[PATCH v2 0/4] One more step to the thermal zone structure encapsulation

[Daniel Lezcano <daniel.lezcano@linaro.org>]

The series provides more changes to self-encapsulate the thermal zone device
structure in order to protect wild accesses to the thermal zone device
internals, especially the trip points and the locks.

The first patch adds a macro to warn at compilation time if the
thermal_core.h is included in a file not belonging to the thermal core
code. One warning will happen with the nvidia drivers but this is in
the way to be solved.

The second patch reorders the headers inclusion in the core code.

The next patches makes the int340x drivers to use the thermal trip
update above and the different accessors for thermal zone structure.

Daniel Lezcano (4):
  thermal/core: Hardening the self-encapsulation
  thermal/core: Reorder the headers inclusion
  thermal/drivers/int3400: Use thermal zone device wrappers
  thermal/drivers/int340x: Do not check the thermal zone state

 drivers/thermal/gov_bang_bang.c               |  1 +
 drivers/thermal/gov_fair_share.c              |  1 +
 drivers/thermal/gov_power_allocator.c         |  7 +--
 drivers/thermal/gov_step_wise.c               |  1 +
 drivers/thermal/gov_user_space.c              |  1 +
 .../intel/int340x_thermal/int3400_thermal.c   | 44 +++++++++----------
 drivers/thermal/thermal_acpi.c                |  1 +
 drivers/thermal/thermal_core.c                |  7 +--
 drivers/thermal/thermal_core.h                |  4 ++
 drivers/thermal/thermal_helpers.c             |  1 +
 drivers/thermal/thermal_hwmon.c               |  1 +
 drivers/thermal/thermal_netlink.c             |  1 +
 drivers/thermal/thermal_of.c                  |  1 +
 drivers/thermal/thermal_sysfs.c               |  1 +
 drivers/thermal/thermal_trip.c                |  1 +
 15 files changed, 45 insertions(+), 28 deletions(-)

-- 
2.34.1