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* [PATCH 0/6] Enable MSM8226 TSENS support
@ 2023-05-07 20:12 Matti Lehtimäki
  2023-05-07 20:12 ` [PATCH 2/6] dt-bindings: thermal: tsens: Add compatible for MSM8226 Matti Lehtimäki
                   ` (2 more replies)
  0 siblings, 3 replies; 13+ messages in thread
From: Matti Lehtimäki @ 2023-05-07 20:12 UTC (permalink / raw)
  To: linux-arm-msm
  Cc: ~postmarketos/upstreaming, phone-devel, Matti Lehtimäki,
	Amit Kucheria, devicetree, Konrad Dybcio, linux-kernel, linux-pm,
	Srinivas Kandagatla, Zhang Rui

Add support for tsens in MSM8226. Add qfprom compatible for MSM8226.
Add device tree nodes for qfprom, tsens and thermal zones for MSM8226.

Matti Lehtimäki (6):
  dt-bindings: nvmem: qfprom: Add compatible for MSM8226
  dt-bindings: thermal: tsens: Add compatible for MSM8226
  thermal/drivers/qcom/tsens-v0_1: Add support for MSM8226
  ARM: dts: msm8226: Add qfprom node
  ARM: dts: msm8226: Add tsens node and related nvmem cells
  ARM: dts: msm8226: Add thermal zones node

 .../bindings/nvmem/qcom,qfprom.yaml           |   1 +
 .../bindings/thermal/qcom-tsens.yaml          |   1 +
 arch/arm/boot/dts/qcom-msm8226.dtsi           | 164 ++++++++++++++++++
 drivers/thermal/qcom/tsens-v0_1.c             |  27 ++-
 drivers/thermal/qcom/tsens.c                  |   3 +
 drivers/thermal/qcom/tsens.h                  |   2 +-
 6 files changed, 196 insertions(+), 2 deletions(-)

-- 
2.34.1


^ permalink raw reply	[flat|nested] 13+ messages in thread

* [PATCH 2/6] dt-bindings: thermal: tsens: Add compatible for MSM8226
  2023-05-07 20:12 [PATCH 0/6] Enable MSM8226 TSENS support Matti Lehtimäki
@ 2023-05-07 20:12 ` Matti Lehtimäki
  2023-05-07 20:22   ` Luca Weiss
                     ` (3 more replies)
  2023-05-07 20:12 ` [PATCH 3/6] thermal/drivers/qcom/tsens-v0_1: Add support " Matti Lehtimäki
  2023-06-13 23:48 ` (subset) [PATCH 0/6] Enable MSM8226 TSENS support Bjorn Andersson
  2 siblings, 4 replies; 13+ messages in thread
From: Matti Lehtimäki @ 2023-05-07 20:12 UTC (permalink / raw)
  To: linux-arm-msm
  Cc: ~postmarketos/upstreaming, phone-devel, Matti Lehtimäki,
	Amit Kucheria, Thara Gopinath, Andy Gross, Bjorn Andersson,
	Konrad Dybcio, Rafael J. Wysocki, Daniel Lezcano, Zhang Rui,
	Rob Herring, Krzysztof Kozlowski, linux-pm, devicetree,
	linux-kernel

Qualcomm MSM8226 has tsens v0.1 block.

Signed-off-by: Matti Lehtimäki <matti.lehtimaki@gmail.com>
---
 Documentation/devicetree/bindings/thermal/qcom-tsens.yaml | 1 +
 1 file changed, 1 insertion(+)

diff --git a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
index 926e9c51c93c..d6b2957d5137 100644
--- a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
+++ b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
@@ -29,6 +29,7 @@ properties:
         items:
           - enum:
               - qcom,mdm9607-tsens
+              - qcom,msm8226-tsens
               - qcom,msm8916-tsens
               - qcom,msm8939-tsens
               - qcom,msm8974-tsens
-- 
2.34.1


^ permalink raw reply related	[flat|nested] 13+ messages in thread

* [PATCH 3/6] thermal/drivers/qcom/tsens-v0_1: Add support for MSM8226
  2023-05-07 20:12 [PATCH 0/6] Enable MSM8226 TSENS support Matti Lehtimäki
  2023-05-07 20:12 ` [PATCH 2/6] dt-bindings: thermal: tsens: Add compatible for MSM8226 Matti Lehtimäki
@ 2023-05-07 20:12 ` Matti Lehtimäki
  2023-05-07 20:26   ` Luca Weiss
                     ` (2 more replies)
  2023-06-13 23:48 ` (subset) [PATCH 0/6] Enable MSM8226 TSENS support Bjorn Andersson
  2 siblings, 3 replies; 13+ messages in thread
From: Matti Lehtimäki @ 2023-05-07 20:12 UTC (permalink / raw)
  To: linux-arm-msm
  Cc: ~postmarketos/upstreaming, phone-devel, Matti Lehtimäki,
	Andy Gross, Bjorn Andersson, Konrad Dybcio, Amit Kucheria,
	Thara Gopinath, Rafael J. Wysocki, Daniel Lezcano, Zhang Rui,
	linux-pm, linux-kernel

The MSM8226 TSENS IP has 6 thermal sensors in a TSENS v0.1 block.
The thermal sensors use non-standard slope values.

