* [PATCH 0/6] Enable MSM8226 TSENS support
@ 2023-05-07 20:12 Matti Lehtimäki
2023-05-07 20:12 ` [PATCH 2/6] dt-bindings: thermal: tsens: Add compatible for MSM8226 Matti Lehtimäki
` (2 more replies)
0 siblings, 3 replies; 13+ messages in thread
From: Matti Lehtimäki @ 2023-05-07 20:12 UTC (permalink / raw)
To: linux-arm-msm
Cc: ~postmarketos/upstreaming, phone-devel, Matti Lehtimäki,
Amit Kucheria, devicetree, Konrad Dybcio, linux-kernel, linux-pm,
Srinivas Kandagatla, Zhang Rui
Add support for tsens in MSM8226. Add qfprom compatible for MSM8226.
Add device tree nodes for qfprom, tsens and thermal zones for MSM8226.
Matti Lehtimäki (6):
dt-bindings: nvmem: qfprom: Add compatible for MSM8226
dt-bindings: thermal: tsens: Add compatible for MSM8226
thermal/drivers/qcom/tsens-v0_1: Add support for MSM8226
ARM: dts: msm8226: Add qfprom node
ARM: dts: msm8226: Add tsens node and related nvmem cells
ARM: dts: msm8226: Add thermal zones node
.../bindings/nvmem/qcom,qfprom.yaml | 1 +
.../bindings/thermal/qcom-tsens.yaml | 1 +
arch/arm/boot/dts/qcom-msm8226.dtsi | 164 ++++++++++++++++++
drivers/thermal/qcom/tsens-v0_1.c | 27 ++-
drivers/thermal/qcom/tsens.c | 3 +
drivers/thermal/qcom/tsens.h | 2 +-
6 files changed, 196 insertions(+), 2 deletions(-)
--
2.34.1
^ permalink raw reply [flat|nested] 13+ messages in thread* [PATCH 2/6] dt-bindings: thermal: tsens: Add compatible for MSM8226 2023-05-07 20:12 [PATCH 0/6] Enable MSM8226 TSENS support Matti Lehtimäki @ 2023-05-07 20:12 ` Matti Lehtimäki 2023-05-07 20:22 ` Luca Weiss ` (3 more replies) 2023-05-07 20:12 ` [PATCH 3/6] thermal/drivers/qcom/tsens-v0_1: Add support " Matti Lehtimäki 2023-06-13 23:48 ` (subset) [PATCH 0/6] Enable MSM8226 TSENS support Bjorn Andersson 2 siblings, 4 replies; 13+ messages in thread From: Matti Lehtimäki @ 2023-05-07 20:12 UTC (permalink / raw) To: linux-arm-msm Cc: ~postmarketos/upstreaming, phone-devel, Matti Lehtimäki, Amit Kucheria, Thara Gopinath, Andy Gross, Bjorn Andersson, Konrad Dybcio, Rafael J. Wysocki, Daniel Lezcano, Zhang Rui, Rob Herring, Krzysztof Kozlowski, linux-pm, devicetree, linux-kernel Qualcomm MSM8226 has tsens v0.1 block. Signed-off-by: Matti Lehtimäki <matti.lehtimaki@gmail.com> --- Documentation/devicetree/bindings/thermal/qcom-tsens.yaml | 1 + 1 file changed, 1 insertion(+) diff --git a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml index 926e9c51c93c..d6b2957d5137 100644 --- a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml +++ b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml @@ -29,6 +29,7 @@ properties: items: - enum: - qcom,mdm9607-tsens + - qcom,msm8226-tsens - qcom,msm8916-tsens - qcom,msm8939-tsens - qcom,msm8974-tsens -- 2.34.1 ^ permalink raw reply related [flat|nested] 13+ messages in thread
* Re: [PATCH 2/6] dt-bindings: thermal: tsens: Add compatible for MSM8226 2023-05-07 20:12 ` [PATCH 2/6] dt-bindings: thermal: tsens: Add compatible for MSM8226 Matti Lehtimäki @ 2023-05-07 20:22 ` Luca Weiss 2023-05-07 21:25 ` Rob Herring ` (2 subsequent siblings) 3 siblings, 0 replies; 13+ messages in thread From: Luca Weiss @ 2023-05-07 20:22 UTC (permalink / raw) To: linux-arm-msm, ~postmarketos/upstreaming Cc: ~postmarketos/upstreaming, phone-devel, Matti Lehtimäki, Amit Kucheria, Thara Gopinath, Andy Gross, Bjorn Andersson, Konrad Dybcio, Rafael J. Wysocki, Daniel Lezcano, Zhang Rui, Rob Herring, Krzysztof