From: Konrad Dybcio <konrad.dybcio@linaro.org>
To: Caleb Connolly <caleb.connolly@linaro.org>,
Andy Gross <agross@kernel.org>,
Bhupesh Sharma <bhupesh.linux@gmail.com>,
Bjorn Andersson <andersson@kernel.org>,
Mathieu Poirier <mathieu.poirier@linaro.org>,
Rob Herring <robh+dt@kernel.org>,
Krzysztof Kozlowski <krzysztof.kozlowski+dt@linaro.org>,
Conor Dooley <conor+dt@kernel.org>,
"Rafael J. Wysocki" <rafael@kernel.org>,
Daniel Lezcano <daniel.lezcano@linaro.org>,
Amit Kucheria <amitk@kernel.org>, Zhang Rui <rui.zhang@intel.com>,
Sibi Sankar <quic_sibis@quicinc.com>,
Manivannan Sadhasivam <mani@kernel.org>,
Thara Gopinath <thara.gopinath@gmail.com>
Cc: linux-arm-msm@vger.kernel.org, linux-remoteproc@vger.kernel.org,
devicetree@vger.kernel.org, linux-pm@vger.kernel.org
Subject: Re: [PATCH 0/4] thermal: Introduce Qualcomm Thermal Mitigation Device support
Date: Fri, 29 Sep 2023 19:17:01 +0200 [thread overview]
Message-ID: <30066188-3787-4277-914e-e06c95fe2e1c@linaro.org> (raw)
In-Reply-To: <20230905-caleb-qmi_cooling-v1-0-5aa39d4164a7@linaro.org>
On 29.09.2023 18:16, Caleb Connolly wrote:
> The Thermal Mitigation Device (TMD) Service is a QMI service that runs
> on remote subsystems (the modem and DSPs) on Qualcomm SoCs.
> It exposes various mitigations including passive thermal controls and
> rail voltage restrictions.
>
> This series introduces support for exposing TMDs as cooling devices
> in the kernel through the thermal framework, using the QMI interface.
>
> Each TMD client is described as a child of the remoteproc node in
> devicetree. With subnodes for each control.
>
> This series is based on previous work by Bhupesh Sharma which can be
> found at [1]. I'm sending this as a fresh series as it has been a
> year since the original version and I have rewritten most of the driver.
>
Since you're adding support for funky hw, it would be appreciated
if you also linked to a tree that has the dt bits hooked up, the
schema example may not tell the whole story
Konrad
next prev parent reply other threads:[~2023-09-29 17:17 UTC|newest]
Thread overview: 24+ messages / expand[flat|nested] mbox.gz Atom feed top
2023-09-29 16:16 [PATCH 0/4] thermal: Introduce Qualcomm Thermal Mitigation Device support Caleb Connolly
2023-09-29 16:16 ` [PATCH 1/4] remoteproc: qcom: probe all child devices Caleb Connolly
2023-09-29 16:16 ` [PATCH 2/4] dt-bindings: thermal: Add qcom,qmi-cooling yaml bindings Caleb Connolly
2023-09-29 17:15 ` Rob Herring
2023-11-07 3:55 ` Bjorn Andersson
2023-09-29 16:16 ` [PATCH 3/4] thermal: qcom: add qmi-cooling driver Caleb Connolly
2023-09-29 16:28 ` Konrad Dybcio
2023-09-29 16:56 ` Caleb Connolly
2023-10-16 21:10 ` Daniel Lezcano
2023-09-29 16:16 ` [PATCH 4/4] MAINTAINERS: Add entry for Qualcomm Cooling Driver Caleb Connolly
2023-09-29 17:17 ` Konrad Dybcio [this message]
2023-09-29 18:27 ` [PATCH 0/4] thermal: Introduce Qualcomm Thermal Mitigation Device support Caleb Connolly
2023-10-01 15:57 ` Manivannan Sadhasivam
2023-10-01 17:26 ` Caleb Connolly
2023-10-02 14:52 ` Manivannan Sadhasivam
2023-10-02 15:00 ` Dmitry Baryshkov
2023-10-02 15:14 ` Caleb Connolly
2023-10-02 15:58 ` Manivannan Sadhasivam
2023-10-02 16:00 ` Dmitry Baryshkov
2023-10-02 16:13 ` Manivannan Sadhasivam
2023-10-02 16:28 ` Neil Armstrong
2023-10-05 2:36 ` Bjorn Andersson
2023-10-10 12:24 ` Manivannan Sadhasivam
2023-10-05 2:52 ` Bjorn Andersson
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