From: Daniel Lezcano <daniel.lezcano@linaro.org>
To: Thierry Reding <thierry.reding@gmail.com>
Cc: "Rafael J . Wysocki" <rafael@kernel.org>,
Amit Kucheria <amitk@kernel.org>, Zhang Rui <rui.zhang@intel.com>,
Jon Hunter <jonathanh@nvidia.com>,
linux-pm@vger.kernel.org, linux-tegra@vger.kernel.org,
linux-kernel@vger.kernel.org
Subject: Re: [PATCH 1/2] thermal: Add support for cooling device bind/unbind operations
Date: Fri, 10 Feb 2023 13:31:56 +0100 [thread overview]
Message-ID: <20230210123156.GE175687@linaro.org> (raw)
In-Reply-To: <20230209163555.1993557-1-thierry.reding@gmail.com>
On Thu, Feb 09, 2023 at 05:35:54PM +0100, Thierry Reding wrote:
> From: Thierry Reding <treding@nvidia.com>
>
> Drivers for cooling devices can implement these operations when they
> need to perform extra work at the time when a cooling device is bound to
> a given thermal zone.
The approach is not correct.
I'll react to the initial email:
Re: thermal/drivers/tegra: Getting rid of the get_thermal_instance() usage
https://lore.kernel.org/all/Y9J4WAFyXyV%2FnqlG@orome/
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prev parent reply other threads:[~2023-02-10 12:32 UTC|newest]
Thread overview: 3+ messages / expand[flat|nested] mbox.gz Atom feed top
2023-02-09 16:35 [PATCH 1/2] thermal: Add support for cooling device bind/unbind operations Thierry Reding
2023-02-09 16:35 ` [PATCH 2/2] thermal: tegra: Implement bind/unbind for cooling device Thierry Reding
2023-02-10 12:31 ` Daniel Lezcano [this message]
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