRIPS help Newer laptops and tablets that use ACPI may have thermal sensors and other devices with thermal control capabilities outside the core -- 2.4.3