Kozlowski, linux-pm, devicetree, linux-kernel, Matti Lehtimäki On Sonntag, 7. Mai 2023 22:12:20 CEST Matti Lehtimäki wrote: > Qualcomm MSM8226 has tsens v0.1 block. > > Signed-off-by: Matti Lehtimäki <matti.lehtimaki@gmail.com> Reviewed-by: Luca Weiss <luca@z3ntu.xyz> > --- > Documentation/devicetree/bindings/thermal/qcom-tsens.yaml | 1 + > 1 file changed, 1 insertion(+) > > diff --git a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml > b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml index > 926e9c51c93c..d6b2957d5137 100644 > --- a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml > +++ b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml > @@ -29,6 +29,7 @@ properties: > items: > - enum: > - qcom,mdm9607-tsens > + - qcom,msm8226-tsens > - qcom,msm8916-tsens > - qcom,msm8939-tsens > - qcom,msm8974-tsens ^ permalink raw reply [flat|nested] 13+ messages in thread
* Re: [PATCH 2/6] dt-bindings: thermal: tsens: Add compatible for MSM8226 2023-05-07 20:12 ` [PATCH 2/6] dt-bindings: thermal: tsens: Add compatible for MSM8226 Matti Lehtimäki 2023-05-07 20:22 ` Luca Weiss @ 2023-05-07 21:25 ` Rob Herring 2023-05-10 13:57 ` Krzysztof Kozlowski 2023-06-05 14:39 ` Daniel Lezcano 3 siblings, 0 replies; 13+ messages in thread From: Rob Herring @ 2023-05-07 21:25 UTC (permalink / raw) To: Matti Lehtimäki Cc: linux-pm, Daniel Lezcano, Thara Gopinath, linux-kernel, phone-devel, Bjorn Andersson, linux-arm-msm, Andy Gross, Krzysztof Kozlowski, Rafael J. Wysocki, Rob Herring, ~postmarketos/upstreaming, devicetree, Zhang Rui, Konrad Dybcio, Amit Kucheria On Sun, 07 May 2023 23:12:20 +0300, Matti Lehtimäki wrote: > Qualcomm MSM8226 has tsens v0.1 block. > > Signed-off-by: Matti Lehtimäki <matti.lehtimaki@gmail.com> > --- > Documentation/devicetree/bindings/thermal/qcom-tsens.yaml | 1 + > 1 file changed, 1 insertion(+) > My bot found errors running 'make DT_CHECKER_FLAGS=-m dt_binding_check' on your patch (DT_CHECKER_FLAGS is new in v5.13): yamllint warnings/errors: dtschema/dtc warnings/errors: /builds/robherring/dt-review-ci/linux/Documentation/devicetree/bindings/pci/fsl,imx6q-pcie-ep.example.dtb: pcie-ep@33800000: Unevaluated properties are not allowed ('assigned-clock-parents', 'assigned-clock-rates', 'assigned-clocks' were unexpected) From schema: /builds/robherring/dt-review-ci/linux/Documentation/devicetree/bindings/pci/fsl,imx6q-pcie-ep.yaml /builds/robherring/dt-review-ci/linux/Documentation/devicetree/bindings/media/rockchip-isp1.example.dtb: camera@3c: port:endpoint:data-lanes: [[1]] is too short From schema: /builds/robherring/dt-review-ci/linux/Documentation/devicetree/bindings/media/i2c/ovti,ov2685.yaml /builds/robherring/dt-review-ci/linux/Documentation/devicetree/bindings/media/i2c/ovti,ov2685.example.dtb: camera-sensor@3c: port:endpoint:data-lanes: [[1]] is too short From schema: /builds/robherring/dt-review-ci/linux/Documentation/devicetree/bindings/media/i2c/ovti,ov2685.yaml doc reference errors (make refcheckdocs): Documentation/usb/gadget_uvc.rst: Documentation/userspace-api/media/v4l/pixfmt-packed.yuv.rst MAINTAINERS: Documentation/devicetree/bindings/pwm/pwm-apple.yaml See https://patchwork.ozlabs.org/project/devicetree-bindings/patch/20230507201225.89694-3-matti.lehtimaki@gmail.com The base for the series is generally the latest rc1. A different dependency should be noted in *this* patch. If you already ran 'make dt_binding_check' and didn't see the above error(s), then make sure 'yamllint' is installed and dt-schema is up to date: pip3 install dtschema --upgrade Please check and re-submit after running the above command yourself. Note that DT_SCHEMA_FILES can be set to your schema file to speed up checking your schema. However, it must be unset to test all examples with your schema. ^ permalink raw reply [flat|nested] 13+ messages in thread
