From: "Heiko Stübner" <heiko@sntech.de>
To: Sebastian Reichel <sebastian.reichel@collabora.com>
Cc: Ye Zhang <ye.zhang@rock-chips.com>, Rob Herring <robh@kernel.org>,
Conor Dooley <conor+dt@kernel.org>,
"Rafael J. Wysocki" <rafael@kernel.org>,
devicetree@vger.kernel.org, linux-pm@vger.kernel.org,
Daniel Lezcano <daniel.lezcano@linaro.org>,
linux-kernel@vger.kernel.org, linux-rockchip@lists.infradead.org,
Jonas Karlman <jonas@kwiboo.se>,
Alexey Charkov <alchark@gmail.com>,
linux-arm-kernel@lists.infradead.org,
Krzysztof Kozlowski <krzk+dt@kernel.org>,
Zhang Rui <rui.zhang@intel.com>,
kernel@collabora.com, Lukasz Luba <lukasz.luba@arm.com>
Subject: Re: [PATCH v6 0/7] RK3576 thermal sensor support, including OTP trim adjustments
Date: Thu, 31 Jul 2025 15:45:47 +0200 [thread overview]
Message-ID: <2664626.Lt9SDvczpP@diego> (raw)
In-Reply-To: <iafobb7h4nphjcujm34gig6vwlzfveegwewpayehb4h3tayzgv@bxpdfmhf2hfa>
Am Donnerstag, 31. Juli 2025, 15:27:03 Mitteleuropäische Sommerzeit schrieb Sebastian Reichel:
> Hi,
>
> On Thu, Jul 31, 2025 at 10:11:23AM +0200, Heiko Stübner wrote:
> > Right now we're in the middle of the merge-window though, so everything
> > I apply now, I'd need to rebase onto -rc1 in slightly more than a week,
> > invalidating all those nice commit hashes that end up in the "applied" mails.
> >
> > So I'm struggling with myself on every merge window about that.
>
> Your are not supposed to merge anything to your for-next branch
> during the merge window anyways. See first sentence of Stephen
> Rothwell's mails [0]:
>
> > Please do not add any v6.18 material to your linux-next included
> > branches until after v6.17-rc1 has been released.
The general idea is just merging but without updating the -next branch,
then after -rc1 rebase + do new -next.
But as you pointed out, this is all cumbersome and doesn't shave off much
from the amount of patches waiting, so as most of the time, I'll just wait
for -rc1 to start clean :-)
>
> [0] https://lore.kernel.org/all/20250731133311.1a3e3867@canb.auug.org.au/
>
> Greetings,
>
> -- Sebastian
>
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next prev parent reply other threads:[~2025-07-31 14:23 UTC|newest]
Thread overview: 21+ messages / expand[flat|nested] mbox.gz Atom feed top
2025-06-10 12:32 [PATCH v6 0/7] RK3576 thermal sensor support, including OTP trim adjustments Nicolas Frattaroli
2025-06-10 12:32 ` [PATCH v6 1/7] thermal: rockchip: rename rk_tsadcv3_tshut_mode Nicolas Frattaroli
2025-07-10 11:16 ` Heiko Stuebner
2025-06-10 12:32 ` [PATCH v6 2/7] dt-bindings: rockchip-thermal: Add RK3576 compatible Nicolas Frattaroli
2025-07-10 11:17 ` Heiko Stuebner
2025-06-10 12:32 ` [PATCH v6 3/7] thermal: rockchip: Support RK3576 SoC in the thermal driver Nicolas Frattaroli
2025-07-10 11:18 ` Heiko Stuebner
2025-06-10 12:32 ` [PATCH v6 4/7] dt-bindings: thermal: rockchip: document otp thermal trim Nicolas Frattaroli
2025-07-10 11:21 ` Heiko Stuebner
2025-07-10 19:30 ` Nicolas Frattaroli
2025-06-10 12:32 ` [PATCH v6 5/7] thermal: rockchip: support reading trim values from OTP Nicolas Frattaroli
2025-06-10 12:32 ` [PATCH v6 6/7] arm64: dts: rockchip: Add thermal nodes to RK3576 Nicolas Frattaroli
2025-06-10 12:32 ` [PATCH v6 7/7] arm64: dts: rockchip: Add thermal trim OTP and tsadc nodes Nicolas Frattaroli
2025-07-16 20:12 ` [PATCH v6 0/7] RK3576 thermal sensor support, including OTP trim adjustments Daniel Lezcano
2025-07-17 7:21 ` Heiko Stübner
2025-07-17 8:20 ` Daniel Lezcano
2025-07-31 7:33 ` Alexey Charkov
2025-07-31 8:11 ` Heiko Stübner
2025-07-31 13:27 ` Sebastian Reichel
2025-07-31 13:45 ` Heiko Stübner [this message]
2025-08-11 7:52 ` (subset) " Heiko Stuebner
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