From: <Tudor.Ambarus@microchip.com>
To: <prabhakar.mahadev-lad.rj@bp.renesas.com>,
<miquel.raynal@bootlin.com>, <richard@nod.at>, <vigneshr@ti.com>,
<linux-mtd@lists.infradead.org>,
<linux-renesas-soc@vger.kernel.org>
Cc: <linux-kernel@vger.kernel.org>, <prabhakar.csengg@gmail.com>,
<biju.das.jz@bp.renesas.com>
Subject: Re: [PATCH] mtd: spi-nor: winbond: Add support for w25m512jw
Date: Mon, 7 Dec 2020 17:26:57 +0000 [thread overview]
Message-ID: <482d020e-bb1a-cf00-3f05-2bf26694ec16@microchip.com> (raw)
In-Reply-To: <20201016115549.31369-1-prabhakar.mahadev-lad.rj@bp.renesas.com>
Hi, Lad,
On 10/16/20 2:55 PM, Lad Prabhakar wrote:
> EXTERNAL EMAIL: Do not click links or open attachments unless you know the content is safe
>
> This chip is (nearly) identical to the Winbond w25m512jv which is
> already supported by Linux. Compared to the w25m512jv, the 'jw'
> has a different JEDEC ID.
W25M512JW-IQ (2 x 256M-bit) Serial MCP (Multi Chip Package) Flash memory,
introduces a new “Software Die Select (C2h)” instruction, which we don't
support. I guess you can't access the second die with what we have in
mainline. Or am I wrong? We'll need to add support for multi-die support
if we want to add new multi-die flashes.
ta
next prev parent reply other threads:[~2020-12-07 17:28 UTC|newest]
Thread overview: 6+ messages / expand[flat|nested] mbox.gz Atom feed top
2020-10-16 11:55 [PATCH] mtd: spi-nor: winbond: Add support for w25m512jw Lad Prabhakar
2020-10-22 13:14 ` Geert Uytterhoeven
2020-11-10 12:58 ` Vignesh Raghavendra
2020-11-10 14:10 ` Lad, Prabhakar
2020-12-07 17:26 ` Tudor.Ambarus [this message]
2020-12-08 10:40 ` Lad, Prabhakar
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