From mboxrd@z Thu Jan 1 00:00:00 1970 From: "Wangtao (Kevin, Kirin)" Subject: Re: [PATCH v3 1/3] dt-bindings: Document the hi3660 thermal sensor bindings Date: Mon, 21 Aug 2017 10:17:48 +0800 Message-ID: References: <1498102923-68481-1-git-send-email-kevin.wangtao@hisilicon.com> <1502353935-92924-1-git-send-email-kevin.wangtao@hisilicon.com> <1502353935-92924-2-git-send-email-kevin.wangtao@hisilicon.com> <20170817141517.izhteflvfwtoovqv@rob-hp-laptop> Mime-Version: 1.0 Content-Type: text/plain; charset="gbk"; format=flowed Content-Transfer-Encoding: 8bit Return-path: Received: from szxga05-in.huawei.com ([45.249.212.191]:4084 "EHLO szxga05-in.huawei.com" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S1753467AbdHUCSR (ORCPT ); Sun, 20 Aug 2017 22:18:17 -0400 In-Reply-To: <20170817141517.izhteflvfwtoovqv@rob-hp-laptop> Sender: linux-pm-owner@vger.kernel.org List-Id: linux-pm@vger.kernel.org To: Rob Herring Cc: rui.zhang@intel.com, edubezval@gmail.com, xuwei5@hisilicon.com, mark.rutland@arm.com, catalin.marinas@arm.com, will.deacon@arm.com, leo.yan@linaro.org, kevin.wangtao@linaro.org, linux-arm-kernel@lists.infradead.org, devicetree@vger.kernel.org, linux-kernel@vger.kernel.org, linux-pm@vger.kernel.org, sunzhaosheng@hisilicon.com ÔÚ 2017/8/17 23:10, Rob Herring дµÀ: > On Thu, Aug 10, 2017 at 04:32:13PM +0800, Tao Wang wrote: >> From: Tao Wang >> >> This adds documentation of device tree bindings for the >> thermal sensor controller of hi3660 SoC. >> >> Signed-off-by: Tao Wang >> --- >> .../devicetree/bindings/thermal/hisi-tsensor.txt | 23 ++++++++++++++++++++++ >> 1 file changed, 23 insertions(+) >> create mode 100644 Documentation/devicetree/bindings/thermal/hisi-tsensor.txt >> >> diff --git a/Documentation/devicetree/bindings/thermal/hisi-tsensor.txt b/Documentation/devicetree/bindings/thermal/hisi-tsensor.txt >> new file mode 100644 >> index 0000000..2ab0eb9 >> --- /dev/null >> +++ b/Documentation/devicetree/bindings/thermal/hisi-tsensor.txt >> @@ -0,0 +1,23 @@ >> +* Temperature Sensor on hisilicon SoC >> + >> +** Required properties : >> + >> +- compatible: "hisilicon,thermal-tsensor". > > Needs an SoC specific compatible. OK > >> +- reg: physical base address of thermal sensor and length of memory mapped >> + region. >> +- offset: reg offset of each sensor. > > Should be implied by the compatible. Do you mean that the reg offset should not in dts? > >> +- coefficients: An array of integers (one signed cell) containing >> + coefficients to turn adc value to temperture. > > Needs a vendor prefix. OK > >> +- hisi,adc-range: adc value range, minimum value is followed by maximum value. >> +- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description. >> + >> +Example : >> + >> +tsensor: tsensor@FFF3000 { >> + compatible = "hisilicon,tsensor"; >> + reg = <0x0 0xfff30000 0x0 0x1000>; >> + offset = <0x1c 0x5c 0x9c>; >> + coefficients = <165000 (-40000)>; >> + hisi,adc-range = <0x74 0x39A>; >> + #thermal-sensor-cells = <1>; >> +}; >> -- >> 2.8.1 >> >> -- >> To unsubscribe from this list: send the line "unsubscribe devicetree" in >> the body of a message to majordomo@vger.kernel.org >> More majordomo info at http://vger.kernel.org/majordomo-info.html > > . >