From mboxrd@z Thu Jan 1 00:00:00 1970 From: Eduardo Valentin Subject: Re: [PATCH v5 00/18] thermal: exynos: Thermal code rework to use device tree Date: Tue, 20 Jan 2015 21:55:51 -0400 Message-ID: <20150121015549.GD5830@developer.hsd1.ca.comcast.net> References: <1412872737-624-1-git-send-email-l.majewski@samsung.com> <1421666462-7606-1-git-send-email-l.majewski@samsung.com> Mime-Version: 1.0 Content-Type: multipart/signed; micalg=pgp-sha1; protocol="application/pgp-signature"; boundary="J5MfuwkIyy7RmF4Q" Return-path: Content-Disposition: inline In-Reply-To: <1421666462-7606-1-git-send-email-l.majewski@samsung.com> Sender: linux-samsung-soc-owner@vger.kernel.org To: Lukasz Majewski , Arnd Bergmann Cc: Zhang Rui , Kukjin Kim , Kukjin Kim , Linux PM list , "linux-samsung-soc@vger.kernel.org" , Bartlomiej Zolnierkiewicz , Lukasz Majewski , Amit Daniel Kachhap , Abhilash Kesavan , Abhilash Kesavan , Kyungmin Park , Chanwoo Choi List-Id: linux-pm@vger.kernel.org --J5MfuwkIyy7RmF4Q Content-Type: text/plain; charset=us-ascii Content-Disposition: inline Content-Transfer-Encoding: quoted-printable Hello Arnd, On Mon, Jan 19, 2015 at 12:20:44PM +0100, Lukasz Majewski wrote: > 1. Introduction >=20 > Following patches aim to clean up the current implementation of the therm= al > framework on Exynos devices. >=20 > The main goal was to use a generic code for reading thermal configuration > (of-thermal.c). Due to that redundant exynos_thermal_common.[h|c] files > were removed. >=20 > Around 400 lines of code (LOC) were removed directly by this patch, which > is around 20% of the Exynos thermal code base. >=20 > This work should NOT bring any functional changes to Exynos thermal=20 > subsystem. >=20 > 2. Patch-set structure >=20 > Then the cpu_cooling functionality has been preserved to allow cooling > devices by reducing operating frequency. Definition of trip points and > cpufreq's cooling properties were moved to device tree. >=20 > Then the rework of the way in which configuration data is provided to > the Exynos thermal subsystem was performed. Now device tree is used for > configuration. >=20 > 3. Dead code removal >=20 > Thermal support for some SoCs, previously available in the exynos_tmu_dat= a.c=20 > file, was removed since, as of (almost) 3.19-rc3, they didn't have TMU bi= ndings. >=20 > Moreover, support for cpu_cooling devices was preserved only on those > SoCs which had available and working cpufreq driver. >=20 > 4. Testing >=20 > Test devices: > - Exynos4210 - Trats (TMU zone + cpu_cooling) > - Exynos4412 - Trats2/Odroid U3 (TMU zone + cpu_cooling) > - Exynos5250 - Arndale (TMU zone + cpu_cooling) > - Exynos5420 - Arndale-octa (only TMU zones) >=20 > Unfortunately, I don't posses Exynos5440 for testing. Its functionality > has been preserved in the code, but not tested on the hardware. I would > be grateful for help in testing. >=20 >=20 > 5. This work apply on the following tree: >=20 > kernel.org: 'linux-soc-thermal/next' - Eduardo Velentin's tree > SHA1: 1813d80874699145f04af6b05ebab0a6419001fb >=20 >=20 This series contains changes under drivers/thermal that I can pick up, but it also contains changes under arch/arm/boot/dts that depend on a header file provided by the driver. The header is introduced in this series. How do you prefer to preceed in such sitation? Are you OK if I pick the complete series, changes under drivers/thermal and the DTS changes? Cheers, Eduardo > Lukasz Majewski (18): > thermal: exynos: cosmetic: Correct comment format > thermal: exynos: Provide thermal_exynos.h file to be included in > device tree files > arm: dts: trats: Enable TMU on the Exynos4210 trats device > arm: dts: odroid: Add LDO10 regulator node