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Mon, 7 Sep 2026 08:50:36 +0000 (GMT) Message-ID: <792517c1-9970-44f2-8eff-2a87895cc37c@samsung.com> Date: Mon, 7 Sep 2026 14:20:35 +0530 Precedence: bulk X-Mailing-List: linux-usb@vger.kernel.org List-Id: List-Subscribe: List-Unsubscribe: MIME-Version: 1.0 User-Agent: Mozilla Thunderbird Subject: Re: [PATCH 2/3] dt-bindings: usb: Introduce samsung,snps-dwc3 To: Krzysztof Kozlowski , peter.griffin@linaro.org, alim.akhtar@samsung.com, gregkh@linuxfoundation.org, robh@kernel.org, conor+dt@kernel.org, Thinh.Nguyen@synopsys.com, linux-arm-kernel@lists.infradead.org, linux-samsung-soc@vger.kernel.org, linux-usb@vger.kernel.org, devicetree@vger.kernel.org, linux-kernel@vger.kernel.org Cc: jh0801.jung@samsung.com, dh10.jung@samsung.com, akash.m5@samsung.com, hongpooh.kim@samsung.com, eomji.oh@samsung.com, shijie.cai@samsung.com, muhammed.ali@samsung.com, thiagu.r@samsung.com Content-Language: en-US From: Selvarasu Ganesan In-Reply-To: <5629de34-1a63-40bf-8375-64be9a69eea2@kernel.org> Content-Transfer-Encoding: 7bit X-CMS-MailID: 20260907085039epcas5p24c419437ae9644adc78521646b2f1728 X-Msg-Generator: CA Content-Type: text/plain; charset="utf-8" CMS-TYPE: 105P cpgsPolicy: CPGSC10-542,Y X-CFilter-Loop: Reflected X-CMS-RootMailID: 20260903071318epcas5p4b804edb84554847c576d1d034b814d7a References: <20260903071250.3421499-1-selvarasu.g@samsung.com> <20260903071250.3421499-3-selvarasu.g@samsung.com> <5629de34-1a63-40bf-8375-64be9a69eea2@kernel.org> On 9/7/2026 12:37 PM, Krzysztof Kozlowski wrote: > On 07/09/2026 08:04, Selvarasu Ganesan wrote: >> On 9/5/2026 12:52 PM, Krzysztof Kozlowski wrote: >>> On 03/09/2026 09:12, Selvarasu Ganesan wrote: >>>> The Samsung Exynos8855 USB glue is not separate from the Synopsys DWC3 >>>> core, using a flattened model where the DWC3 controller is directly >>>> addressable rather than nested as a child node of a glue layer. >>>> >>>> Describe the Exynos USB block as a single node, referencing the split >>>> out Synopsys DWC3 core properties via snps,dwc3-common.yaml. The new >>>> binding follows the same approach as qcom,snps-dwc3. >>>> >>>> A generic fallback compatible "samsung,snps-dwc3" is introduced to >>>> describe this binding, selected by the validator based on the presence >>>> of the fallback string in the compatible list. Future Exynos SoCs >>> This is AI slop text. Over longish useless sentence describing diff >>> without actual information WHY. >>> >>> Don't send AI generated slop messages. >> Sorry for the misleading info on this commit message. We were trying to >> explain why a separate flattened representation is being introduced with >> using generic fallback string, and follow the style of some other DWC3 >> flattened refactors (like the Qualcomm : >> https://lore.kernel.org/all/20250414-dwc3-refactor-v7-2-f015b358722d@oss.qualcomm.com) >> to justify the separate binding, but it became too long. We'll simplify >> it and keep only the technical reasoning. > Flattened node is the right approach, so just say this is the first > Samsung Exynos binding using flattened node. Thanks for your update. We will update the commit message as follows and post a new patch set. And We are assuming that all other points including the clock count and the generic fallback compatible (samsung,snps-dwc3) are fine. dt-bindings: usb: Introduce samsung,snps-dwc3 Add the Samsung Exynos8855 DWC3 binding using a flattened node representation, where the DWC3 controller is directly addressable rather than nested as a child node of a glue layer. This is the first Samsung Exynos binding using the flattened representation. The existing samsung,exynos-dwc3 binding describes the parent and child representation used by existing Exynos SoCs, which can be migrated to the flattened model. Use the samsung,snps-dwc3 fallback compatible for Samsung Exynos SoCs sharing the same flattened model can be added by extending the compatible enum with per SoC clock and property constraints. Thanks, Selva > > > Best regards, > Krzysztof