From mboxrd@z Thu Jan 1 00:00:00 1970 From: Ian Molton Date: Tue, 15 Mar 2011 21:25:03 +0000 Subject: Re: [PATCH 0/6] mmc: split the tmio driver into several modules Message-Id: List-Id: References: In-Reply-To: MIME-Version: 1.0 Content-Type: text/plain; charset="us-ascii" Content-Transfer-Encoding: 7bit To: Guennadi Liakhovetski Cc: linux-sh@vger.kernel.org, linux-mmc@vger.kernel.org, Chris Ball Sounds like a good idea... Its possible that I could implement DMA on the toshiba stuff too, can your code handle this? (I havent had time to read this yet) -- Ian Molton Linux, Automotive, and other hacking: http://www.mnementh.co.uk/ On 11 March 2011 07:51, Guennadi Liakhovetski wrote: > Hi all > > The tmio_mmc SD/SDIO driver is serving very different hardware > configurations: on the one hand multi-function style chips from Toshiba, > Compaq, on the other hand SDHI units in ARM- and SuperH-based sh-mobile > SoCs. Apart from the different native APIs: MFD for the former and > platform-device in the latter, sh-mobile implementations also have a > number of features, exclusive to them, which, if implemented in the common > driver, clutter it needlessly and make its maintenance more difficult. > This patch series simplifies the situation by splitting the driver up into > 3 modules: the core, consisting of the main part and, on sh-mobile, of the > DMA part; the mfd glue; and the platform glue. This way also (imaginary) > sh-mobile systems with additional tmio mfd chips on them can be supported. > > Thanks > Guennadi > --- > Guennadi Liakhovetski, Ph.D. > Freelance Open-Source Software Developer > http://www.open-technology.de/ >