Re: [PATCH v2 06/17] thermal: cpu_cooling: dts: Define device tree bindings for Exynos cpu cooling functionality

Eduardo Valentin
2015-01-12T14:24:33Z

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On Mon, Jan 12, 2015 at 03:09:16PM +0100, Lukasz Majewski wrote:
> Hi Eduardo,
>
> > > Presented patch aims to move data necessary for correct CPU cooling
> > > device configuration from exynos_tmu_data.c to device tree.
> >
> > I believe the patch title is misleading. Looks like you are changing
> > something at cpu cooling, but in fact, you are changing DTS files. I
> > would suggest you to use a prefix like 'arm: dts: ....'
>
> Now this patch name is:
> thermal: cpu_cooling: dts: ......
>
> All the code in this patch adds bindings for 'thermal-zone' to map
> cooling device to proper trip points.
> In fact this is solely related to cpu_cooling...
>
> From the above, I think that the already provided convention is more
> suitable and "arm: dts: cpu_cooling: thermal" seems a bit awkward for
> me.
>
> If you don't regard my justification as valid, then I will fix this.

Still, the naming is confusing. With that prefix you are saying this
patch is something generic about cpu cooling and thermal dts. And that
is not what this patch is about.

Saying "arm: dts: add cpu cooling bindings for Exynos" is a short and
direct subject. Besides, you have the plus to call the attention of the
ARM and device tree maintainers. It will be also in my radar.

The original subject also makes me think you are dealing with C code,
while the former says already upfront that you are talking about arm dts
bindings.

Cheers,
>
> --
> Best regards,
>
> Lukasz Majewski
>
> Samsung R&D Institute Poland (SRPOL) | Linux Platform Group

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