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Date:   Fri, 22 Sep 2023 15:50:23 -0500
From:   Rob Herring <robh@kernel.org>
To:     Sricharan R <srichara@win-platform-upstream01.qualcomm.com>
Cc:     rafael@kernel.org, quic_srichara@quicinc.com,
        linux-kernel@vger.kernel.org, dmitry.baryshkov@linaro.org,
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        krzysztof.kozlowski@linaro.org, linux-arm-msm@vger.kernel.org,
        agross@kernel.org, conor+dt@kernel.org, daniel.lezcano@linaro.org
Subject: Re: [PATCH V3 1/4] dt-bindings: thermal: qcom-tsens: Add ipq5018
 compatible
Message-ID: <169541580075.3555585.17615922669140216464.robh@kernel.org>
References: <20230922115116.2748804-1-srichara@win-platform-upstream01.qualcomm.com>
 <20230922115116.2748804-2-srichara@win-platform-upstream01.qualcomm.com>
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On Fri, 22 Sep 2023 17:21:13 +0530, Sricharan R wrote:
> From: Sricharan Ramabadhran <quic_srichara@quicinc.com>
> 
> IPQ5018 has tsens v1.0 block with 4 sensors and 1 interrupt.
> 
> Signed-off-by: Sricharan Ramabadhran <quic_srichara@quicinc.com>
> ---
>  [v3] Added the tsens-ipq5018 as  new binding without rpm
> 
>  Documentation/devicetree/bindings/thermal/qcom-tsens.yaml | 4 ++++
>  1 file changed, 4 insertions(+)
> 

Acked-by: Rob Herring <robh@kernel.org>