Re: [PATCH RESEND v4 0/2] 96boards: add thermal senor support to hikey board

Xinwei Kong
2015-05-12T03:11:30Z

On 2015/5/12 9:31, Eduardo Valentin wrote:
> On Mon, May 04, 2015 at 10:52:18AM +0800, Xinwei Kong wrote:
>> From: kongxinwei <kong.kongxinwei@hisilicon.com>
>>
>> The Linaro connect introduce 96boards series in Hong Kong,The HiKey board
>> is the first board to be certified 96Boards Consumer Edition compatible.
>> This board is based on the HiSilicon SoC. you can get more information
>> from https://www.96boards.org.
>>
>> The hisilicon SoC contains thermal module, this thermal module has 4 sensors,
>>
>> - sensor 0: local sensor;
>> - sensor 1: remote sensor for ACPU cluster 1;
>> - sensor 2: remote sensor for ACPU cluster 2;
>> - sensor 3: remote sensor for GPU;
>>
>> It can obtain this device temperature by operating this hardware. The new
>> sensor driver satisfies thermal framework and to realize the ACPU ,GPU and
>> so on to cool function.
>>
>> Changes v0->v1;
>> * Delete this hi6220 dtsi.
>> * Fix documentation and error checks.
>> * Modify this driver which makes use of kernel to decide how to dynamically
>> bind the interrupt to hottest sensor.
>> * Delete "sensor-thres-temp" property and read thermal_zone trips points
>> replace of it.
>> * Delete "sensor-reset-temp" property and define the fixed value replace
>> of it.
>>
>> Changes v1->v2;
>> * change patch's position between binding document and driver file
>> * clean up some regiser for enabling thermal sensor
>> * use mutex lock to replace the spin lock
>>
>> Changes v2->v3;
>> * delete sensor id property in binding document
>> * fix sensor driver to satisfy sensor register after deleting sensor id
>> property
>>
>> Changes v3->v4;
>> * using "usleep_range" function instead of "msleep" function
>> * delete code detail error
>>
>> kongxinwei (2):
>> dt-bindings: Document the hi6220 thermal sensor bindings
>> thermal: hisilicon: add new hisilicon thermal sensor driver
>>
>> .../bindings/thermal/hisilicon-thermal.txt | 23 ++
>> drivers/thermal/Kconfig | 8 +
>> drivers/thermal/Makefile | 1 +
>> drivers/thermal/hisi_thermal.c | 437 +++++++++++++++++++++
>
> Can you please include a patch adding the DT bindings for a board in you
> next version? Even if the patches don't go in one single tree, it is
> good to review all patches (DT and drivers) in one single patch series.
>

Ok, accept it.

>> 4 files changed, 469 insertions(+)
>> create mode 100644 Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
>> create mode 100644 drivers/thermal/hisi_thermal.c
>>
>> --
>> 1.9.1
>>
>>