Signed-off-by: Matti Lehtimäki <matti.lehtimaki@gmail.com>
---
 drivers/thermal/qcom/tsens-v0_1.c | 27 ++++++++++++++++++++++++++-
 drivers/thermal/qcom/tsens.c      |  3 +++
 drivers/thermal/qcom/tsens.h      |  2 +-
 3 files changed, 30 insertions(+), 2 deletions(-)

diff --git a/drivers/thermal/qcom/tsens-v0_1.c b/drivers/thermal/qcom/tsens-v0_1.c
index e89c6f39a3ae..ad57ab94546b 100644
--- a/drivers/thermal/qcom/tsens-v0_1.c
+++ b/drivers/thermal/qcom/tsens-v0_1.c
@@ -243,6 +243,18 @@ static int calibrate_8974(struct tsens_priv *priv)
 	return 0;
 }
 
+static int __init init_8226(struct tsens_priv *priv)
+{
+	priv->sensor[0].slope = 2901;
+	priv->sensor[1].slope = 2846;
+	priv->sensor[2].slope = 3038;
+	priv->sensor[3].slope = 2955;
+	priv->sensor[4].slope = 2901;
+	priv->sensor[5].slope = 2846;
+
+	return init_common(priv);
+}
+
 static int __init init_8939(struct tsens_priv *priv) {
 	priv->sensor[0].slope = 2911;
 	priv->sensor[1].slope = 2789;
@@ -258,7 +270,7 @@ static int __init init_8939(struct tsens_priv *priv) {
 	return init_common(priv);
 }
 
-/* v0.1: 8916, 8939, 8974, 9607 */
+/* v0.1: 8226, 8916, 8939, 8974, 9607 */
 
 static struct tsens_features tsens_v0_1_feat = {
 	.ver_major	= VER_0_1,
@@ -313,6 +325,19 @@ static const struct tsens_ops ops_v0_1 = {
 	.get_temp	= get_temp_common,
 };
 
+static const struct tsens_ops ops_8226 = {
+	.init		= init_8226,
+	.calibrate	= tsens_calibrate_common,
+	.get_temp	= get_temp_common,
+};
+
+struct tsens_plat_data data_8226 = {
+	.num_sensors	= 6,
+	.ops		= &ops_8226,
+	.feat		= &tsens_v0_1_feat,
+	.fields	= tsens_v0_1_regfields,
+};
+
 static const struct tsens_ops ops_8916 = {
 	.init		= init_common,
 	.calibrate	= calibrate_8916,
diff --git a/drivers/thermal/qcom/tsens.c b/drivers/thermal/qcom/tsens.c
index 8020ead2794e..eb33a8bf0488 100644
--- a/drivers/thermal/qcom/tsens.c
+++ b/drivers/thermal/qcom/tsens.c
@@ -1095,6 +1095,9 @@ static const struct of_device_id tsens_table[] = {
 	}, {
 		.compatible = "qcom,mdm9607-tsens",
 		.data = &data_9607,
+	}, {
+		.compatible = "qcom,msm8226-tsens",
+		.data = &data_8226,
 	}, {
 		.compatible = "qcom,msm8916-tsens",
 		.data = &data_8916,
diff --git a/drivers/thermal/qcom/tsens.h b/drivers/thermal/qcom/tsens.h
index dba9cd38f637..433eba370998 100644
--- a/drivers/thermal/qcom/tsens.h
+++ b/drivers/thermal/qcom/tsens.h
@@ -635,7 +635,7 @@ int get_temp_common(const struct tsens_sensor *s, int *temp);
 extern struct tsens_plat_data data_8960;
 
 /* TSENS v0.1 targets */
-extern struct tsens_plat_data data_8916, data_8939, data_8974, data_9607;
+extern struct tsens_plat_data data_8226, data_8916, data_8939, data_8974, data_9607;
 
 /* TSENS v1 targets */
 extern struct tsens_plat_data data_tsens_v1, data_8976, data_8956;
-- 
2.34.1