* Re: [PATCH 2/6] dt-bindings: thermal: tsens: Add compatible for MSM8226 2023-05-07 20:12 ` [PATCH 2/6] dt-bindings: thermal: tsens: Add compatible for MSM8226 Matti Lehtimäki 2023-05-07 20:22 ` Luca Weiss 2023-05-07 21:25 ` Rob Herring @ 2023-05-10 13:57 ` Krzysztof Kozlowski 2023-06-05 14:39 ` Daniel Lezcano 3 siblings, 0 replies; 13+ messages in thread From: Krzysztof Kozlowski @ 2023-05-10 13:57 UTC (permalink / raw) To: Matti Lehtimäki, linux-arm-msm Cc: ~postmarketos/upstreaming, phone-devel, Amit Kucheria, Thara Gopinath, Andy Gross, Bjorn Andersson, Konrad Dybcio, Rafael J. Wysocki, Daniel Lezcano, Zhang Rui, Rob Herring, Krzysztof Kozlowski, linux-pm, devicetree, linux-kernel On 07/05/2023 22:12, Matti Lehtimäki wrote: > Qualcomm MSM8226 has tsens v0.1 block. > > Signed-off-by: Matti Lehtimäki <matti.lehtimaki@gmail.com> > --- Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Bot's errors can be ignored. Best regards, Krzysztof ^ permalink raw reply [flat|nested] 13+ messages in thread
* Re: [PATCH 2/6] dt-bindings: thermal: tsens: Add compatible for MSM8226 2023-05-07 20:12 ` [PATCH 2/6] dt-bindings: thermal: tsens: Add compatible for MSM8226 Matti Lehtimäki ` (2 preceding siblings ...) 2023-05-10 13:57 ` Krzysztof Kozlowski @ 2023-06-05 14:39 ` Daniel Lezcano 3 siblings, 0 replies; 13+ messages in thread From: Daniel Lezcano @ 2023-06-05 14:39 UTC (permalink / raw) To: Matti Lehtimäki, linux-arm-msm Cc: ~postmarketos/upstreaming, phone-devel, Amit Kucheria, Thara Gopinath, Andy Gross, Bjorn Andersson, Konrad Dybcio, Rafael J. Wysocki, Zhang Rui, Rob Herring, Krzysztof Kozlowski, linux-pm, devicetree, linux-kernel On 07/05/2023 22:12, Matti Lehtimäki wrote: > Qualcomm MSM8226 has tsens v0.1 block. > > Signed-off-by: Matti Lehtimäki <matti.lehtimaki@gmail.com> > --- Applied, thanks -- <http://www.linaro.org/> Linaro.org │ Open source software for ARM SoCs Follow Linaro: <http://www.facebook.com/pages/Linaro> Facebook | <http://twitter.com/#!/linaroorg> Twitter | <http://www.linaro.org/linaro-blog/> Blog ^ permalink raw reply [flat|nested] 13+ messages in thread
* [PATCH 3/6] thermal/drivers/qcom/tsens-v0_1: Add support for MSM8226 2023-05-07 20:12 [PATCH 0/6] Enable MSM8226 TSENS support Matti Lehtimäki 2023-05-07 20:12 ` [PATCH 2/6] dt-bindings: thermal: tsens: Add compatible for MSM8226 Matti Lehtimäki @ 2023-05-07 20:12 ` Matti Lehtimäki 2023-05-07 20:26 ` Luca Weiss ` (2 more replies) 2023-06-13 23:48 ` (subset) [PATCH 0/6] Enable MSM8226 TSENS support Bjorn Andersson 2 siblings, 3 replies; 13+ messages in thread From: Matti Lehtimäki @ 2023-05-07 20:12 UTC (permalink / raw) To: linux-arm-msm Cc: ~postmarketos/upstreaming, phone-devel, Matti Lehtimäki, Andy Gross, Bjorn Andersson, Konrad Dybcio, Amit Kucheria, Thara Gopinath, Rafael J. Wysocki, Daniel Lezcano, Zhang Rui, linux-pm, linux-kernel The MSM8226 TSENS IP has 6 thermal sensors in a TSENS v0.1 block. The thermal sensors use