I see your point, I agree the two layers of glue is bad.  But this means
the double code is spread across many drivers instead of being in one
place (fsl_soc.c).

On 7/7/07, Grant Likely <grant.likely@secretlab.ca> wrote:
>
> On 7/7/07, John Rigby <jcrigby@gmail.com> wrote:
> > > This same comment probably goes for the other arch_initcall functions
> > > in fsl_soc.c which do exactly the same thing for other devices.
> >
> > This depends,  some devices in fsl_soc.c may exist on non-powerpc SoCs
> > that do not have OF.  The USB core in 8349 for example also is in the
> > arm based mx27 and mx31.  These devices should remain platform devices
> > and the glue in fls_soc.c will continure to be needed.
>
> I disagree; the current method is "glue for the glue".  There is no
> reason why the driver cannot have two bindings; one for
> platform_device and one for of_platform_device.  It's about the same
> amount of code, but uses less indirection for the device tree case.
>
> Cheers,
> g.
>
>
> --
> Grant Likely, B.Sc., P.Eng.
> Secret Lab Technologies Ltd.
> grant.likely@secretlab.ca
> (403) 399-0195
>