From: Hsun Lai <i@chainsx.cn>
To: robh@kernel.org, krzk+dt@kernel.org, conor+dt@kernel.org
Cc: andrew@lunn.ch, inindev@gmail.com, heiko@sntech.de,
jonas@kwiboo.se, quentin.schulz@cherry.de,
linux-kernel@vger.kernel.org, linux-rockchip@lists.infradead.org,
krzysztof.kozlowski@linaro.org, devicetree@vger.kernel.org,
i@chainsx.cn, sfr@canb.auug.org.au,
linux-arm-kernel@lists.infradead.org
Subject: [PATCH v3 1/3] dt-bindings: vendor-prefixes: Add SakuraPi prefix
Date: Mon, 19 May 2025 16:56:12 +0800 [thread overview]
Message-ID: <20250519085614.2245892-2-i@chainsx.cn> (raw)
In-Reply-To: <20250519085614.2245892-1-i@chainsx.cn>
Add vendor prefix for SakuraPi.org, which produces
development boards like the SakuraPi-RK3308B.
Signed-off-by: Hsun Lai <i@chainsx.cn>
---
(no changes since v1)
Documentation/devicetree/bindings/vendor-prefixes.yaml | 2 ++
1 file changed, 2 insertions(+)
diff --git a/Documentation/devicetree/bindings/vendor-prefixes.yaml b/Documentation/devicetree/bindings/vendor-prefixes.yaml
index 3e7450c3f..744d01a76 100644
--- a/Documentation/devicetree/bindings/vendor-prefixes.yaml
+++ b/Documentation/devicetree/bindings/vendor-prefixes.yaml
@@ -1299,6 +1299,8 @@ patternProperties:
"^rve,.*":
description: Recharge Véhicule Électrique (RVE) inc.
"^saef,.*":
+ description: SakuraPi.org
+ "^sakurapi,.*":
description: Saef Technology Limited
"^samsung,.*":
description: Samsung Semiconductor
--
2.34.1
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next prev parent reply other threads:[~2025-05-19 8:56 UTC|newest]
Thread overview: 6+ messages / expand[flat|nested] mbox.gz Atom feed top
2025-05-19 8:56 [PATCH v3 0/3] Add support for Sakura Pi RK3308B Hsun Lai
2025-05-19 8:56 ` Hsun Lai [this message]
2025-05-19 9:31 ` [PATCH v3 1/3] dt-bindings: vendor-prefixes: Add SakuraPi prefix Krzysztof Kozlowski
2025-05-20 2:00 ` [v3,1/3] " Hsun Lai
2025-05-19 8:56 ` [PATCH v3 2/3] dt-bindings: arm: rockchip: Add Sakura Pi RK3308B Hsun Lai
2025-05-19 8:56 ` [PATCH v3 3/3] arm64: dts: rockchip: add DTs for " Hsun Lai
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