non-standard slope values. Signed-off-by: Matti Lehtimäki <matti.lehtimaki@gmail.com> --- drivers/thermal/qcom/tsens-v0_1.c | 27 ++++++++++++++++++++++++++- drivers/thermal/qcom/tsens.c | 3 +++ drivers/thermal/qcom/tsens.h | 2 +- 3 files changed, 30 insertions(+), 2 deletions(-) diff --git a/drivers/thermal/qcom/tsens-v0_1.c b/drivers/thermal/qcom/tsens-v0_1.c index e89c6f39a3ae..ad57ab94546b 100644 --- a/drivers/thermal/qcom/tsens-v0_1.c +++ b/drivers/thermal/qcom/tsens-v0_1.c @@ -243,6 +243,18 @@ static int calibrate_8974(struct tsens_priv *priv) return 0; } +static int __init init_8226(struct tsens_priv *priv) +{ + priv->sensor[0].slope = 2901; + priv->sensor[1].slope = 2846; + priv->sensor[2].slope = 3038; + priv->sensor[3].slope = 2955; + priv->sensor[4].slope = 2901; + priv->sensor[5].slope = 2846; + + return init_common(priv); +} + static int __init init_8939(struct tsens_priv *priv) { priv->sensor[0].slope = 2911; priv->sensor[1].slope = 2789; @@ -258,7 +270,7 @@ static int __init init_8939(struct tsens_priv *priv) { return init_common(priv); } -/* v0.1: 8916, 8939, 8974, 9607 */ +/* v0.1: 8226, 8916, 8939, 8974, 9607 */ static struct tsens_features tsens_v0_1_feat = { .ver_major = VER_0_1, @@ -313,6 +325,19 @@ static const struct tsens_ops ops_v0_1 = { .get_temp = get_temp_common, }; +static const struct tsens_ops ops_8226 = { + .init = init_8226, + .calibrate = tsens_calibrate_common, + .get_temp = get_temp_common, +}; + +struct tsens_plat_data data_8226 = { + .num_sensors = 6, + .ops = &ops_8226, + .feat = &tsens_v0_1_feat, + .fields = tsens_v0_1_regfields, +}; + static const struct tsens_ops ops_8916 = { .init = init_common, .calibrate = calibrate_8916, diff --git a/drivers/thermal/qcom/tsens.c b/drivers/thermal/qcom/tsens.c index 8020ead2794e..eb33a8bf0488 100644 --- a/drivers/thermal/qcom/tsens.c +++ b/drivers/thermal/qcom/tsens.c @@ -1095,6 +1095,9 @@ static const struct of_device_id tsens_table[] = { }, { .compatible = "qcom,mdm9607-tsens", .data = &data_9607, + }, { + .compatible = "qcom,msm8226-tsens", + .data = &data_8226, }, { .compatible = "qcom,msm8916-tsens", .data = &data_8916, diff --git a/drivers/thermal/qcom/tsens.h b/drivers/thermal/qcom/tsens.h index dba9cd38f637..433eba370998 100644 --- a/drivers/thermal/qcom/tsens.h +++ b/drivers/thermal/qcom/tsens.h @@ -635,7 +635,7 @@ int get_temp_common(const struct tsens_sensor *s, int *temp); extern struct tsens_plat_data data_8960; /* TSENS v0.1 targets */ -extern struct tsens_plat_data data_8916, data_8939, data_8974, data_9607; +extern struct tsens_plat_data data_8226, data_8916, data_8939, data_8974, data_9607; /* TSENS v1 targets */ extern struct tsens_plat_data data_tsens_v1, data_8976, data_8956; -- 2.34.1 ^ permalink raw reply related [flat|nested] 13+ messages in thread
* Re: [PATCH 3/6] thermal/drivers/qcom/tsens-v0_1: Add support for MSM8226 2023-05-07 20:12 ` [PATCH 3/6] thermal/drivers/qcom/tsens-v0_1: Add support " Matti Lehtimäki @ 2023-05-07 20:26 ` Luca Weiss 2023-05-07 20:40 ` Dmitry Baryshkov 2023-06-05 14:39 ` Daniel Lezcano 2 siblings, 0 replies; 13+ messages in thread From: Luca Weiss @ 2023-05-07 20:26 UTC (permalink / raw) To: linux-arm-msm, ~postmarketos/upstreaming Cc: ~postmarketos/upstreaming, phone-devel, Matti Lehtimäki, Andy Gross, Bjorn Andersson, Konrad Dybcio, Amit Kucheria, Thara Gopinath, Rafael J. Wysocki, Daniel Lezcano, Zhang