From: Dragan Simic <dsimic@manjaro.org>
To: Alexey Charkov <alchark@gmail.com>
Cc: "Rob Herring" <robh+dt@kernel.org>,
"Krzysztof Kozlowski" <krzysztof.kozlowski+dt@linaro.org>,
"Conor Dooley" <conor+dt@kernel.org>,
"Heiko Stuebner" <heiko@sntech.de>,
"Sebastian Reichel" <sebastian.reichel@collabora.com>,
"Cristian Ciocaltea" <cristian.ciocaltea@collabora.com>,
"Christopher Obbard" <chris.obbard@collabora.com>,
"Tamás Szűcs" <szucst@iit.uni-miskolc.hu>,
"Shreeya Patel" <shreeya.patel@collabora.com>,
"Kever Yang" <kever.yang@rock-chips.com>,
"Jagan Teki" <jagan@edgeble.ai>,
"Chris Morgan" <macromorgan@hotmail.com>,
devicetree@vger.kernel.org, linux-arm-kernel@lists.infradead.org,
linux-rockchip@lists.infradead.org, linux-kernel@vger.kernel.org
Subject: Re: [PATCH v2] arm64: dts: rockchip: enable built-in thermal monitoring on rk3588
Date: Thu, 18 Jan 2024 20:20:28 +0100 [thread overview]
Message-ID: <121f6c6f65efcca3ad6dbe5264563561@manjaro.org> (raw)
In-Reply-To: <20240109192608.5981-1-alchark@gmail.com>
On 2024-01-09 20:19, Alexey Charkov wrote:
> Include thermal zones information in device tree for rk3588 variants
> and enable the built-in thermal sensing ADC on RADXA Rock 5B
>
> Signed-off-by: Alexey Charkov <alchark@gmail.com>
> ---
> Changes in v2:
> - Dropped redundant comments
> - Included all CPU cores in cooling maps
> - Split cooling maps into more granular ones utilizing TSADC
> channels 1-3 which measure temperature by separate CPU clusters
> instead of channel 0 which measures the center of the SoC die
> ---
> .../boot/dts/rockchip/rk3588-rock-5b.dts | 4 +
> arch/arm64/boot/dts/rockchip/rk3588s.dtsi | 151 ++++++++++++++++++
> 2 files changed, 155 insertions(+)
>
> diff --git a/arch/arm64/boot/dts/rockchip/rk3588-rock-5b.dts
> b/arch/arm64/boot/dts/rockchip/rk3588-rock-5b.dts
> index a5a104131403..f9d540000de3 100644
> --- a/arch/arm64/boot/dts/rockchip/rk3588-rock-5b.dts
> +++ b/arch/arm64/boot/dts/rockchip/rk3588-rock-5b.dts
> @@ -772,3 +772,7 @@ &usb_host1_ehci {
> &usb_host1_ohci {
> status = "okay";
> };
> +
> +&tsadc {
> + status = "okay";
> +};
I keep forgetting to note that enabling it for the Rock 5B should
be performed in a separate patch.
> diff --git a/arch/arm64/boot/dts/rockchip/rk3588s.dtsi
> b/arch/arm64/boot/dts/rockchip/rk3588s.dtsi
> index 8aa0499f9b03..8d54998d0ecc 100644
> --- a/arch/arm64/boot/dts/rockchip/rk3588s.dtsi
> +++ b/arch/arm64/boot/dts/rockchip/rk3588s.dtsi
> @@ -10,6 +10,7 @@
> #include <dt-bindings/reset/rockchip,rk3588-cru.h>
> #include <dt-bindings/phy/phy.h>
> #include <dt-bindings/ata/ahci.h>
> +#include <dt-bindings/thermal/thermal.h>
>
> / {
> compatible = "rockchip,rk3588";
> @@ -2112,6 +2113,156 @@ tsadc: tsadc@fec00000 {
> status = "disabled";
> };
>
> + thermal_zones: thermal-zones {
> + /* sensor near the center of the whole chip */
> + soc_thermal: soc-thermal {
> + polling-delay-passive = <20>;
> + polling-delay = <1000>;
> + sustainable-power = <2100>;
> + thermal-sensors = <&tsadc 0>;
> +
> + trips {
> + soc_crit: soc-crit {
> + temperature = <115000>;
> + hysteresis = <2000>;
> + type = "critical";
> + };
> + };
> + };
As already noted in my previous response, perhaps it whould be
better to name it package_thermal instead. That way, it should
be more self descriptive.
> + /* sensor between A76 cores 0 and 1 */
> + bigcore0_thermal: bigcore0-thermal {
> + polling-delay-passive = <20>;
> + polling-delay = <1000>;
> + thermal-sensors = <&tsadc 1>;
> +
> + trips {
> + bigcore0_alert: bigcore0-alert {
> + temperature = <85000>;
> + hysteresis = <2000>;
> + type = "passive";
> + };
> + bigcore0_crit: bigcore0-crit {
> + temperature = <115000>;
> + hysteresis = <2000>;
> + type = "critical";
> + };
> + };
As already noted in my previous message, perhaps another trip,
of the "hot" type, should be added here.
