From mboxrd@z Thu Jan 1 00:00:00 1970 Return-Path: Received: (majordomo@vger.kernel.org) by vger.kernel.org via listexpand id S1757493AbcAONHH (ORCPT ); Fri, 15 Jan 2016 08:07:07 -0500 Received: from mail-wm0-f42.google.com ([74.125.82.42]:38617 "EHLO mail-wm0-f42.google.com" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S1755066AbcAONHA (ORCPT ); Fri, 15 Jan 2016 08:07:00 -0500 From: Matthias Brugger To: robh+dt@kernel.org, pawel.moll@arm.com, mark.rutland@arm.com, ijc+devicetree@hellion.org.uk, galak@codeaurora.org, heiko@sntech.de, catalin.marinas@arm.com, will.deacon@arm.com Cc: dianders@chromium.org, romain.perier@gmail.com, amstan@chromium.org, naobsd@gmail.com, sjoerd.simons@collabora.co.uk, andy.yan@rock-chips.com, briannorris@chromium.org, treding@nvidia.com, jic23@kernel.org, arnd@arndb.de, dmitry.torokhov@gmail.com, p.zabel@pengutronix.de, mbrugger@suse.com, olof@lixom.net, devicetree@vger.kernel.org, linux-arm-kernel@lists.infradead.org, linux-rockchip@lists.infradead.org, linux-kernel@vger.kernel.org, Matthias Brugger Subject: [PATCH 1/2] devicetree: bindings: Add vendor prefix for Tronsmart Date: Fri, 15 Jan 2016 14:06:31 +0100 Message-Id: <1452863192-29231-1-git-send-email-matthias.bgg@gmail.com> X-Mailer: git-send-email 2.6.2 Sender: linux-kernel-owner@vger.kernel.org List-ID: X-Mailing-List: linux-kernel@vger.kernel.org Tronsmart is a China based company building consumer electronic devices. Signed-off-by: Matthias Brugger --- Documentation/devicetree/bindings/vendor-prefixes.txt | 1 + 1 file changed, 1 insertion(+) diff --git a/Documentation/devicetree/bindings/vendor-prefixes.txt b/Documentation/devicetree/bindings/vendor-prefixes.txt index 55df1d4..f787742 100644 --- a/Documentation/devicetree/bindings/vendor-prefixes.txt +++ b/Documentation/devicetree/bindings/vendor-prefixes.txt @@ -231,6 +231,7 @@ toshiba Toshiba Corporation toumaz Toumaz tplink TP-LINK Technologies Co., Ltd. tronfy Tronfy +tronsmart Tronsmart truly Truly Semiconductors Limited upisemi uPI Semiconductor Corp. usi Universal Scientific Industrial Co., Ltd. -- 2.6.2