Rui, linux-pm, linux-kernel, Matti Lehtimäki On Sonntag, 7. Mai 2023 22:12:21 CEST Matti Lehtimäki wrote: > The MSM8226 TSENS IP has 6 thermal sensors in a TSENS v0.1 block. > The thermal sensors use non-standard slope values. Matches the configuration found in msm8226-v2.dtsi in msm-3.10 kernel. Reviewed-by: Luca Weiss <luca@z3ntu.xyz> > > Signed-off-by: Matti Lehtimäki <matti.lehtimaki@gmail.com> > --- > drivers/thermal/qcom/tsens-v0_1.c | 27 ++++++++++++++++++++++++++- > drivers/thermal/qcom/tsens.c | 3 +++ > drivers/thermal/qcom/tsens.h | 2 +- > 3 files changed, 30 insertions(+), 2 deletions(-) > > diff --git a/drivers/thermal/qcom/tsens-v0_1.c > b/drivers/thermal/qcom/tsens-v0_1.c index e89c6f39a3ae..ad57ab94546b 100644 > --- a/drivers/thermal/qcom/tsens-v0_1.c > +++ b/drivers/thermal/qcom/tsens-v0_1.c > @@ -243,6 +243,18 @@ static int calibrate_8974(struct tsens_priv *priv) > return 0; > } > > +static int __init init_8226(struct tsens_priv *priv) > +{ > + priv->sensor[0].slope = 2901; > + priv->sensor[1].slope = 2846; > + priv->sensor[2].slope = 3038; > + priv->sensor[3].slope = 2955; > + priv->sensor[4].slope = 2901; > + priv->sensor[5].slope = 2846; > + > + return init_common(priv); > +} > + > static int __init init_8939(struct tsens_priv *priv) { > priv->sensor[0].slope = 2911; > priv->sensor[1].slope = 2789; > @@ -258,7 +270,7 @@ static int __init init_8939(struct tsens_priv *priv) { > return init_common(priv); > } > > -/* v0.1: 8916, 8939, 8974, 9607 */ > +/* v0.1: 8226, 8916, 8939, 8974, 9607 */ > > static struct tsens_features tsens_v0_1_feat = { > .ver_major = VER_0_1, > @@ -313,6 +325,19 @@ static const struct tsens_ops ops_v0_1 = { > .get_temp = get_temp_common, > }; > > +static const struct tsens_ops ops_8226 = { > + .init = init_8226, > + .calibrate = tsens_calibrate_common, > + .get_temp = get_temp_common, > +}; > + > +struct tsens_plat_data data_8226 = { > + .num_sensors = 6, > + .ops = &ops_8226, > + .feat = &tsens_v0_1_feat, > + .fields = tsens_v0_1_regfields, > +}; > + > static const struct tsens_ops ops_8916 = { > .init = init_common, > .calibrate = calibrate_8916, > diff --git a/drivers/thermal/qcom/tsens.c b/drivers/thermal/qcom/tsens.c > index 8020ead2794e..eb33a8bf0488 100644 > --- a/drivers/thermal/qcom/tsens.c > +++ b/drivers/thermal/qcom/tsens.c > @@ -1095,6 +1095,9 @@ static const struct of_device_id tsens_table[] = { > }, { > .compatible = "qcom,mdm9607-tsens", > .data = &data_9607, > + }, { > + .compatible = "qcom,msm8226-tsens", > + .data = &data_8226, > }, { > .compatible = "qcom,msm8916-tsens", > .data = &data_8916, > diff --git a/drivers/thermal/qcom/tsens.h b/drivers/thermal/qcom/tsens.h > index dba9cd38f637..433eba370998 100644 > --- a/drivers/thermal/qcom/tsens.h > +++ b/drivers/thermal/qcom/tsens.h > @@ -635,7 +635,7 @@ int get_temp_common(const struct tsens_sensor *s, int > *temp); extern struct tsens_plat_data data_8960; > > /* TSENS v0.1 targets */ > -extern struct tsens_plat_data data_8916, data_8939, data_8974, data_9607; > +extern struct tsens_plat_data data_8226, data_8916, data_8939, data_8974, > data_9607; > > /* TSENS v1 targets */ > extern struct tsens_plat_data data_tsens_v1, data_8976, data_8956; ^ permalink raw reply [flat|nested] 13+ messages in thread
