From: Bhupesh Sharma <bhupesh.sharma@linaro.org>
To: linux-kernel@vger.kernel.org, linux-pm@vger.kernel.org,
devicetree@vger.kernel.org
Cc: agross@kernel.org, linux-arm-msm@vger.kernel.org,
daniel.lezcano@linaro.org, robh@kernel.org, andersson@kernel.org,
rafael@kernel.org, bhupesh.sharma@linaro.org,
bhupesh.linux@gmail.com
Subject: [PATCH 3/4] dt-bindings: thermal: Add qcom,qmi-tmd-device and qcom,tmd-device yaml bindings
Date: Mon, 12 Sep 2022 14:20:48 +0530 [thread overview]
Message-ID: <20220912085049.3517140-4-bhupesh.sharma@linaro.org> (raw)
In-Reply-To: <20220912085049.3517140-1-bhupesh.sharma@linaro.org>
Add qcom,qmi-tmd-device and qcom,tmd-device yaml bindings.
Qualcomm QMI based TMD cooling device(s) are used for various
mitigations for remote subsystem(s) including remote processor
mitigation, rail voltage restriction etc.
Each child node represents one remote subsystem and each child
of this subsystem in-turn represents separate TMD cooling device.
Cc: daniel.lezcano@linaro.org
Cc: rafael@kernel.org
Cc: andersson@kernel.org
Cc: robh@kernel.org
Signed-off-by: Bhupesh Sharma <bhupesh.sharma@linaro.org>
---
.../bindings/thermal/qcom,qmi-tmd-device.yaml | 78 +++++++++++
.../bindings/thermal/qcom,tmd-device.yaml | 122 ++++++++++++++++++
include/dt-bindings/thermal/qcom,tmd.h | 14 ++
3 files changed, 214 insertions(+)
create mode 100644 Documentation/devicetree/bindings/thermal/qcom,qmi-tmd-device.yaml
create mode 100644 Documentation/devicetree/bindings/thermal/qcom,tmd-device.yaml
create mode 100644 include/dt-bindings/thermal/qcom,tmd.h
diff --git a/Documentation/devicetree/bindings/thermal/qcom,qmi-tmd-device.yaml b/Documentation/devicetree/bindings/thermal/qcom,qmi-tmd-device.yaml
new file mode 100644
index 000000000000..dfda5b611a93
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/qcom,qmi-tmd-device.yaml
@@ -0,0 +1,78 @@
+# SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause)
+
+%YAML 1.2
+---
+$id: "http://devicetree.org/schemas/thermal/qcom,qmi-tmd-device.yaml#"
+$schema: "http://devicetree.org/meta-schemas/core.yaml#"
+
+title: Qualcomm QMI based thermal mitigation (TMD) cooling devices.
+
+maintainers:
+ - Bhupesh Sharma <bhupesh.sharma@linaro.org>
+
+description:
+ Qualcomm QMI based TMD cooling device(s) are used for various
+ mitigations for remote subsystem(s) including remote processor
+ mitigation, rail voltage restriction etc.
+
+properties:
+ $nodename:
+ const: qmi-tmd-devices
+
+ compatible:
+ items:
+ - const: qcom,qmi-tmd-devices
+
+ modem0:
+ $ref: /schemas/thermal/qcom,tmd-device.yaml#
+
+ adsp:
+ $ref: /schemas/thermal/qcom,tmd-device.yaml#
+
+ cdsp:
+ $ref: /schemas/thermal/qcom,tmd-device.yaml#
+
+ slpi:
+ $ref: /schemas/thermal/qcom,tmd-device.yaml#
+
+required:
+ - compatible
+
+unevaluatedProperties: false
+
+examples:
+ - |
+ #include <dt-bindings/thermal/qcom,tmd.h>
+ qmi-tmd-devices {
+ compatible = "qcom,qmi-tmd-devices";
+
+ modem0 {
+ qcom,instance-id = <MODEM0_INSTANCE_ID>;
+
+ modem0_pa: tmd-device0 {
+ label = "pa";
+ #cooling-cells = <2>;
+ };
+
+ modem0_proc: tmd-device1 {
+ label = "modem";
+ #cooling-cells = <2>;
+ };
+
+ modem0_current: tmd-device2 {
+ label = "modem_current";
+ #cooling-cells = <2>;
+ };
+
+ modem0_skin: tmd-device3 {
+ label = "modem_skin";
+ #cooling-cells = <2>;
+ };
+
+ modem0_vdd: tmd-device4 {
+ label = "cpuv_restriction_cold";
+ #cooling-cells = <2>;
+ };
+ };
+ };
+...
diff --git a/Documentation/devicetree/bindings/thermal/qcom,tmd-device.yaml b/Documentation/devicetree/bindings/thermal/qcom,tmd-device.yaml
new file mode 100644
index 000000000000..38ac62f03376
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/qcom,tmd-device.yaml
@@ -0,0 +1,122 @@
+# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause)
+
+%YAML 1.2
+---
+$id: "http://devicetree.org/schemas/thermal/qcom,tmd-device.yaml#"
+$schema: "http://devicetree.org/meta-schemas/core.yaml#"
+
+title: Qualcomm thermal mitigation (TMD) cooling devices
+
+maintainers:
+ - Bhupesh Sharma <bhupesh.sharma@linaro.org>
+
+description:
+ Qualcomm thermal mitigation (TMD) cooling devices. Each child node
+ represents one remote subsystem and each child of this subsystem in-turn
+ represents separate cooling devices.
