Re: [PATCH v5 00/33] New thermal OF code

Daniel Lezcano
2022-08-08T11:07:17Z

On 08/08/2022 12:55, Michael Walle wrote:
> Hi Daniel,

[ ... ]

>>> There seems to be one mistake within the new thermal code:

[ ... ]

>>> This was seen a sl28 board
>>> (arch/arm64/boot/dts/freescale/fsl-ls1028a-kontron-kbox-a-230-ls.dts).
>>> The same board in the KernelCI also have some more information:
>>> https://lavalab.kontron.com/scheduler/job/151900#L1162
>>>
>>> But I guess even if that is fixed, the driver will not probe due to the
>>> missing trip points? Are they now mandatory? Does it mean we'd need to
>>> update our device trees? But that will then mean older devices trees
>>> don't work anymore.
>>
>> Thanks for reporting, I'll investigate the issues you are reporting.
>>
>> There is no need to update any device tree file. The code does not
>> change the bindings, it is a rewrite of the implementation supposed to
>> be without impact on the existing bindings, thus the existing device
>> tree descriptions.
>>
>> Why are you saying there are missing trip points ? The dts shows trip
>> points for 'core-cluster' and 'ddr-controller' ?
>
> You are right. I've just looked at the error message:
>
> [    2.030452] thermal_sys: Failed to find 'trips' node
> [    2.033664] usb 1-1: new high-speed USB device number 2 using xhci-hcd
> [    2.035434] thermal_sys: Failed to find trip points for tmu id=2
>
> So maybe the code just don't find em.

For the board it seems there is no definition for tmu with id 2

--
<http://www.linaro.org/> Linaro.org │ Open source software for ARM SoCs

Follow Linaro: <http://www.facebook.com/pages/Linaro> Facebook |
<http://twitter.com/#!/linaroorg> Twitter |