* Re: [PATCH 3/6] thermal/drivers/qcom/tsens-v0_1: Add support for MSM8226 2023-05-07 20:12 ` [PATCH 3/6] thermal/drivers/qcom/tsens-v0_1: Add support " Matti Lehtimäki 2023-05-07 20:26 ` Luca Weiss @ 2023-05-07 20:40 ` Dmitry Baryshkov 2023-05-07 21:11 ` Matti Lehtimäki 2023-06-05 14:39 ` Daniel Lezcano 2 siblings, 1 reply; 13+ messages in thread From: Dmitry Baryshkov @ 2023-05-07 20:40 UTC (permalink / raw) To: Matti Lehtimäki, linux-arm-msm Cc: ~postmarketos/upstreaming, phone-devel, Andy Gross, Bjorn Andersson, Konrad Dybcio, Amit Kucheria, Thara Gopinath, Rafael J. Wysocki, Daniel Lezcano, Zhang Rui, linux-pm, linux-kernel On 07/05/2023 23:12, Matti Lehtimäki wrote: > The MSM8226 TSENS IP has 6 thermal sensors in a TSENS v0.1 block. > The thermal sensors use non-standard slope values. Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Note, the driver from 3.10 also provides custom data for non-calibrated mode. We can either ignore that (in the hope that all devices leaving the factory are calibrated), or fix it in the manner close to 8x74. > > Signed-off-by: Matti Lehtimäki <matti.lehtimaki@gmail.com> > --- > drivers/thermal/qcom/tsens-v0_1.c | 27 ++++++++++++++++++++++++++- > drivers/thermal/qcom/tsens.c | 3 +++ > drivers/thermal/qcom/tsens.h | 2 +- > 3 files changed, 30 insertions(+), 2 deletions(-) > > diff --git a/drivers/thermal/qcom/tsens-v0_1.c b/drivers/thermal/qcom/tsens-v0_1.c > index e89c6f39a3ae..ad57ab94546b 100644 > --- a/drivers/thermal/qcom/tsens-v0_1.c > +++ b/drivers/thermal/qcom/tsens-v0_1.c > @@ -243,6 +243,18 @@ static int calibrate_8974(struct tsens_priv *priv) > return 0; > } > > +static int __init init_8226(struct tsens_priv *priv) > +{ > + priv->sensor[0].slope = 2901; > + priv->sensor[1].slope = 2846; > + priv->sensor[2].slope = 3038; > + priv->sensor[3].slope = 2955; > + priv->sensor[4].slope = 2901; > + priv->sensor[5].slope = 2846; > + > + return init_common(priv); > +} > + > static int __init init_8939(struct tsens_priv *priv) { > priv->sensor[0].slope = 2911; > priv->sensor[1].slope = 2789; > @@ -258,7 +270,7 @@ static int __init init_8939(struct tsens_priv *priv) { > return init_common(priv); > } > > -/* v0.1: 8916, 8939, 8974, 9607 */ > +/* v0.1: 8226, 8916, 8939, 8974, 9607 */ > > static struct tsens_features tsens_v0_1_feat = { > .ver_major = VER_0_1, > @@ -313,6 +325,19 @@ static const struct tsens_ops ops_v0_1 = { > .get_temp = get_temp_common, > }; > > +static const struct tsens_ops ops_8226 = { > + .init = init_8226, > + .calibrate = tsens_calibrate_common, > + .get_temp = get_temp_common, > +}; > + > +struct tsens_plat_data data_8226 = { > + .num_sensors = 6, > + .ops = &ops_8226, > + .feat = &tsens_v0_1_feat, > + .fields = tsens_v0_1_regfields, > +}; > + > static const struct tsens_ops ops_8916 = { > .init = init_common, > .calibrate = calibrate_8916, > diff --git a/drivers/thermal/qcom/tsens.c b/drivers/thermal/qcom/tsens.c > index 8020ead2794e..eb33a8bf0488 100644 > --- a/drivers/thermal/qcom/tsens.c > +++ b/drivers/thermal/qcom/tsens.c > @@ -1095,6 +1095,9 @@ static const struct of_device_id tsens_table[] = { > }, { > .compatible = "qcom,mdm9607-tsens", > .data = &data_9607, > + }, { > + .compatible = "qcom,msm8226-tsens", > + .data = &data_8226, > }, { > .compatible = "qcom,msm8916-tsens", > .data = &data_8916, > diff --git a/drivers/thermal/qcom/tsens.h b/drivers/thermal/qcom/tsens.h > index dba9cd38f637..433eba370998 100644 > --- a/drivers/thermal/qcom/tsens.h > +++ b/drivers/thermal/qcom/tsens.h > @@ -635,7 +635,7 @@ int get_temp_common(const struct tsens_sensor *s, int *temp); > extern struct tsens_plat_data data_8960; > > /* TSENS v0.1 targets */ > -extern struct tsens_plat_data data_8916, data_8939, data_8974, data_9607; > +extern struct tsens_plat_data data_8226, data_8916, data_8939, data_8974, data_9607; > > /* TSENS v1 targets */ > extern struct tsens_plat_data data_tsens_v1, data_8976, data_8956; -- With best wishes Dmitry ^ permalink raw reply [flat|nested] 13+ messages in thread