> + cooling-maps {
> + map0 {
> + trip = <&bigcore0_alert>;
> + cooling-device =
> + <&cpu_b0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>,
> + <&cpu_b1 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
> + contribution = <1024>;
> + };
> + };
> + };
> +
> + /* sensor between A76 cores 2 and 3 */
> + bigcore2_thermal: bigcore2-thermal {
> + polling-delay-passive = <20>;
> + polling-delay = <1000>;
> + thermal-sensors = <&tsadc 2>;
> +
> + trips {
> + bigcore2_alert: bigcore2-alert {
> + temperature = <85000>;
> + hysteresis = <2000>;
> + type = "passive";
> + };
> + bigcore2_crit: bigcore2-crit {
> + temperature = <115000>;
> + hysteresis = <2000>;
> + type = "critical";
> + };
> + };
The same suggestion about one more "hot" trip applies here as well.
> + cooling-maps {
> + map1 {
> + trip = <&bigcore2_alert>;
> + cooling-device =
> + <&cpu_b2 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>,
> + <&cpu_b3 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
> + contribution = <1024>;
> + };
> + };
> + };
> +
> + /* sensor between the four A55 cores */
> + little_core_thermal: littlecore-thermal {
> + polling-delay-passive = <20>;
> + polling-delay = <1000>;
> + thermal-sensors = <&tsadc 3>;
> +
> + trips {
> + littlecore_alert: littlecore-alert {
> + temperature = <85000>;
> + hysteresis = <2000>;
> + type = "passive";
> + };
> + littlecore_crit: littlecore-crit {
> + temperature = <115000>;
> + hysteresis = <2000>;
> + type = "critical";
> + };
> + };
The same suggestion about one more "hot" trip applies here as well.
> + cooling-maps {
> + map2 {
> + trip = <&littlecore_alert>;
> + cooling-device =
> + <&cpu_l0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>,
> + <&cpu_l1 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>,
> + <&cpu_l2 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>,
> + <&cpu_l3 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
> + contribution = <1024>;
> + };
> + };
> + };
> +
> + /* sensor near the PD_CENTER power domain */
> + center_thermal: center-thermal {
> + polling-delay-passive = <20>;
> + polling-delay = <1000>;
> + thermal-sensors = <&tsadc 4>;
> +
> + trips {
> + center_crit: center-crit {
> + temperature = <115000>;
> + hysteresis = <2000>;
> + type = "critical";
> + };
> + };
> + };
> +
> + gpu_thermal: gpu-thermal {
> + polling-delay-passive = <20>;
> + polling-delay = <1000>;
> + thermal-sensors = <&tsadc 5>;
> +
> + trips {
> + gpu_crit: gpu-crit {
> + temperature = <115000>;
> + hysteresis = <2000>;
> + type = "critical";
> + };
> + };
> + };
> +
> + npu_thermal: npu-thermal {
> + polling-delay-passive = <20>;
> + polling-delay = <1000>;
> + thermal-sensors = <&tsadc 6>;
> +
> + trips {
> + npu_crit: npu-crit {
> + temperature = <115000>;
> + hysteresis = <2000>;
> + type = "critical";
> + };
> + };
> + };
> + };
> +
> saradc: adc@fec10000 {
> compatible = "rockchip,rk3588-saradc";
> reg = <0x0 0xfec10000 0x0 0x10000>;
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next prev parent reply other threads:[~2024-01-18 19:20 UTC|newest]
Thread overview: 21+ messages / expand[flat|nested] mbox.gz Atom feed top
2024-01-06 22:23 [PATCH] arm64: dts: rockchip: enable built-in thermal monitoring on rk3588 Alexey Charkov
2024-01-06 22:54 ` Dragan Simic
2024-01-08 13:41 ` Alexey Charkov
2024-01-18 18:48 ` Dragan Simic
2024-01-21 18:56 ` Alexey Charkov
2024-01-22 4:55 ` Dragan Simic
2024-01-22 6:03 ` Alexey Charkov
2024-01-22 6:22 ` Dragan Simic
2024-01-22 7:36 ` Alexey Charkov
2024-01-22 7:57 ` Dragan Simic
2024-01-22 14:20 ` Alexey Charkov
2024-01-22 17:33 ` Dragan Simic
2024-01-09 19:19 ` [PATCH v2] " Alexey Charkov
2024-01-18 19:20 ` Dragan Simic [this message]
2024-01-19 13:15 ` Heiko Stübner
2024-01-19 16:21 ` Daniel Lezcano
2024-01-21 19:57 ` Alexey Charkov
2024-01-22 0:04 ` Daniel Lezcano
2024-01-22 5:57 ` Alexey Charkov
2024-01-23 19:47 ` Alexey Charkov
2024-01-24 0:14 ` Daniel Lezcano
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