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[195.132.213.62]) by smtp.gmail.com with ESMTPSA id m21-20020a05600c091500b003d1de805de5sm2450567wmp.16.2023.01.24.09.46.26 (version=TLS1_3 cipher=TLS_AES_128_GCM_SHA256 bits=128/128); Tue, 24 Jan 2023 09:46:27 -0800 (PST) Message-ID: <2950b824-ad2f-2579-a956-a03d157453eb@baylibre.com> Date: Tue, 24 Jan 2023 18:46:25 +0100 MIME-Version: 1.0 User-Agent: Mozilla/5.0 (X11; Linux x86_64; rv:102.0) Gecko/20100101 Thunderbird/102.7.0 Subject: Re: [PATCH v7 4/4] thermal: mediatek: add another get_temp ops for thermal sensors To: Daniel Lezcano , "Rafael J. Wysocki" , Amit Kucheria , Rob Herring , Krzysztof Kozlowski , Zhang Rui Cc: AngeloGioacchino Del Regno , Fabien Parent , Matthias Brugger , Markus Schneider-Pargmann , linux-pm@vger.kernel.org, Rob Herring , Michael Kao , linux-kernel@vger.kernel.org, Hsin-Yi Wang , linux-arm-kernel@lists.infradead.org, linux-mediatek@lists.infradead.org, devicetree@vger.kernel.org References: <20221018-up-i350-thermal-bringup-v7-0-ebf08ff2eddb@baylibre.com> <20221018-up-i350-thermal-bringup-v7-4-ebf08ff2eddb@baylibre.com> <4121bb6b-30db-7a23-f4c8-40afdda7a0b5@linaro.org> <0644aede-c281-3919-50e0-4466f6587d81@linaro.org> <187b0fe1-1f14-d8b8-c827-1e824da0b1d3@baylibre.com> <9f9547a2-69dd-f91d-c587-289156bf9d55@linaro.org> Content-Language: en-US From: Amjad Ouled-Ameur In-Reply-To: <9f9547a2-69dd-f91d-c587-289156bf9d55@linaro.org> Content-Type: text/plain; charset=UTF-8; format=flowed Content-Transfer-Encoding: 7bit Precedence: bulk List-ID: X-Mailing-List: linux-pm@vger.kernel.org On 1/24/23 17:54, Daniel Lezcano wrote: > > Hi Amjad, > > On 24/01/2023 11:08, Amjad Ouled-Ameur wrote: > > [ ... ] > >>>> >>>> IIUC, there is a sensor per couple of cores. 1 x 2Bigs, 1 x 2Bigs, 1 x 4 Little, right ? >>> >>> MT8365 SoC has 4 x A53 CPUs. The SoC has 4 thermal zones per sensor. Thermal zone 0 corresponds >>> >>> to all 4 x A53 CPUs, the other thermal zones (1, 2 and 3) has nothing to do with CPUs. The cooling device type >>> >>> used for CPUs is passive. FYI, thermal zones 1, 2 and 3 are present in the SoC for debug-purpose only, they are not supposed >>> >>> to be used for production. >>> >> After reconsidering the fact that zones 1, 2 and 3 are only used for dev/debug, it might be best to avo > >> aggregation as you suggested, and keep only support for zone 0 in this driver. Thus I suggest I send a V8 >> >> where I keep only below fixes for this patch if that's okay with you: >> >> - Define "raw_to_mcelsius" function pointer for "struct thermal_bank_cfg". >> >> - Fix "mtk_thermal" variable in mtk_read_temp(). >> >> - Set "mt->raw_to_mcelsius" in probe(). >> >> >> For zones 1, 2 and 3 we can later add a different driver specific for dev/debug to probe them to >> >> avoid confusion. > > You can add them in the driver and in the device tree, but just add the cooling device for the thermal zone 0. Thermal zone 0 uses CPU{0..3} for passive cooling, in this case we should register cooling device with cpufreq_cooling_register() for each CPU right ? > >