^ permalink raw reply related	[flat|nested] 13+ messages in thread

* Re: [PATCH 2/6] dt-bindings: thermal: tsens: Add compatible for MSM8226
  2023-05-07 20:12 ` [PATCH 2/6] dt-bindings: thermal: tsens: Add compatible for MSM8226 Matti Lehtimäki
@ 2023-05-07 20:22   ` Luca Weiss
  2023-05-07 21:25   ` Rob Herring
                     ` (2 subsequent siblings)
  3 siblings, 0 replies; 13+ messages in thread
From: Luca Weiss @ 2023-05-07 20:22 UTC (permalink / raw)
  To: linux-arm-msm, ~postmarketos/upstreaming
  Cc: ~postmarketos/upstreaming, phone-devel, Matti Lehtimäki,
	Amit Kucheria, Thara Gopinath, Andy Gross, Bjorn Andersson,
	Konrad Dybcio, Rafael J. Wysocki, Daniel Lezcano, Zhang Rui,
	Rob Herring, Krzysztof Kozlowski, linux-pm, devicetree,
	linux-kernel, Matti Lehtimäki

On Sonntag, 7. Mai 2023 22:12:20 CEST Matti Lehtimäki wrote:
> Qualcomm MSM8226 has tsens v0.1 block.
> 
> Signed-off-by: Matti Lehtimäki <matti.lehtimaki@gmail.com>

Reviewed-by: Luca Weiss <luca@z3ntu.xyz>

> ---
>  Documentation/devicetree/bindings/thermal/qcom-tsens.yaml | 1 +
>  1 file changed, 1 insertion(+)
> 
> diff --git a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
> b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml index
> 926e9c51c93c..d6b2957d5137 100644
> --- a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
> +++ b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
> @@ -29,6 +29,7 @@ properties:
>          items:
>            - enum:
>                - qcom,mdm9607-tsens
> +              - qcom,msm8226-tsens
>                - qcom,msm8916-tsens
>                - qcom,msm8939-tsens
>                - qcom,msm8974-tsens





^ permalink raw reply	[flat|nested] 13+ messages in thread

* Re: [PATCH 3/6] thermal/drivers/qcom/tsens-v0_1: Add support for MSM8226
  2023-05-07 20:12 ` [PATCH 3/6] thermal/drivers/qcom/tsens-v0_1: Add support " Matti Lehtimäki
@ 2023-05-07 20:26   ` Luca Weiss
  2023-05-07 20:40   ` Dmitry Baryshkov
  2023-06-05 14:39   ` Daniel Lezcano
  2 siblings, 0 replies; 13+ messages in thread
From: Luca Weiss @ 2023-05-07 20:26 UTC (permalink / raw)
  To: linux-arm-msm, ~postmarketos/upstreaming
  Cc: ~postmarketos/upstreaming, phone-devel, Matti Lehtimäki,
	Andy Gross, Bjorn Andersson, Konrad Dybcio, Amit Kucheria,
	Thara Gopinath, Rafael J. Wysocki, Daniel Lezcano, Zhang Rui,
	linux-pm, linux-kernel, Matti Lehtimäki

On Sonntag, 7. Mai 2023 22:12:21 CEST Matti Lehtimäki wrote:
> The MSM8226 TSENS IP has 6 thermal sensors in a TSENS v0.1 block.
> The thermal sensors use non-standard slope values.

Matches the configuration found in msm8226-v2.dtsi in msm-3.10 kernel.

