I see your point, I agree the two layers of glue is bad.  But this means
the double code is spread across many drivers instead of being in one
place (fsl_soc.c).

On 7/7/07, Grant Likely <grant.likely@secretlab.ca> wrote:
On 7/7/07, John Rigby <jcrigby@gmail.com> wrote:
> > This same comment probably goes for the other arch_initcall functions
> > in fsl_soc.c which do exactly the same thing for other devices.
>
> This depends,  some devices in fsl_soc.c may exist on non-powerpc SoCs
> that do not have OF.  The USB core in 8349 for example also is in the
> arm based mx27 and mx31.  These devices should remain platform devices
> and the glue in fls_soc.c will continure to be needed.

I disagree; the current method is "glue for the glue".  There is no
reason why the driver cannot have two bindings; one for
platform_device and one for of_platform_device.  It's about the same
amount of code, but uses less indirection for the device tree case.

Cheers,
g.


--
Grant Likely, B.Sc., P.Eng.
Secret Lab Technologies Ltd.
grant.likely@secretlab.ca
(403) 399-0195