From mboxrd@z Thu Jan 1 00:00:00 1970 From: Bartlomiej Zolnierkiewicz Subject: Re: [PATCH] thermal: offer TI thermal support only when ARCH_OMAP2PLUS is defined Date: Mon, 07 Oct 2013 12:51:18 +0200 Message-ID: <1777775.ZWYXb1l2UF@amdc1032> References: <3702969.8rn3SOscJE@amdc1032> <524F086E.4020608@ti.com> <24683815.qjRRgfGo3Z@amdc1032> Mime-Version: 1.0 Content-Type: text/plain; charset=ISO-8859-1 Content-Transfer-Encoding: 7Bit Return-path: Received: from mailout3.samsung.com ([203.254.224.33]:50296 "EHLO mailout3.samsung.com" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S1754577Ab3JGKv2 (ORCPT ); Mon, 7 Oct 2013 06:51:28 -0400 In-reply-to: <24683815.qjRRgfGo3Z@amdc1032> Sender: linux-pm-owner@vger.kernel.org List-Id: linux-pm@vger.kernel.org To: Eduardo Valentin Cc: Zhang Rui , linux-pm@vger.kernel.org, linux-kernel@vger.kernel.org, Kyungmin Park , Arnd Bergmann On Monday, October 07, 2013 12:05:05 PM Bartlomiej Zolnierkiewicz wrote: > On Friday, October 04, 2013 02:26:54 PM Eduardo Valentin wrote: > > On 04-10-2013 14:22, Eduardo Valentin wrote: > > > On 04-10-2013 08:35, Bartlomiej Zolnierkiewicz wrote: > > >> Menu for Texas Instruments thermal support is visible on all > > >> platforms and TI_SOC_THERMAL + TI_THERMAL config options can > > >> be selected also on EXYNOS platform (on which ARCH_HAS_BANDGAP > > >> config option is selected by SoCs config options to fulfill > > >> EXYNOS_THERMAL config option dependency). Thus the code which > > >> is never used can be build. Fix it by making TI menu dependent > > >> on ARCH_OMAP2PLUS config option. > > >> > > > > > > Besides, you can always disable the driver if you are not interested in > > compiling it. > > You should not have TI-specific drivers visible without any TI dependencies. > ARCH_BANDGAP dependency is not enough, ARCH_BANDGAP is also used by EXYNOS s/ARCH_BANDGAP/ARCH_HAS_BANDGAP/ of course > to indicate thermal support. Currently you can select TI thermal drivers on > EXYNOS platforms without any other dependencies on TI. This is just wrong, > it can result in unused code being build currently but can result in more > severe problems in the future (build break). Arnd, could you please give your opinion on the issue? Best regards, -- Bartlomiej Zolnierkiewicz Samsung R&D Institute Poland Samsung Electronics > > >> Signed-off-by: Bartlomiej Zolnierkiewicz > > >> Signed-off-by: Kyungmin Park > > >> --- > > >> drivers/thermal/Kconfig | 1 + > > >> 1 file changed, 1 insertion(+) > > >> > > >> diff --git a/drivers/thermal/Kconfig b/drivers/thermal/Kconfig > > >> index 57e06a9..a709c63 100644 > > >> --- a/drivers/thermal/Kconfig > > >> +++ b/drivers/thermal/Kconfig > > >> @@ -193,6 +193,7 @@ config X86_PKG_TEMP_THERMAL > > >> notification methods. > > >> > > >> menu "Texas Instruments thermal drivers" > > >> +depends on ARCH_OMAP2PLUS > > > > > > No, this driver is not for ARCH_OMAP*, but for TI bandgap, with the > > > option to offer thermal control. So, the HW supported is TI bandgap IP, > > > not ARCH_OMAP*. It happens to be so that OMAP2PLUS all have a > > > (different) version of this device. > > > > > > However, DRA7 devices, for instance, also feature the bandgap IP > > > (different version of those present in OMAP devices), and it is not > > > ARCH_OMAP2PLUS. > > > > > > And because of that, the design of this driver is different. It is not > > > expected to depend on an arch, but the arch code is expected to select > > > ARCH_HAS_BANDGAP. > > > > > >> source "drivers/thermal/ti-soc-thermal/Kconfig" > > >> endmenu > > Best regards, > -- > Bartlomiej Zolnierkiewicz > Samsung R&D Institute Poland > Samsung Electronics