Reviewed-by: Luca Weiss <luca@z3ntu.xyz>

> 
> Signed-off-by: Matti Lehtimäki <matti.lehtimaki@gmail.com>
> ---
>  drivers/thermal/qcom/tsens-v0_1.c | 27 ++++++++++++++++++++++++++-
>  drivers/thermal/qcom/tsens.c      |  3 +++
>  drivers/thermal/qcom/tsens.h      |  2 +-
>  3 files changed, 30 insertions(+), 2 deletions(-)
> 
> diff --git a/drivers/thermal/qcom/tsens-v0_1.c
> b/drivers/thermal/qcom/tsens-v0_1.c index e89c6f39a3ae..ad57ab94546b 100644
> --- a/drivers/thermal/qcom/tsens-v0_1.c
> +++ b/drivers/thermal/qcom/tsens-v0_1.c
> @@ -243,6 +243,18 @@ static int calibrate_8974(struct tsens_priv *priv)
>  	return 0;
>  }
> 
> +static int __init init_8226(struct tsens_priv *priv)
> +{
> +	priv->sensor[0].slope = 2901;
> +	priv->sensor[1].slope = 2846;
> +	priv->sensor[2].slope = 3038;
> +	priv->sensor[3].slope = 2955;
> +	priv->sensor[4].slope = 2901;
> +	priv->sensor[5].slope = 2846;
> +
> +	return init_common(priv);
> +}
> +
>  static int __init init_8939(struct tsens_priv *priv) {
>  	priv->sensor[0].slope = 2911;
>  	priv->sensor[1].slope = 2789;
> @@ -258,7 +270,7 @@ static int __init init_8939(struct tsens_priv *priv) {
>  	return init_common(priv);
>  }
> 
> -/* v0.1: 8916, 8939, 8974, 9607 */
> +/* v0.1: 8226, 8916, 8939, 8974, 9607 */
> 
>  static struct tsens_features tsens_v0_1_feat = {
>  	.ver_major	= VER_0_1,
> @@ -313,6 +325,19 @@ static const struct tsens_ops ops_v0_1 = {
>  	.get_temp	= get_temp_common,
>  };
> 
> +static const struct tsens_ops ops_8226 = {
> +	.init		= init_8226,
> +	.calibrate	= tsens_calibrate_common,
> +	.get_temp	= get_temp_common,
> +};
> +
> +struct tsens_plat_data data_8226 = {
> +	.num_sensors	= 6,
> +	.ops		= &ops_8226,
> +	.feat		= &tsens_v0_1_feat,
> +	.fields	= tsens_v0_1_regfields,
> +};
> +
>  static const struct tsens_ops ops_8916 = {
>  	.init		= init_common,
>  	.calibrate	= calibrate_8916,
> diff --git a/drivers/thermal/qcom/tsens.c b/drivers/thermal/qcom/tsens.c
> index 8020ead2794e..eb33a8bf0488 100644
> --- a/drivers/thermal/qcom/tsens.c
> +++ b/drivers/thermal/qcom/tsens.c
> @@ -1095,6 +1095,9 @@ static const struct of_device_id tsens_table[] = {
>  	}, {
>  		.compatible = "qcom,mdm9607-tsens",
>  		.data = &data_9607,
> +	}, {
> +		.compatible = "qcom,msm8226-tsens",
> +		.data = &data_8226,
>  	}, {
>  		.compatible = "qcom,msm8916-tsens",
>  		.data = &data_8916,
> diff --git a/drivers/thermal/qcom/tsens.h b/drivers/thermal/qcom/tsens.h
> index dba9cd38f637..433eba370998 100644
> --- a/drivers/thermal/qcom/tsens.h
> +++ b/drivers/thermal/qcom/tsens.h
> @@ -635,7 +635,7 @@ int get_temp_common(const struct tsens_sensor *s, int
> *temp); extern struct tsens_plat_data data_8960;
> 
>  /* TSENS v0.1 targets */
> -extern struct tsens_plat_data data_8916, data_8939, data_8974, data_9607;
> +extern struct tsens_plat_data data_8226, data_8916, data_8939, data_8974,
> data_9607;
> 
>  /* TSENS v1 targets */
>  extern struct tsens_plat_data data_tsens_v1, data_8976, data_8956;





^ permalink raw reply	[flat|nested] 13+ messages in thread

* Re: [PATCH 3/6] thermal/drivers/qcom/tsens-v0_1: Add support for MSM8226
  2023-05-07 20:12 ` [PATCH 3/6] thermal/drivers/qcom/tsens-v0_1: Add support " Matti Lehtimäki
  2023-05-07 20:26   ` Luca Weiss
@ 2023-05-07 20:40   ` Dmitry Baryshkov
  2023-05-07 21:11     ` Matti Lehtimäki
  2023-06-05 14:39   ` Daniel Lezcano
  2 siblings, 1 reply; 13+ messages in thread
From: Dmitry Baryshkov @ 2023-05-07 20:40 UTC (permalink / raw)
  To: Matti Lehtimäki, linux-arm-msm
  Cc: ~postmarketos/upstreaming, phone-devel, Andy Gross,
	Bjorn Andersson, Konrad Dybcio, Amit Kucheria, Thara Gopinath,
	Rafael J. Wysocki, Daniel Lezcano, Zhang Rui, linux-pm,
	linux-kernel

On 07/05/2023 23:12, Matti Lehtimäki wrote:
> The MSM8226 TSENS IP has 6 thermal sensors in a TSENS v0.1 block.
> The thermal sensors use non-standard slope values.

Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>

Note, the driver from 3.10 also provides custom data for non-calibrated 
mode. We can either ignore that (in the hope that all devices leaving 
the factory are calibrated), or fix it in the manner close to 8x74.

