From mboxrd@z Thu Jan 1 00:00:00 1970 From: Daniel Lezcano Subject: Re: [PATCH 8/8] thermal/drivers/cpu_cooling: Add the combo cpu cooling device Date: Wed, 7 Feb 2018 11:05:13 +0100 Message-ID: <93e62f8b-bba6-96e6-0011-84504041930a@linaro.org> References: <1516721671-16360-1-git-send-email-daniel.lezcano@linaro.org> <1516721671-16360-9-git-send-email-daniel.lezcano@linaro.org> <20180202104259.GA28462@vireshk-i7> <8dadd854-25ac-68aa-aa9f-33ba76a137a4@linaro.org> <20180205041734.GD28462@vireshk-i7> <911804cd-2f1d-a1f7-61a2-6c8b95a88d6b@linaro.org> <20180206042853.GI28462@vireshk-i7> <54081703-c48f-3e07-b79d-3a2831bc28d7@linaro.org> <20180207072606.GO28462@vireshk-i7> Mime-Version: 1.0 Content-Type: text/plain; charset=utf-8 Content-Transfer-Encoding: 8bit Return-path: In-Reply-To: <20180207072606.GO28462@vireshk-i7> Content-Language: en-US Sender: linux-kernel-owner@vger.kernel.org To: Viresh Kumar Cc: edubezval@gmail.com, kevin.wangtao@linaro.org, leo.yan@linaro.org, vincent.guittot@linaro.org, amit.kachhap@gmail.com, linux-kernel@vger.kernel.org, Zhang Rui , Javi Merino , "open list:THERMAL" , daniel.thompson@linaro.org List-Id: linux-pm@vger.kernel.org On 07/02/2018 08:26, Viresh Kumar wrote: > On 06-02-18, 11:48, Daniel Lezcano wrote: >> On 06/02/2018 05:28, Viresh Kumar wrote: > >>> Surely we can do one thing at a time if that's the way we choose to do it. >> >> Easy to say :) >> >> The current code is to introduce the feature without impacting the DT >> bindings in order to keep focused on the thermal mitigation aspect. >> >> There are still a lot of improvements to do after that. You are >> basically asking me to implement the copy-on-write before the memory >> management is complete. > > Perhaps I wasn't clear. What I was trying to say is that we can do "one thing at > a time" if we choose to create a "combo device" (the way you proposed). I am not > trying to force you to solve all the problems in one go :) Oh, ok :) >> Can you give an example? Or your understanding is incorrect or I missed >> the point. > > So I tried to write it down and realized I was assuming that different > cooling-maps can be provided for different cooling strategies > (cpufreq/cpuidle) and obviously that's not the case as its per device. > Not sure if it would be correct to explore the possibility of doing > that. > -- Linaro.org │ Open source software for ARM SoCs Follow Linaro: Facebook | Twitter | Blog