From: Eduardo Valentin <eduardo.valentin@ti.com>
To: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm <linux-pm@lists.linux-foundation.org>,
Amit Kachhap <amit.kachhap@linaro.org>,
eduardo <eduardo.valentin@ti.com>,
"R, Durgadoss" <durgadoss.r@intel.com>,
"Len, Brown" <lenb@kernel.org>, "Rafael J. Wysocki" <rjw@sisk.pl>,
Matthew Garrett <mjg59@srcf.ucam.org>,
"linux-acpi@vger.kernel.org" <linux-acpi@vger.kernel.org>
Subject: Re: [RFC PATCH 7/12] thermal: rename structure thermal_cooling_device_instance to thermal_instance
Date: Tue, 12 Jun 2012 17:39:28 +0300 [thread overview]
Message-ID: <20120612143928.GG8724@besouro> (raw)
In-Reply-To: <1339395696.1492.179.camel@rui.sh.intel.com>
Hello Rui,
On Mon, Jun 11, 2012 at 02:21:36PM +0800, Zhang Rui wrote:
> seems this patch is missed. Resend it.
>
> On 一, 2012-06-11 at 11:20 +0800, Zhang Rui wrote:
> > Rename structure thermal_cooling_device_instance to thermal_instance.
> >
> > This struct is used to describe the behavior for a thermal
> > cooling device on a certain trip point for a certain thremal zone.
typo
> >
> > thermal_cooling_device_instance is not accurate, as a cooling device
> > can be used for more than one trip point in one thermal zone device.
'thermal_instance' seams to be a bit misleading though...
It looks a bit too generic. One reading it won't figure it out that
it is supposed the mapping between cooling device vs. trip vs. thermal zone...
How about 'thermal_mapping' or 'thermal_binding'?
> >
> > Signed-off-by: Zhang Rui <rui.zhang@intel.com>
> > ---
> > drivers/thermal/thermal_sys.c | 18 +++++++++---------
> > 1 file changed, 9 insertions(+), 9 deletions(-)
> >
> > Index: rtd3/drivers/thermal/thermal_sys.c
> > ===================================================================
> > --- rtd3.orig/drivers/thermal/thermal_sys.c
> > +++ rtd3/drivers/thermal/thermal_sys.c
> > @@ -46,7 +46,7 @@ MODULE_LICENSE("GPL");
> > * a certain cooling device on a certain trip point
> > * in a certain thermal zone
> > */
> > -struct thermal_cooling_device_instance {
> > +struct thermal_instance {
> > int id;
> > char name[THERMAL_NAME_LENGTH];
> > struct thermal_zone_device *tz;
> > @@ -388,10 +388,10 @@ static ssize_t
> > thermal_cooling_device_trip_point_show(struct device *dev,
> > struct device_attribute *attr, char *buf)
> > {
> > - struct thermal_cooling_device_instance *instance;
> > + struct thermal_instance *instance;
> >
> > instance =
> > - container_of(attr, struct thermal_cooling_device_instance, attr);
> > + container_of(attr, struct thermal_instance, attr);
> >
> > if (instance->trip == THERMAL_TRIPS_NONE)
> > return sprintf(buf, "-1\n");
> > @@ -686,7 +686,7 @@ static void thermal_zone_device_passive(
> > int temp, int trip_temp, int trip)
> > {
> > int trend = 0;
> > - struct thermal_cooling_device_instance *instance;
> > + struct thermal_instance *instance;
> > struct thermal_cooling_device *cdev;
> > long state, max_state;
> >
> > @@ -771,8 +771,8 @@ int thermal_zone_bind_cooling_device(str
> > struct thermal_cooling_device *cdev,
> > long upper, long lower)
> > {
> > - struct thermal_cooling_device_instance *dev;
> > - struct thermal_cooling_device_instance *pos;
> > + struct thermal_instance *dev;
> > + struct thermal_instance *pos;
> > struct thermal_zone_device *pos1;
> > struct thermal_cooling_device *pos2;
> > unsigned long max_state;
> > @@ -803,7 +803,7 @@ int thermal_zone_bind_cooling_device(str
> > return -EINVAL;
> >
> > dev =
> > - kzalloc(sizeof(struct thermal_cooling_device_instance), GFP_KERNEL);
> > + kzalloc(sizeof(struct thermal_instance), GFP_KERNEL);
> > if (!dev)
> > return -ENOMEM;
> > dev->tz = tz;
> > @@ -868,7 +868,7 @@ int thermal_zone_unbind_cooling_device(s
> > int trip,
> > struct thermal_cooling_device *cdev)
> > {
> > - struct thermal_cooling_device_instance *pos, *next;
> > + struct thermal_instance *pos, *next;
> >
> > mutex_lock(&tz->lock);
> > list_for_each_entry_safe(pos, next, &tz->cooling_devices, node) {
> > @@ -1054,7 +1054,7 @@ EXPORT_SYMBOL(thermal_cooling_device_unr
> > static void thermal_zone_trip_update(struct thermal_zone_device *tz,
> > int trip, long temp)
> > {
> > - struct thermal_cooling_device_instance *instance;
> > + struct thermal_instance *instance;
> > struct thermal_cooling_device *cdev = NULL;
> > unsigned long cur_state, max_state;
> > long trip_temp;
> >
>
>
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prev parent reply other threads:[~2012-06-12 14:39 UTC|newest]
Thread overview: 2+ messages / expand[flat|nested] mbox.gz Atom feed top
[not found] <1339384821.1492.161.camel@rui.sh.intel.com>
2012-06-11 6:21 ` [RFC PATCH 7/12] thermal: rename structure thermal_cooling_device_instance to thermal_instance Zhang Rui
2012-06-12 14:39 ` Eduardo Valentin [this message]
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