From: Guennadi Liakhovetski <g.liakhovetski@gmx.de>
To: linux-sh@vger.kernel.org
Cc: linux-mmc@vger.kernel.org, Chris Ball <cjb@laptop.org>,
Ian Molton <ian@mnementh.co.uk>,
Magnus Damm <magnus.damm@gmail.com>,
Samuel Ortiz <sameo@linux.intel.com>,
Paul Mundt <lethal@linux-sh.org>
Subject: [PATCH 0/6 v2] mmc: split the tmio driver into several modules
Date: Wed, 23 Mar 2011 13:42:29 +0000 [thread overview]
Message-ID: <Pine.LNX.4.64.1103231156220.6836@axis700.grange> (raw)
Hi all
This is version 2 of the patch series, posted on 11th of March. The only
change in this version is the dynamic allocation of the DMA bounce buffer,
as suggested by Magnus. Desription from the original post:
The tmio_mmc SD/SDIO driver is serving very different hardware
configurations: on the one hand multi-function style chips from Toshiba,
Compaq, on the other hand SDHI units in ARM- and SuperH-based sh-mobile
SoCs. Apart from the different native APIs: MFD for the former and
platform-device in the latter, sh-mobile implementations also have a
number of features, exclusive to them, which, if implemented in the common
driver, clutter it needlessly and make its maintenance more difficult.
This patch series simplifies the situation by splitting the driver up into
3 modules: the core, consisting of the main part and, on sh-mobile, of the
DMA part; the mfd glue; and the platform glue. This way also (imaginary)
sh-mobile systems with additional tmio mfd chips on them can be supported.
This patch-series touches code under
arch/arm/mach-shmobile
arch/sh/boards
drivers/mfd
drivers/mmc/host
Perhaps, it would be best to collect necessary acks from Paul and push
them all via mmc?
Thanks
Guennadi
---
Guennadi Liakhovetski, Ph.D.
Freelance Open-Source Software Developer
http://www.open-technology.de/
next reply other threads:[~2011-03-23 13:42 UTC|newest]
Thread overview: 12+ messages / expand[flat|nested] mbox.gz Atom feed top
2011-03-23 13:42 Guennadi Liakhovetski [this message]
2011-03-23 13:42 ` [PATCH 1/6 v2] mmc: tmio: split core functionality, DMA and MFD glue Guennadi Liakhovetski
2011-03-23 13:42 ` [PATCH 2/6] sh: ecovec: use the CONFIG_MMC_TMIO symbols instead of Guennadi Liakhovetski
2011-03-23 13:43 ` [PATCH 3/6 v2] mmc: tmio: convert the SDHI MMC driver from MFD to Guennadi Liakhovetski
2011-03-23 13:43 ` [PATCH 4/6] ARM: mach-shmobile: convert boards to use Guennadi Liakhovetski
2011-03-23 13:43 ` [PATCH 5/6] sh: convert boards to use linux/mmc/sh_mobile_sdhi.h Guennadi Liakhovetski
2011-03-23 13:43 ` [PATCH 6/6] mfd: remove now redundant sh_mobile_sdhi.h header Guennadi Liakhovetski
2011-03-23 14:07 ` Samuel Ortiz
2011-03-23 13:50 ` [PATCH 0/6 v2] mmc: split the tmio driver into several modules Paul Mundt
2011-03-23 23:02 ` Simon Horman
2011-03-23 23:16 ` Simon Horman
2011-03-24 7:34 ` Guennadi Liakhovetski
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