necessary for TMU on Odroid > arm: dts: odroid: Enable TMU at Exynos4412 based Odroid U3 device > arm: dts: Adding CPU cooling binding for Exynos SoCs > thermal: exynos: Modify exynos thermal code to use device tree for cpu > cooling configuration > thermal: exynos: dts: Add default definition of the TMU sensor > parameter > dts: Documentation: Extending documentation entry for exynos-thermal > thermal: dts: Default trip points definition for Exynos5420 SoCs > thermal: exynos: dts: Define default thermal-zones for Exynos4 > thermal: dts: exynos: Trip points and sensor configuration data for > Exynos5440 > dts: Documentation: Update exynos-thermal.txt example for Exynos5440 > thermal: exynos: dts: Provide device tree bindings identical to the > one in exynos_tmu_data.c > thermal: samsung: core: Exynos TMU rework to use device tree for > configuration > thermal: exynos: Remove exynos_thermal_common.[c|h] files > thermal: exynos: Remove exynos_tmu_data.c file > thermal: exynos: Remove not needed exynos_tmu_init_data declarations > from exynos_tmu.h >=20 > .../devicetree/bindings/thermal/exynos-thermal.txt | 17 + > arch/arm/boot/dts/exynos3250.dtsi | 2 + > arch/arm/boot/dts/exynos4-cpu-thermal.dtsi | 52 +++ > arch/arm/boot/dts/exynos4.dtsi | 4 + > arch/arm/boot/dts/exynos4210-trats.dts | 19 + > arch/arm/boot/dts/exynos4210.dtsi | 30 +- > arch/arm/boot/dts/exynos4212.dtsi | 5 +- > arch/arm/boot/dts/exynos4412-odroid-common.dtsi | 27 ++ > arch/arm/boot/dts/exynos4412-tmu-sensor-conf.dtsi | 24 ++ > arch/arm/boot/dts/exynos4412-trats2.dts | 15 + > arch/arm/boot/dts/exynos4412.dtsi | 5 +- > arch/arm/boot/dts/exynos4x12.dtsi | 1 + > arch/arm/boot/dts/exynos5250.dtsi | 29 +- > arch/arm/boot/dts/exynos5420-trip-points.dtsi | 35 ++ > arch/arm/boot/dts/exynos5420.dtsi | 28 ++ > arch/arm/boot/dts/exynos5440-tmu-sensor-conf.dtsi | 24 ++ > arch/arm/boot/dts/exynos5440-trip-points.dtsi | 25 ++ > arch/arm/boot/dts/exynos5440.dtsi | 18 + > drivers/cpufreq/exynos-cpufreq.c | 30 +- > drivers/thermal/samsung/Makefile | 2 - > drivers/thermal/samsung/exynos_thermal_common.c | 427 ---------------= ------ > drivers/thermal/samsung/exynos_thermal_common.h | 106 ----- > drivers/thermal/samsung/exynos_tmu.c | 348 +++++++++++----= -- > drivers/thermal/samsung/exynos_tmu.h | 76 +--- > drivers/thermal/samsung/exynos_tmu_data.c | 264 ------------- > include/dt-bindings/thermal/thermal_exynos.h | 28 ++ > 26 files changed, 632 insertions(+), 1009 deletions(-) > create mode 100644 arch/arm/boot/dts/exynos4-cpu-thermal.dtsi > create mode 100644 arch/arm/boot/dts/exynos4412-tmu-sensor-conf.dtsi > create mode 100644 arch/arm/boot/dts/exynos5420-trip-points.dtsi > create mode 100644 arch/arm/boot/dts/exynos5440-tmu-sensor-conf.dtsi > create mode 100644 arch/arm/boot/dts/exynos5440-trip-points.dtsi > delete mode 100644 drivers/thermal/samsung/exynos_thermal_common.c > delete mode 100644 drivers/thermal/samsung/exynos_thermal_common.h > delete mode 100644 drivers/thermal/samsung/exynos_tmu_data.c > create mode 100644 include/dt-bindings/thermal/thermal_exynos.h >=20 > --=20 > 2.0.0.rc2 >=20 --J5MfuwkIyy7RmF4Q Content-Type: application/pgp-signature; name="signature.asc" Content-Description: Digital signature -----BEGIN PGP SIGNATURE----- Version: GnuPG v2 iQEcBAEBAgAGBQJUvwcZAAoJEMLUO4d9pOJWzv4H/3cBJd1YvN8mrUZXBp+kmz0s H82dqfDLz4GTrXGLa42iGde3+j0i3F6hE3uQpiPIG43Z333Po8/+QFWuBqNO1dSi 15Vw2PsSwysS9m7Bj1SyUwU/Z2hcb8l1X8kPC6ckAzKCuMinXMyL1Rshsh7FtTFG /2YdhAISkPA9OAEkDgzhvhF1aU9JSGfYSQNqpN1m++Qr970U3aJy1zkiukjyvNzE pq/Qfiv+25+vhIy8OyhhC0rXobgVPd4EHHRDTdZCWFM08V9NXI2sBACtP+rQ0FiB BENvYSSkcxjP9XADYIQQ5+msScD1PpJfauQfxfUwQoPbYZW8G+WpcTPbiaXpm4g= =7E7f -----END PGP SIGNATURE----- --J5MfuwkIyy7RmF4Q--