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From: Daniel Lezcano <daniel.lezcano@linaro.org>
To: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Cc: linux-pm@vger.kernel.org, thierry.reding@gmail.com,
	Amit Kucheria <amitk@kernel.org>, Zhang Rui <rui.zhang@intel.com>,
	Jernej Skrabec <jernej.skrabec@gmail.com>,
	Baolin Wang <baolin.wang@linux.alibaba.com>,
	AngeloGioacchino Del Regno 
	<angelogioacchino.delregno@collabora.com>,
	"Lee, Chun-Yi" <joeyli.kernel@gmail.com>,
	ye xingchen <ye.xingchen@zte.com.cn>,
	open list <linux-kernel@vger.kernel.org>,
	rafael@kernel.org
Subject: Re: [PATCH 5/8] thermal/drivers/int3400: Use thermal zone device wrappers
Date: Mon, 3 Jul 2023 12:49:42 +0200	[thread overview]
Message-ID: <ab892878-9c66-f94f-cf4c-9961723411d2@linaro.org> (raw)
In-Reply-To: <20230525140135.3589917-6-daniel.lezcano@linaro.org>


Hi Srinivas,

do you agree with the changes in patches 5 and 6 ?

Thanks

   -- Daniel


On 25/05/2023 16:01, Daniel Lezcano wrote:
> The driver is accessing the thermal zone device structure but the
> accessors are already existing and we want to consolidate the thermal
> core code by preventing accesses to the internals from the drivers.
> 
> Let's use these accessors.
> 
> On the other side, the code is getting directly the temperature from
> tz->temperature, but the temperature is a faked on, so we can replace
> this access by the fake temp and remove the thermal zone device
> structure access.
> 
> Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
> ---
>   .../thermal/intel/int340x_thermal/int3400_thermal.c  | 12 ++++++++----
>   1 file changed, 8 insertions(+), 4 deletions(-)
> 
> diff --git a/drivers/thermal/intel/int340x_thermal/int3400_thermal.c b/drivers/thermal/intel/int340x_thermal/int3400_thermal.c
> index 810231b59dcd..66e34241b33a 100644
> --- a/drivers/thermal/intel/int340x_thermal/int3400_thermal.c
> +++ b/drivers/thermal/intel/int340x_thermal/int3400_thermal.c
> @@ -15,6 +15,7 @@
>   #define INT3400_THERMAL_TABLE_CHANGED 0x83
>   #define INT3400_ODVP_CHANGED 0x88
>   #define INT3400_KEEP_ALIVE 0xA0
> +#define INT3400_FAKE_TEMP (20 * 1000) /* faked temp sensor with 20C */
>   
>   enum int3400_thermal_uuid {
>   	INT3400_THERMAL_ACTIVE = 0,
> @@ -453,6 +454,7 @@ static void int3400_notify(acpi_handle handle,
>   			void *data)
>   {
>   	struct int3400_thermal_priv *priv = data;
> +	struct device *dev;
>   	char *thermal_prop[5];
>   	int therm_event;
>   
> @@ -475,12 +477,14 @@ static void int3400_notify(acpi_handle handle,
>   		return;
>   	}
>   
> -	thermal_prop[0] = kasprintf(GFP_KERNEL, "NAME=%s", priv->thermal->type);
> -	thermal_prop[1] = kasprintf(GFP_KERNEL, "TEMP=%d", priv->thermal->temperature);
> +	dev = thermal_zone_device(priv->thermal);
> +	
> +	thermal_prop[0] = kasprintf(GFP_KERNEL, "NAME=%s", thermal_zone_device_type(priv->thermal));
> +	thermal_prop[1] = kasprintf(GFP_KERNEL, "TEMP=%d", INT3400_FAKE_TEMP);
>   	thermal_prop[2] = kasprintf(GFP_KERNEL, "TRIP=");
>   	thermal_prop[3] = kasprintf(GFP_KERNEL, "EVENT=%d", therm_event);
>   	thermal_prop[4] = NULL;
> -	kobject_uevent_env(&priv->thermal->device.kobj, KOBJ_CHANGE, thermal_prop);
> +	kobject_uevent_env(&dev->kobj, KOBJ_CHANGE, thermal_prop);
>   	kfree(thermal_prop[0]);
>   	kfree(thermal_prop[1]);
>   	kfree(thermal_prop[2]);
> @@ -490,7 +494,7 @@ static void int3400_notify(acpi_handle handle,
>   static int int3400_thermal_get_temp(struct thermal_zone_device *thermal,
>   			int *temp)
>   {
> -	*temp = 20 * 1000; /* faked temp sensor with 20C */
> +	*temp = INT3400_FAKE_TEMP;
>   	return 0;
>   }
>   

-- 
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  reply	other threads:[~2023-07-03 10:49 UTC|newest]

Thread overview: 23+ messages / expand[flat|nested]  mbox.gz  Atom feed  top
2023-05-25 14:01 [PATCH 0/8] Finish thermal zone structure encapsulation Daniel Lezcano
2023-05-25 14:01 ` [PATCH 1/8] net/mlx5: Update the driver with the recent thermal changes Daniel Lezcano
2023-05-26  9:20   ` Simon Horman
2023-05-31 22:10   ` Saeed Mahameed
2023-06-07 13:17     ` Daniel Lezcano
2023-05-25 14:01 ` [PATCH 2/8] thermal/core: Hardening the self-encapsulation Daniel Lezcano
2023-05-25 14:01 ` [PATCH 3/8] thermal/core: Reorder the headers inclusion Daniel Lezcano
2023-05-25 14:01 ` [PATCH 4/8] thermal/core: Update the generic trip points Daniel Lezcano
2023-06-20 11:28   ` Rafael J. Wysocki
2023-06-20 18:35     ` Daniel Lezcano
2023-06-23 17:59       ` Rafael J. Wysocki
2023-06-25 20:29   ` Rafael J. Wysocki
2023-05-25 14:01 ` [PATCH 5/8] thermal/drivers/int3400: Use thermal zone device wrappers Daniel Lezcano
2023-07-03 10:49   ` Daniel Lezcano [this message]
2023-07-03 16:15     ` srinivas pandruvada
2023-07-05 10:41       ` Daniel Lezcano
2023-07-05 11:35         ` srinivas pandruvada
2023-07-05 11:49           ` Daniel Lezcano
2023-05-25 14:01 ` [PATCH 6/8] thermal/drivers/int340x: Do not check the thermal zone state Daniel Lezcano
2023-05-25 14:01 ` [PATCH 7/8] thermal/drivers/int340x: Use thermal zone device trip update Daniel Lezcano
2023-05-25 14:01 ` [PATCH 8/8] thermal/core: Move the thermal zone structure to the private core header Daniel Lezcano
2023-06-13 14:12 ` [PATCH 0/8] Finish thermal zone structure encapsulation Daniel Lezcano
2023-06-20 10:54   ` Rafael J. Wysocki

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