> 
> Signed-off-by: Matti Lehtimäki <matti.lehtimaki@gmail.com>
> ---
>   drivers/thermal/qcom/tsens-v0_1.c | 27 ++++++++++++++++++++++++++-
>   drivers/thermal/qcom/tsens.c      |  3 +++
>   drivers/thermal/qcom/tsens.h      |  2 +-
>   3 files changed, 30 insertions(+), 2 deletions(-)
> 
> diff --git a/drivers/thermal/qcom/tsens-v0_1.c b/drivers/thermal/qcom/tsens-v0_1.c
> index e89c6f39a3ae..ad57ab94546b 100644
> --- a/drivers/thermal/qcom/tsens-v0_1.c
> +++ b/drivers/thermal/qcom/tsens-v0_1.c
> @@ -243,6 +243,18 @@ static int calibrate_8974(struct tsens_priv *priv)
>   	return 0;
>   }
>   
> +static int __init init_8226(struct tsens_priv *priv)
> +{
> +	priv->sensor[0].slope = 2901;
> +	priv->sensor[1].slope = 2846;
> +	priv->sensor[2].slope = 3038;
> +	priv->sensor[3].slope = 2955;
> +	priv->sensor[4].slope = 2901;
> +	priv->sensor[5].slope = 2846;
> +
> +	return init_common(priv);
> +}
> +
>   static int __init init_8939(struct tsens_priv *priv) {
>   	priv->sensor[0].slope = 2911;
>   	priv->sensor[1].slope = 2789;
> @@ -258,7 +270,7 @@ static int __init init_8939(struct tsens_priv *priv) {
>   	return init_common(priv);
>   }
>   
> -/* v0.1: 8916, 8939, 8974, 9607 */
> +/* v0.1: 8226, 8916, 8939, 8974, 9607 */
>   
>   static struct tsens_features tsens_v0_1_feat = {
>   	.ver_major	= VER_0_1,
> @@ -313,6 +325,19 @@ static const struct tsens_ops ops_v0_1 = {
>   	.get_temp	= get_temp_common,
>   };
>   
> +static const struct tsens_ops ops_8226 = {
> +	.init		= init_8226,
> +	.calibrate	= tsens_calibrate_common,
> +	.get_temp	= get_temp_common,
> +};
> +
> +struct tsens_plat_data data_8226 = {
> +	.num_sensors	= 6,
> +	.ops		= &ops_8226,
> +	.feat		= &tsens_v0_1_feat,
> +	.fields	= tsens_v0_1_regfields,
> +};
> +
>   static const struct tsens_ops ops_8916 = {
>   	.init		= init_common,
>   	.calibrate	= calibrate_8916,
> diff --git a/drivers/thermal/qcom/tsens.c b/drivers/thermal/qcom/tsens.c
> index 8020ead2794e..eb33a8bf0488 100644
> --- a/drivers/thermal/qcom/tsens.c
> +++ b/drivers/thermal/qcom/tsens.c
> @@ -1095,6 +1095,9 @@ static const struct of_device_id tsens_table[] = {
>   	}, {
>   		.compatible = "qcom,mdm9607-tsens",
>   		.data = &data_9607,
> +	}, {
> +		.compatible = "qcom,msm8226-tsens",
> +		.data = &data_8226,
>   	}, {
>   		.compatible = "qcom,msm8916-tsens",
>   		.data = &data_8916,
> diff --git a/drivers/thermal/qcom/tsens.h b/drivers/thermal/qcom/tsens.h
> index dba9cd38f637..433eba370998 100644
> --- a/drivers/thermal/qcom/tsens.h
> +++ b/drivers/thermal/qcom/tsens.h
> @@ -635,7 +635,7 @@ int get_temp_common(const struct tsens_sensor *s, int *temp);
>   extern struct tsens_plat_data data_8960;
>   
>   /* TSENS v0.1 targets */
> -extern struct tsens_plat_data data_8916, data_8939, data_8974, data_9607;
> +extern struct tsens_plat_data data_8226, data_8916, data_8939, data_8974, data_9607;
>   
>   /* TSENS v1 targets */
>   extern struct tsens_plat_data data_tsens_v1, data_8976, data_8956;

-- 
With best wishes
Dmitry


^ permalink raw reply	[flat|nested] 13+ messages in thread

* Re: [PATCH 3/6] thermal/drivers/qcom/tsens-v0_1: Add support for MSM8226
  2023-05-07 20:40   ` Dmitry Baryshkov
@ 2023-05-07 21:11     ` Matti Lehtimäki
  2023-05-07 22:49       ` Dmitry Baryshkov
  0 siblings, 1 reply; 13+ messages in thread
From: Matti Lehtimäki @ 2023-05-07 21:11 UTC (permalink / raw)
  To: Dmitry Baryshkov, linux-arm-msm
  Cc: ~postmarketos/upstreaming, phone-devel, Andy Gross,
	Bjorn Andersson, Konrad Dybcio, Amit Kucheria, Thara Gopinath,
	Rafael J. Wysocki, Daniel Lezcano, Zhang Rui, linux-pm,
	linux-kernel

On 7.5.2023 23.40, Dmitry Baryshkov wrote:
> On 07/05/2023 23:12, Matti Lehtimäki wrote:
>> The MSM8226 TSENS IP has 6 thermal sensors in a TSENS v0.1 block.
>> The thermal sensors use non-standard slope values.
> 
> Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
> 
> Note, the driver from 3.10 also provides custom data for non-calibrated mode. We can either ignore that (in the hope that all devices leaving the factory are calibrated), or fix it in the manner close to 8x74.