* Re: [PATCH 3/6] thermal/drivers/qcom/tsens-v0_1: Add support for MSM8226 2023-05-07 20:40 ` Dmitry Baryshkov @ 2023-05-07 21:11 ` Matti Lehtimäki 2023-05-07 22:49 ` Dmitry Baryshkov 0 siblings, 1 reply; 13+ messages in thread From: Matti Lehtimäki @ 2023-05-07 21:11 UTC (permalink / raw) To: Dmitry Baryshkov, linux-arm-msm Cc: ~postmarketos/upstreaming, phone-devel, Andy Gross, Bjorn Andersson, Konrad Dybcio, Amit Kucheria, Thara Gopinath, Rafael J. Wysocki, Daniel Lezcano, Zhang Rui, linux-pm, linux-kernel On 7.5.2023 23.40, Dmitry Baryshkov wrote: > On 07/05/2023 23:12, Matti Lehtimäki wrote: >> The MSM8226 TSENS IP has 6 thermal sensors in a TSENS v0.1 block. >> The thermal sensors use non-standard slope values. > > Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> > > Note, the driver from 3.10 also provides custom data for non-calibrated mode. We can either ignore that (in the hope that all devices leaving the factory are calibrated), or fix it in the manner close to 8x74. That is true, 3.10 kernel does support non-calibrated mode. I can add support for that in a new version if that is wanted. ^ permalink raw reply [flat|nested] 13+ messages in thread
* Re: [PATCH 3/6] thermal/drivers/qcom/tsens-v0_1: Add support for MSM8226 2023-05-07 21:11 ` Matti Lehtimäki @ 2023-05-07 22:49 ` Dmitry Baryshkov 0 siblings, 0 replies; 13+ messages in thread From: Dmitry Baryshkov @ 2023-05-07 22:49 UTC (permalink / raw) To: Matti Lehtimäki Cc: linux-arm-msm, ~postmarketos/upstreaming, phone-devel, Andy Gross, Bjorn Andersson, Konrad Dybcio, Amit Kucheria, Thara Gopinath, Rafael J. Wysocki, Daniel Lezcano, Zhang Rui, linux-pm, linux-kernel On Mon, 8 May 2023 at 00:11, Matti Lehtimäki <matti.lehtimaki@gmail.com> wrote: > > On 7.5.2023 23.40, Dmitry Baryshkov wrote: > > On 07/05/2023 23:12, Matti Lehtimäki wrote: > >> The MSM8226 TSENS IP has 6 thermal sensors in a TSENS v0.1 block. > >> The thermal sensors use non-standard slope values. > > > > Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> > > > > Note, the driver from 3.10 also provides custom data for non-calibrated mode. We can either ignore that (in the hope that all devices leaving the factory are calibrated), or fix it in the manner close to 8x74. > > That is true, 3.10 kernel does support non-calibrated mode. I can add support for that in a new version if that is wanted. If there are no other comments, I'd suggest sending that as a follow up (if sending it at all). The tsens driver provides some default values for non-calibrated mode, so it is a minor issue. -- With best wishes Dmitry ^ permalink raw reply [flat|nested] 13+ messages in thread