+
+properties:
+ $nodename:
+ pattern: "^(modem|adsp|cdsp|slpi[0-9])?$"
+
+ qcom,instance-id:
+ $ref: /schemas/types.yaml#/definitions/uint32
+ description:
+ Remote subsystem QMI server instance id to be used for communicating with QMI.
+
+patternProperties:
+ "^tmd-device[0-9]?$":
+ type: object
+ description:
+ Subnodes indicating tmd cooling device of a specific category.
+ properties:
+ label:
+ maxItems: 1
+ description: |
+ Remote subsystem device identifier. Acceptable device names -
+ "pa" -> for pa cooling device,
+ "cpuv_restriction_cold" -> for vdd restriction,
+ "cx_vdd_limit" -> for vdd limit,
+ "modem" -> for processor passive cooling device,
+ "modem_current" -> for current limiting device,
+ "modem_bw" -> for bus bandwidth limiting device,
+ "cpr_cold" -> for cpr restriction.
+
+ "#cooling-cells":
+ const: 2
+
+ required:
+ - label
+ - "#cooling-cells"
+
+ additionalProperties: false
+
+required:
+ - qcom,instance-id
+
+additionalProperties: false
+
+examples:
+ - |
+ #include <dt-bindings/thermal/qcom,tmd.h>
+ modem0 {
+ qcom,instance-id = <MODEM0_INSTANCE_ID>;
+
+ modem0_pa: tmd-device0 {
+ label = "pa";
+ #cooling-cells = <2>;
+ };
+
+ modem0_proc: tmd-device1 {
+ label = "modem";
+ #cooling-cells = <2>;
+ };
+
+ modem0_current: tmd-device2 {
+ label = "modem_current";
+ #cooling-cells = <2>;
+ };
+
+ modem0_skin: tmd-device3 {
+ label = "modem_skin";
+ #cooling-cells = <2>;
+ };
+
+ modem0_vdd: tmd-device4 {
+ label = "cpuv_restriction_cold";
+ #cooling-cells = <2>;
+ };
+ };
+
+ - |
+ #include <dt-bindings/thermal/qcom,tmd.h>
+ adsp {
+ qcom,instance-id = <ADSP_INSTANCE_ID>;
+
+ adsp_vdd: tmd-device1 {
+ label = "cpuv_restriction_cold";
+ #cooling-cells = <2>;
+ };
+ };
+
+ - |
+ #include <dt-bindings/thermal/qcom,tmd.h>
+ cdsp {
+ qcom,instance-id = <CDSP_INSTANCE_ID>;
+
+ cdsp_vdd: tmd-device1 {
+ label = "cpuv_restriction_cold";
+ #cooling-cells = <2>;
+ };
+ };
+
+ - |
+ #include <dt-bindings/thermal/qcom,tmd.h>
+ slpi {
+ qcom,instance-id = <SLPI_INSTANCE_ID>;
+
+ slpi_vdd: tmd-device1 {
+ label = "cpuv_restriction_cold";
+ #cooling-cells = <2>;
+ };
+ };
diff --git a/include/dt-bindings/thermal/qcom,tmd.h b/include/dt-bindings/thermal/qcom,tmd.h
new file mode 100644
index 000000000000..5ede4422e04e
--- /dev/null
+++ b/include/dt-bindings/thermal/qcom,tmd.h
@@ -0,0 +1,14 @@
+/* SPDX-License-Identifier: GPL-2.0 */
+/*
+ * This header provides constants for the Qualcomm TMD instances.
+ */
+
+#ifndef _DT_BINDINGS_THERMAL_QCOM_TMD_H_
+#define _DT_BINDINGS_THERMAL_QCOM_TMD_H_
+
+#define MODEM0_INSTANCE_ID 0x0
+#define ADSP_INSTANCE_ID 0x1
+#define CDSP_INSTANCE_ID 0x43
+#define SLPI_INSTANCE_ID 0x53
+
+#endif
--
2.37.1
next prev parent reply other threads:[~2022-09-12 8:51 UTC|newest]
Thread overview: 13+ messages / expand[flat|nested] mbox.gz Atom feed top
2022-09-12 8:50 [PATCH 0/4] thermal: Introduce Qualcomm Cooling Driver suppport Bhupesh Sharma
2022-09-12 8:50 ` [PATCH 1/4] thermal: qcom: qmi_cooling: Add skeletal qmi cooling driver Bhupesh Sharma
2022-09-12 21:23 ` Jeff Johnson
2022-09-13 15:39 ` Bjorn Andersson
2022-09-13 18:42 ` Bjorn Andersson
2022-09-12 8:50 ` [PATCH 2/4] thermal: qcom: Add Kconfig entry & compilation support for " Bhupesh Sharma
2022-09-13 18:53 ` Bjorn Andersson
2022-09-12 8:50 ` Bhupesh Sharma [this message]
2022-09-12 15:38 ` [PATCH 3/4] dt-bindings: thermal: Add qcom,qmi-tmd-device and qcom,tmd-device yaml bindings Rob Herring
2022-09-12 15:58 ` Rob Herring
2022-09-13 19:10 ` Bjorn Andersson
2022-10-28 16:58 ` Krzysztof Kozlowski
2022-09-12 8:50 ` [PATCH 4/4] MAINTAINERS: Add entry for Qualcomm Cooling Driver Bhupesh Sharma
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