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[2.99.112.229]) by smtp.gmail.com with ESMTPSA id z20-20020a7bc7d4000000b0040640073d25sm5586923wmk.16.2023.10.01.10.26.16 (version=TLS1_3 cipher=TLS_AES_128_GCM_SHA256 bits=128/128); Sun, 01 Oct 2023 10:26:17 -0700 (PDT) Message-ID: Date: Sun, 1 Oct 2023 18:26:14 +0100 MIME-Version: 1.0 User-Agent: Mozilla Thunderbird Subject: Re: [PATCH 0/4] thermal: Introduce Qualcomm Thermal Mitigation Device support Content-Language: en-US To: Manivannan Sadhasivam Cc: Andy Gross , Bhupesh Sharma , Bjorn Andersson , Konrad Dybcio , Mathieu Poirier , Rob Herring , Krzysztof Kozlowski , Conor Dooley , "Rafael J. Wysocki" , Daniel Lezcano , Amit Kucheria , Zhang Rui , Sibi Sankar , Thara Gopinath , linux-arm-msm@vger.kernel.org, linux-remoteproc@vger.kernel.org, devicetree@vger.kernel.org, linux-pm@vger.kernel.org References: <20230905-caleb-qmi_cooling-v1-0-5aa39d4164a7@linaro.org> <20231001155701.GA53767@thinkpad> From: Caleb Connolly In-Reply-To: <20231001155701.GA53767@thinkpad> Content-Type: text/plain; charset=UTF-8; format=flowed Content-Transfer-Encoding: 7bit Precedence: bulk List-ID: X-Mailing-List: linux-pm@vger.kernel.org On 01/10/2023 16:57, Manivannan Sadhasivam wrote: > On Fri, Sep 29, 2023 at 05:16:16PM +0100, Caleb Connolly wrote: >> The Thermal Mitigation Device (TMD) Service is a QMI service that runs >> on remote subsystems (the modem and DSPs) on Qualcomm SoCs. >> It exposes various mitigations including passive thermal controls and >> rail voltage restrictions. >> >> This series introduces support for exposing TMDs as cooling devices >> in the kernel through the thermal framework, using the QMI interface. >> >> Each TMD client is described as a child of the remoteproc node in >> devicetree. With subnodes for each control. >> > > Daniel expressed concerns in the past aganist representing TMD driver as a > cooling device since it is not tied to thermal zones and the governors cannot > use it. Instead he suggested to represent it as a powercap device with thermal > constraints. Hi Mani, Forgive me as I'm not yet super familiar with the thermal subsystem. As I understand it, the DT layout here enables each control to be referenced under the thermal zones, at least this is the approach taken in CAF 4.9. Maybe I don't quite understand what you mean, are you saying that using thermal zones is the wrong approach? > > So please look into that approach. Any recommended reading? Or drivers I can use as a reference? Thanks > > - Mani > >> This series is based on previous work by Bhupesh Sharma which can be >> found at [1]. I'm sending this as a fresh series as it has been a >> year since the original version and I have rewritten most of the driver. >> >> [1]: https://lore.kernel.org/linux-arm-msm/20220912085049.3517140-1-bhupesh.sharma@linaro.org/ >> >> --- >> Caleb Connolly (4): >> remoteproc: qcom: probe all child devices >> dt-bindings: thermal: Add qcom,qmi-cooling yaml bindings >> thermal: qcom: add qmi-cooling driver >> MAINTAINERS: Add entry for Qualcomm Cooling Driver >> >> .../bindings/remoteproc/qcom,msm8996-mss-pil.yaml | 13 + >> .../bindings/remoteproc/qcom,pas-common.yaml | 6 + >> .../bindings/thermal/qcom,qmi-cooling.yaml | 168 +++++++ >> MAINTAINERS | 8 + >> drivers/remoteproc/qcom_q6v5.c | 4 + >> drivers/remoteproc/qcom_q6v5_mss.c | 8 - >> drivers/thermal/qcom/Kconfig | 13 + >> drivers/thermal/qcom/Makefile | 1 + >> drivers/thermal/qcom/qmi-cooling.c | 520 +++++++++++++++++++++ >> drivers/thermal/qcom/qmi-cooling.h | 428 +++++++++++++++++ >> 10 files changed, 1161 insertions(+), 8 deletions(-) >> --- >> base-commit: 9067f80db58bbce81d5f0703aa2fd261e88bc812 >> >> // Caleb (they/them) >> > -- // Caleb (they/them)