* Re: [PATCH 3/6] thermal/drivers/qcom/tsens-v0_1: Add support for MSM8226 2023-05-07 20:12 ` [PATCH 3/6] thermal/drivers/qcom/tsens-v0_1: Add support " Matti Lehtimäki 2023-05-07 20:26 ` Luca Weiss 2023-05-07 20:40 ` Dmitry Baryshkov @ 2023-06-05 14:39 ` Daniel Lezcano 2 siblings, 0 replies; 13+ messages in thread From: Daniel Lezcano @ 2023-06-05 14:39 UTC (permalink / raw) To: Matti Lehtimäki, linux-arm-msm Cc: ~postmarketos/upstreaming, phone-devel, Andy Gross, Bjorn Andersson, Konrad Dybcio, Amit Kucheria, Thara Gopinath, Rafael J. Wysocki, Zhang Rui, linux-pm, linux-kernel On 07/05/2023 22:12, Matti Lehtimäki wrote: > The MSM8226 TSENS IP has 6 thermal sensors in a TSENS v0.1 block. > The thermal sensors use non-standard slope values. > > Signed-off-by: Matti Lehtimäki <matti.lehtimaki@gmail.com> > --- Applied, thanks -- <http://www.linaro.org/> Linaro.org │ Open source software for ARM SoCs Follow Linaro: <http://www.facebook.com/pages/Linaro> Facebook | <http://twitter.com/#!/linaroorg> Twitter | <http://www.linaro.org/linaro-blog/> Blog ^ permalink raw reply [flat|nested] 13+ messages in thread
* Re: (subset) [PATCH 0/6] Enable MSM8226 TSENS support 2023-05-07 20:12 [PATCH 0/6] Enable MSM8226 TSENS support Matti Lehtimäki 2023-05-07 20:12 ` [PATCH 2/6] dt-bindings: thermal: tsens: Add compatible for MSM8226 Matti Lehtimäki 2023-05-07 20:12 ` [PATCH 3/6] thermal/drivers/qcom/tsens-v0_1: Add support " Matti Lehtimäki @ 2023-06-13 23:48 ` Bjorn Andersson 2 siblings, 0 replies; 13+ messages in thread From: Bjorn Andersson @ 2023-06-13 23:48 UTC (permalink / raw) To: linux-arm-msm, Matti Lehtimäki Cc: devicetree, linux-kernel, phone-devel, Amit Kucheria, Srinivas Kandagatla, Zhang Rui, linux-pm, ~postmarketos/upstreaming, Konrad Dybcio On Sun, 7 May 2023 23:12:18 +0300, Matti Lehtimäki wrote: > Add support for tsens in MSM8226. Add qfprom compatible for MSM8226. > Add device tree nodes for qfprom, tsens and thermal zones for MSM8226. > > Matti Lehtimäki (6): > dt-bindings: nvmem: qfprom: Add compatible for MSM8226 > dt-bindings: thermal: tsens: Add compatible for MSM8226 > thermal/drivers/qcom/tsens-v0_1: Add support for MSM8226 > ARM: dts: msm8226: Add qfprom node > ARM: dts: msm8226: Add tsens node and related nvmem cells > ARM: dts: msm8226: Add thermal zones node > > [...] Applied, thanks! [4/6] ARM: dts: msm8226: Add qfprom node commit: 16a9fa7ab27b69be3a34b97ff8c7b034fcc73b88 [5/6] ARM: dts: msm8226: Add tsens node and related nvmem cells commit: 0f8861c9fc7cc9af6d6f65d6657aa9cf2531b29c [6/6] ARM: dts: msm8226: Add thermal zones node commit: 8d4236f62f3acbc6a0def79106c13fe7344d8238 Best regards, -- Bjorn Andersson <andersson@kernel.org> ^ permalink raw reply [flat|nested] 13+ messages in thread
end of thread, other threads:[~2023-06-13 23:47 UTC | newest] Thread overview: 13+ messages (download: mbox.gz follow: Atom feed -- links below jump to the message on this page -- 2023-05-07 20:12 [PATCH 0/6] Enable MSM8226 TSENS support Matti Lehtimäki 2023-05-07 20:12 ` [PATCH 2/6] dt-bindings: thermal: tsens: Add compatible for MSM8226 Matti Lehtimäki 2023-05-07 20:22 ` Luca Weiss 2023-05-07 21:25 ` Rob Herring 2023-05-10 13:57 ` Krzysztof Kozlowski 2023-06-05 14:39 ` Daniel Lezcano 2023-05-07 20:12 ` [PATCH 3/6] thermal/drivers/qcom/tsens-v0_1: Add support " Matti Lehtimäki 2023-05-07 20:26 ` Luca Weiss 2023-05-07 20:40 ` Dmitry Baryshkov 2023-05-07 21:11 ` Matti Lehtimäki 2023-05-07 22:49 ` Dmitry Baryshkov 2023-06-05 14:39 ` Daniel Lezcano 2023-06-13 23:48 ` (subset) [PATCH 0/6] Enable MSM8226 TSENS support Bjorn Andersson
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