That is true, 3.10 kernel does support non-calibrated mode. I can add support for that in a new version if that is wanted.

^ permalink raw reply	[flat|nested] 13+ messages in thread

* Re: [PATCH 2/6] dt-bindings: thermal: tsens: Add compatible for MSM8226
  2023-05-07 20:12 ` [PATCH 2/6] dt-bindings: thermal: tsens: Add compatible for MSM8226 Matti Lehtimäki
  2023-05-07 20:22   ` Luca Weiss
@ 2023-05-07 21:25   ` Rob Herring
  2023-05-10 13:57   ` Krzysztof Kozlowski
  2023-06-05 14:39   ` Daniel Lezcano
  3 siblings, 0 replies; 13+ messages in thread
From: Rob Herring @ 2023-05-07 21:25 UTC (permalink / raw)
  To: Matti Lehtimäki
  Cc: linux-pm, Daniel Lezcano, Thara Gopinath, linux-kernel,
	phone-devel, Bjorn Andersson, linux-arm-msm, Andy Gross,
	Krzysztof Kozlowski, Rafael J. Wysocki, Rob Herring,
	~postmarketos/upstreaming, devicetree, Zhang Rui, Konrad Dybcio,
	Amit Kucheria


On Sun, 07 May 2023 23:12:20 +0300, Matti Lehtimäki wrote:
> Qualcomm MSM8226 has tsens v0.1 block.
> 
> Signed-off-by: Matti Lehtimäki <matti.lehtimaki@gmail.com>
> ---
>  Documentation/devicetree/bindings/thermal/qcom-tsens.yaml | 1 +
>  1 file changed, 1 insertion(+)
> 

My bot found errors running 'make DT_CHECKER_FLAGS=-m dt_binding_check'
on your patch (DT_CHECKER_FLAGS is new in v5.13):

yamllint warnings/errors:

dtschema/dtc warnings/errors:
/builds/robherring/dt-review-ci/linux/Documentation/devicetree/bindings/pci/fsl,imx6q-pcie-ep.example.dtb: pcie-ep@33800000: Unevaluated properties are not allowed ('assigned-clock-parents', 'assigned-clock-rates', 'assigned-clocks' were unexpected)
	From schema: /builds/robherring/dt-review-ci/linux/Documentation/devicetree/bindings/pci/fsl,imx6q-pcie-ep.yaml
/builds/robherring/dt-review-ci/linux/Documentation/devicetree/bindings/media/rockchip-isp1.example.dtb: camera@3c: port:endpoint:data-lanes: [[1]] is too short
	From schema: /builds/robherring/dt-review-ci/linux/Documentation/devicetree/bindings/media/i2c/ovti,ov2685.yaml
/builds/robherring/dt-review-ci/linux/Documentation/devicetree/bindings/media/i2c/ovti,ov2685.example.dtb: camera-sensor@3c: port:endpoint:data-lanes: [[1]] is too short
	From schema: /builds/robherring/dt-review-ci/linux/Documentation/devicetree/bindings/media/i2c/ovti,ov2685.yaml

doc reference errors (make refcheckdocs):
Documentation/usb/gadget_uvc.rst: Documentation/userspace-api/media/v4l/pixfmt-packed.yuv.rst
MAINTAINERS: Documentation/devicetree/bindings/pwm/pwm-apple.yaml

See https://patchwork.ozlabs.org/project/devicetree-bindings/patch/20230507201225.89694-3-matti.lehtimaki@gmail.com

The base for the series is generally the latest rc1. A different dependency
should be noted in *this* patch.

If you already ran 'make dt_binding_check' and didn't see the above
error(s), then make sure 'yamllint' is installed and dt-schema is up to
date:

pip3 install dtschema --upgrade

Please check and re-submit after running the above command yourself. Note
that DT_SCHEMA_FILES can be set to your schema file to speed up checking
your schema. However, it must be unset to test all examples with your schema.


