From mboxrd@z Thu Jan 1 00:00:00 1970 From: Stephen Warren Subject: Re: [RFC PATCH 1/2] PM / OPP: add support to specify phandle of another node for OPP Date: Wed, 31 Jul 2013 15:51:15 -0600 Message-ID: <51F986D3.4060501@wwwdotorg.org> References: <1375207217-4433-1-git-send-email-Sudeep.KarkadaNagesha@arm.com> <1375207217-4433-2-git-send-email-Sudeep.KarkadaNagesha@arm.com> <51F80750.8030701@wwwdotorg.org> <51F826A0.2000109@ti.com> <51F8F17B.1020304@arm.com> <51F9234A.6010501@ti.com> Mime-Version: 1.0 Content-Type: text/plain; charset=windows-1252 Content-Transfer-Encoding: 7bit Return-path: In-Reply-To: <51F9234A.6010501@ti.com> Sender: cpufreq-owner@vger.kernel.org To: Nishanth Menon Cc: Sudeep KarkadaNagesha , "cpufreq@vger.kernel.org" , "linux-pm@vger.kernel.org" , "devicetree@vger.kernel.org" , "rob.herring@calxeda.com" , Pawel Moll , Mark Rutland , "Rafael J. Wysocki" List-Id: linux-pm@vger.kernel.org On 07/31/2013 08:46 AM, Nishanth Menon wrote: ... > Let me try to explain since SoCs such as OMAP/AM family dont make life > trivial :).. > > An legacy example[1][2] > > SoC DM explains that the chip is capable of X opps: > opp1, 2 - for all devices > opp1,2, 3 - if efuse bit X@y is set > opp1,2,3,4 - if efuse bit X@y is set AND Board design meets SoC vendors > requirements (including additional features A, B is enabled). Hopefully the text "board design meets SoC vendors requirements" means something like "the board has a big fan capable of dissipating a lot of heat" and not "the board manufacturer paid us a lot of money to license the 'go faster' feature". The former could well be suitable to represent in DT, the latter not.