Re: [PATCH v4 0/3] Dynamic power model from device tree

[Punit Agrawal <punit.agrawal@arm.com>]

Viresh Kumar <viresh.kumar@linaro.org> writes:

> On Tue, Nov 17, 2015 at 1:00 AM, Punit Agrawal <punit.agrawal@arm.com> wrote:
>> Hi,
>>
>> This patchset adds support to build a single-coefficient dynamic power
>> model for a CPU. The model is used by the CPU cooling device to
>> provide an estimate of power consumption and also translate allocated
>> power to performance cap.
>>
>> Changes from previous posting -
>>
>> v3 -> v4:
>> arm_big_little: Migrated to using static arrays
>> arm_big_little: Updated Kconfig to support building thermal as module
>>
>> Patch 1 extends the CPU nodes binding to provide an optional dynamic
>> power coefficient which can be used to create a dynamic power model
>> for the CPUs. This model is used to constrain device power consumption
>> (using power_allocator governor) when the system is thermally
>> constrained.
>>
>> Patches 2-3 extends the cpufreq-dt and arm_big_little driver to
>> register cpu cooling devices with the dynamic coefficient when
>> provided.
>>
>> The patches were previously posted at [0][1][2]. Mediatek platform
>> 8173 builds on these bindings to build the power model.
>>
>> If there are no objections, I'd appreciate Acks from device tree
>> bindings maintainers.
>
> You forgot to cc cpufreq maintainers for this and there are good chances
> that I may completely miss the series some times..

Yikes! I'll make sure to include both Rafael and you for future
postings.

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