RE: [PATCH v7 13/22] vfio-iommufd: Split bind/attach into two steps

Tian, Kevin
2023-03-17T01:57:33Z

> From: Liu, Yi L <yi.l.liu@intel.com>
> Sent: Thursday, March 16, 2023 8:55 PM
>
> to align with the coming vfio device cdev support.
>
> Signed-off-by: Yi Liu <yi.l.liu@intel.com>