^ permalink raw reply	[flat|nested] 13+ messages in thread

* Re: [PATCH 3/6] thermal/drivers/qcom/tsens-v0_1: Add support for MSM8226
  2023-05-07 21:11     ` Matti Lehtimäki
@ 2023-05-07 22:49       ` Dmitry Baryshkov
  0 siblings, 0 replies; 13+ messages in thread
From: Dmitry Baryshkov @ 2023-05-07 22:49 UTC (permalink / raw)
  To: Matti Lehtimäki
  Cc: linux-arm-msm, ~postmarketos/upstreaming, phone-devel, Andy Gross,
	Bjorn Andersson, Konrad Dybcio, Amit Kucheria, Thara Gopinath,
	Rafael J. Wysocki, Daniel Lezcano, Zhang Rui, linux-pm,
	linux-kernel

On Mon, 8 May 2023 at 00:11, Matti Lehtimäki <matti.lehtimaki@gmail.com> wrote:
>
> On 7.5.2023 23.40, Dmitry Baryshkov wrote:
> > On 07/05/2023 23:12, Matti Lehtimäki wrote:
> >> The MSM8226 TSENS IP has 6 thermal sensors in a TSENS v0.1 block.
> >> The thermal sensors use non-standard slope values.
> >
> > Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org>
> >
> > Note, the driver from 3.10 also provides custom data for non-calibrated mode. We can either ignore that (in the hope that all devices leaving the factory are calibrated), or fix it in the manner close to 8x74.
>
> That is true, 3.10 kernel does support non-calibrated mode. I can add support for that in a new version if that is wanted.

If there are no other comments, I'd suggest sending that as a follow
up (if sending it at all). The tsens driver provides some default
values for non-calibrated mode, so it is a minor issue.

-- 
With best wishes
Dmitry

^ permalink raw reply	[flat|nested] 13+ messages in thread

* Re: [PATCH 2/6] dt-bindings: thermal: tsens: Add compatible for MSM8226
  2023-05-07 20:12 ` [PATCH 2/6] dt-bindings: thermal: tsens: Add compatible for MSM8226 Matti Lehtimäki
  2023-05-07 20:22   ` Luca Weiss
  2023-05-07 21:25   ` Rob Herring
@ 2023-05-10 13:57   ` Krzysztof Kozlowski
  2023-06-05 14:39   ` Daniel Lezcano
  3 siblings, 0 replies; 13+ messages in thread
From: Krzysztof Kozlowski @ 2023-05-10 13:57 UTC (permalink / raw)
  To: Matti Lehtimäki, linux-arm-msm
  Cc: ~postmarketos/upstreaming, phone-devel, Amit Kucheria,
	Thara Gopinath, Andy Gross, Bjorn Andersson, Konrad Dybcio,
	Rafael J. Wysocki, Daniel Lezcano, Zhang Rui, Rob Herring,
	Krzysztof Kozlowski, linux-pm, devicetree, linux-kernel

On 07/05/2023 22:12, Matti Lehtimäki wrote:
> Qualcomm MSM8226 has tsens v0.1 block.
> 
> Signed-off-by: Matti Lehtimäki <matti.lehtimaki@gmail.com>
> ---

Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>

Bot's errors can be ignored.

Best regards,
Krzysztof


^ permalink raw reply	[flat|nested] 13+ messages in thread

* Re: [PATCH 3/6] thermal/drivers/qcom/tsens-v0_1: Add support for MSM8226
  2023-05-07 20:12 ` [PATCH 3/6] thermal/drivers/qcom/tsens-v0_1: Add support " Matti Lehtimäki
  2023-05-07 20:26   ` Luca Weiss
  2023-05-07 20:40   ` Dmitry Baryshkov
@ 2023-06-05 14:39   ` Daniel Lezcano
  2 siblings, 0 replies; 13+ messages in thread
From: Daniel Lezcano @ 2023-06-05 14:39 UTC (permalink / raw)
  To: Matti Lehtimäki, linux-arm-msm
  Cc: ~postmarketos/upstreaming, phone-devel, Andy Gross,
	Bjorn Andersson, Konrad Dybcio, Amit Kucheria, Thara Gopinath,
	Rafael J. Wysocki, Zhang Rui, linux-pm, linux-kernel

On 07/05/2023 22:12, Matti Lehtimäki wrote:
> The MSM8226 TSENS IP has 6 thermal sensors in a TSENS v0.1 block.
> The thermal sensors use non-standard slope values.
> 
> Signed-off-by: Matti Lehtimäki <matti.lehtimaki@gmail.com>
> ---

Applied, thanks

-- 
<http://www.linaro.org/> Linaro.org │ Open source software for ARM SoCs

Follow Linaro:  <http://www.facebook.com/pages/Linaro> Facebook |
<http://twitter.com/#!/linaroorg> Twitter |
<http://www.linaro.org/linaro-blog/> Blog


^ permalink raw reply	[flat|nested] 13+ messages in thread

* Re: [PATCH 2/6] dt-bindings: thermal: tsens: Add compatible for MSM8226
  2023-05-07 20:12 ` [PATCH 2/6] dt-bindings: thermal: tsens: Add compatible for MSM8226 Matti Lehtimäki
                     ` (2 preceding siblings ...)
  2023-05-10 13:57   ` Krzysztof Kozlowski
@ 2023-06-05 14:39   ` Daniel Lezcano
  3 siblings, 0 replies; 13+ messages in thread
From: Daniel Lezcano @ 2023-06-05 14:39 UTC (permalink / raw)
  To: Matti Lehtimäki, linux-arm-msm
  Cc: ~postmarketos/upstreaming, phone-devel, Amit Kucheria,
	Thara Gopinath, Andy Gross, Bjorn Andersson, Konrad Dybcio,
	Rafael J. Wysocki, Zhang Rui, Rob Herring, Krzysztof Kozlowski,
	linux-pm, devicetree, linux-kernel

