From mboxrd@z Thu Jan 1 00:00:00 1970 From: Francesco Lavra Subject: Re: [PATCH V6 1/2] Thermal: Add ST-Ericsson DB8500 thermal driver. Date: Sun, 18 Nov 2012 15:29:51 +0100 Message-ID: <50A8F0DF.8040509@gmail.com> References: <1352977003-25095-1-git-send-email-hongbo.zhang@linaro.com> <1352977003-25095-2-git-send-email-hongbo.zhang@linaro.com> <1352983878.2080.25.camel@rzhang1-mobl4> Mime-Version: 1.0 Content-Type: text/plain; charset="us-ascii" Content-Transfer-Encoding: 7bit Return-path: In-Reply-To: <1352983878.2080.25.camel@rzhang1-mobl4> List-Unsubscribe: , List-Archive: List-Post: List-Help: List-Subscribe: , Sender: linaro-dev-bounces-cunTk1MwBs8s++Sfvej+rw@public.gmane.org Errors-To: linaro-dev-bounces-cunTk1MwBs8s++Sfvej+rw@public.gmane.org To: Zhang Rui Cc: linaro-kernel-cunTk1MwBs8s++Sfvej+rw@public.gmane.org, linaro-dev-cunTk1MwBs8s++Sfvej+rw@public.gmane.org, linux-pm-u79uwXL29TY76Z2rM5mHXA@public.gmane.org, patches-QSEj5FYQhm4dnm+yROfE0A@public.gmane.org, linux-kernel-u79uwXL29TY76Z2rM5mHXA@public.gmane.org, STEricsson_nomadik_linux-nkJGhpqTU55BDgjK7y7TUQ@public.gmane.org, kernel-vMlcbD5RyM6HZuj8yyL1ah2eb7JE58TQ@public.gmane.org, "hongbo.zhang" List-Id: linux-pm@vger.kernel.org On 11/15/2012 01:51 PM, Zhang Rui wrote: > On Thu, 2012-11-15 at 18:56 +0800, hongbo.zhang wrote: >> From: "hongbo.zhang" >> >> This driver is based on the thermal management framework in thermal_sys.c. A >> thermal zone device is created with the trip points to which cooling devices >> can be bound, the current cooling device is cpufreq, e.g. CPU frequency is >> clipped down to cool the CPU, and other cooling devices can be added and bound >> to the trip points dynamically. The platform specific PRCMU interrupts are >> used to active thermal update when trip points are reached. >> >> Signed-off-by: hongbo.zhang >> Reviewed-by: Viresh Kumar >> Reviewed-by: Francesco Lavra > > Patch is refreshed and applied to thermal next. > refreshed patch attached. [...] > diff --git a/drivers/thermal/Kconfig b/drivers/thermal/Kconfig > index 99b6587..d96da07 100644 > --- a/drivers/thermal/Kconfig > +++ b/drivers/thermal/Kconfig > @@ -101,5 +101,25 @@ config EXYNOS_THERMAL > If you say yes here you get support for TMU (Thermal Managment > Unit) on SAMSUNG EXYNOS series of SoC. > > +config DB8500_THERMAL > + bool "DB8500 thermal management" > + depends on ARCH_U8500 Shouldn't it depend on THERMAL as well, as in Hongbo's original patch? > + default y > + help > + Adds DB8500 thermal management implementation according to the thermal > + management framework. A thermal zone with several trip points will be > + created. Cooling devices can be bound to the trip points to cool this > + thermal zone if trip points reached. > + > +config DB8500_CPUFREQ_COOLING > + tristate "DB8500 cpufreq cooling" > + depends on ARCH_U8500 > + depends on CPU_THERMAL > + default y > + help > + Adds DB8500 cpufreq cooling devices, and these cooling devices can be > + bound to thermal zone trip points. When a trip point reached, the > + bound cpufreq cooling device turns active to set CPU frequency low to > + cool down the CPU. > > endif -- Francesco