From mboxrd@z Thu Jan 1 00:00:00 1970 From: Leo Yan Subject: Regard of thermal power allocator's coefficients Date: Sun, 14 Feb 2016 19:00:41 +0800 Message-ID: <20160214110041.GB26920@leoy-linaro> Mime-Version: 1.0 Content-Type: text/plain; charset=us-ascii Return-path: Received: from mail-pf0-f180.google.com ([209.85.192.180]:35922 "EHLO mail-pf0-f180.google.com" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S1751175AbcBNLAt (ORCPT ); Sun, 14 Feb 2016 06:00:49 -0500 Received: by mail-pf0-f180.google.com with SMTP id e127so71785132pfe.3 for ; Sun, 14 Feb 2016 03:00:49 -0800 (PST) Content-Disposition: inline Sender: linux-pm-owner@vger.kernel.org List-Id: linux-pm@vger.kernel.org To: linux-pm@vger.kernel.org, Javi Merino , Zhang Rui , Eduardo Valentin , linux-kernel@vger.kernel.org Hi there, I'm trying to upstreaming IPA patches for 96board Hikey, but so far there have no standard DT binding for passing IPA coefficients for power modeling. So want to firstly to confirm if should we pass coefficients by using device tree? Is someone working on related work for this? Here has another more straightforward method is to directly to include power model's coefficients in thermal sensor driver (such like drivers/thermal/hisi_thermal.c), but my concern is this method will include SoC specific data in the common thermal sensor driver, so is this doable? Welcome any suggestion. Thanks, Leo Yan