On 07/05/2023 22:12, Matti Lehtimäki wrote:
> Qualcomm MSM8226 has tsens v0.1 block.
> 
> Signed-off-by: Matti Lehtimäki <matti.lehtimaki@gmail.com>
> ---

Applied, thanks

-- 
<http://www.linaro.org/> Linaro.org │ Open source software for ARM SoCs

Follow Linaro:  <http://www.facebook.com/pages/Linaro> Facebook |
<http://twitter.com/#!/linaroorg> Twitter |
<http://www.linaro.org/linaro-blog/> Blog


^ permalink raw reply	[flat|nested] 13+ messages in thread

* Re: (subset) [PATCH 0/6] Enable MSM8226 TSENS support
  2023-05-07 20:12 [PATCH 0/6] Enable MSM8226 TSENS support Matti Lehtimäki
  2023-05-07 20:12 ` [PATCH 2/6] dt-bindings: thermal: tsens: Add compatible for MSM8226 Matti Lehtimäki
  2023-05-07 20:12 ` [PATCH 3/6] thermal/drivers/qcom/tsens-v0_1: Add support " Matti Lehtimäki
@ 2023-06-13 23:48 ` Bjorn Andersson
  2 siblings, 0 replies; 13+ messages in thread
From: Bjorn Andersson @ 2023-06-13 23:48 UTC (permalink / raw)
  To: linux-arm-msm, Matti Lehtimäki
  Cc: devicetree, linux-kernel, phone-devel, Amit Kucheria,
	Srinivas Kandagatla, Zhang Rui, linux-pm,
	~postmarketos/upstreaming, Konrad Dybcio

On Sun, 7 May 2023 23:12:18 +0300, Matti Lehtimäki wrote:
> Add support for tsens in MSM8226. Add qfprom compatible for MSM8226.
> Add device tree nodes for qfprom, tsens and thermal zones for MSM8226.
> 
> Matti Lehtimäki (6):
>   dt-bindings: nvmem: qfprom: Add compatible for MSM8226
>   dt-bindings: thermal: tsens: Add compatible for MSM8226
>   thermal/drivers/qcom/tsens-v0_1: Add support for MSM8226
>   ARM: dts: msm8226: Add qfprom node
>   ARM: dts: msm8226: Add tsens node and related nvmem cells
>   ARM: dts: msm8226: Add thermal zones node
> 
> [...]

Applied, thanks!

[4/6] ARM: dts: msm8226: Add qfprom node
      commit: 16a9fa7ab27b69be3a34b97ff8c7b034fcc73b88
[5/6] ARM: dts: msm8226: Add tsens node and related nvmem cells
      commit: 0f8861c9fc7cc9af6d6f65d6657aa9cf2531b29c
[6/6] ARM: dts: msm8226: Add thermal zones node
      commit: 8d4236f62f3acbc6a0def79106c13fe7344d8238

Best regards,
-- 
Bjorn Andersson <andersson@kernel.org>

^ permalink raw reply	[flat|nested] 13+ messages in thread

end of thread, other threads:[~2023-06-13 23:47 UTC | newest]

Thread overview: 13+ messages (download: mbox.gz follow: Atom feed
-- links below jump to the message on this page --
2023-05-07 20:12 [PATCH 0/6] Enable MSM8226 TSENS support Matti Lehtimäki
2023-05-07 20:12 ` [PATCH 2/6] dt-bindings: thermal: tsens: Add compatible for MSM8226 Matti Lehtimäki
2023-05-07 20:22   ` Luca Weiss
2023-05-07 21:25   ` Rob Herring
2023-05-10 13:57   ` Krzysztof Kozlowski
2023-06-05 14:39   ` Daniel Lezcano
2023-05-07 20:12 ` [PATCH 3/6] thermal/drivers/qcom/tsens-v0_1: Add support " Matti Lehtimäki
2023-05-07 20:26   ` Luca Weiss
2023-05-07 20:40   ` Dmitry Baryshkov
2023-05-07 21:11     ` Matti Lehtimäki
2023-05-07 22:49       ` Dmitry Baryshkov
2023-06-05 14:39   ` Daniel Lezcano
2023-06-13 23:48 ` (subset) [PATCH 0/6] Enable MSM8226 TSENS support Bjorn Andersson

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