From: Stephen Boyd <sboyd@codeaurora.org>
To: Punit Agrawal <punit.agrawal@arm.com>
Cc: Eduardo Valentin <edubezval@gmail.com>,
linux-pm@vger.kernel.org, linux-kernel@vger.kernel.org,
Zhang Rui <rui.zhang@intel.com>
Subject: Re: [PATCH] thermal: Bind cooling devices with the correct arguments
Date: Wed, 18 Jun 2014 15:17:48 -0700 [thread overview]
Message-ID: <53A2100C.6080701@codeaurora.org> (raw)
In-Reply-To: <9hh61jzsuq1.fsf@arm.com>
On 06/17/14 03:20, Punit Agrawal wrote:
> Ping?
>
> Punit Agrawal <punit.agrawal@arm.com> writes:
>
>> When binding cooling devices to thermal zones created from the device
>> tree the minimum and maximum cooling states are in the wrong order
>> leading to failure to bind.
>>
>> Fix the order of cooling states in the call to
>> thermal_zone_bind_cooling_device to fix this.
>>
>> Cc:Zhang Rui <rui.zhang@intel.com>
>> Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Ah I ran into the same problem while testing out some thermal DT stuff.
Reviewed-by: Stephen Boyd <sboyd@codeaurora.org>
--
Qualcomm Innovation Center, Inc. is a member of Code Aurora Forum,
hosted by The Linux Foundation
next prev parent reply other threads:[~2014-06-18 22:17 UTC|newest]
Thread overview: 5+ messages / expand[flat|nested] mbox.gz Atom feed top
2014-06-03 9:59 [PATCH] thermal: Bind cooling devices with the correct arguments Punit Agrawal
2014-06-17 10:20 ` Punit Agrawal
2014-06-18 22:17 ` Stephen Boyd [this message]
2014-06-24 10:43 ` Punit Agrawal
2014-07-02 11:54 ` edubezval
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