Re: [PATCH v2 06/17] thermal: cpu_cooling: dts: Define device tree bindings for Exynos cpu cooling functionality

Lukasz Majewski
2015-01-13T08:22:21Z

Hi Eduardo,

>
> On Mon, Jan 12, 2015 at 03:09:16PM +0100, Lukasz Majewski wrote:
> > Hi Eduardo,
> >
> > > > Presented patch aims to move data necessary for correct CPU
> > > > cooling device configuration from exynos_tmu_data.c to device
> > > > tree.
> > >
> > > I believe the patch title is misleading. Looks like you are
> > > changing something at cpu cooling, but in fact, you are changing
> > > DTS files. I would suggest you to use a prefix like 'arm:
> > > dts: ....'
> >
> > Now this patch name is:
> > thermal: cpu_cooling: dts: ......
> >
> > All the code in this patch adds bindings for 'thermal-zone' to map
> > cooling device to proper trip points.
> > In fact this is solely related to cpu_cooling...
> >
> > From the above, I think that the already provided convention is more
> > suitable and "arm: dts: cpu_cooling: thermal" seems a bit awkward
> > for me.
> >
> > If you don't regard my justification as valid, then I will fix this.
>
> Still, the naming is confusing. With that prefix you are saying this
> patch is something generic about cpu cooling and thermal dts. And that
> is not what this patch is about.
>
> Saying "arm: dts: add cpu cooling bindings for Exynos" is a short and
> direct subject. Besides, you have the plus to call the attention of
> the ARM and device tree maintainers. It will be also in my radar.

Fair enough. Thanks for clarification.

>
>
> The original subject also makes me think you are dealing with C code,
> while the former says already upfront that you are talking about arm
> dts bindings.
>
> Cheers,
> >
> > --
> > Best regards,
> >
> > Lukasz Majewski
> >
> > Samsung R&D Institute Poland (SRPOL) | Linux Platform Group

--
Best regards,

Lukasz Majewski

Samsung R&D Institute Poland (SRPOL) | Linux Platform Group