Re: [PATCH 0/2] dt: thermal: Fix broken cooling-maps

Wei Xu
2018-07-18T15:34:38Z

Hi Viresh,

On 2018/7/5 6:09, Viresh Kumar wrote:
> Hi,
>
> This is an attempt to fix the broken or partially defined DT bindings
> for cooling-maps. We should list every device that participates in
> cooling down at a certain trip point, instead of just the first in the
> list as that depends on certain ordering of events to work properly.
>
> The first patch extends the binding to allow a list of phandles in
> "cooling-device" property and the second patch fixes one of the
> platform's DT.
>
> This will be followed up by fixing all platform DT bindings that have
> these issues after this set is accepted.
>
> The kernel also requires some changes to handle the phandle list, but
> wouldn't break with these changes as it reads the first phandle in the
> list for now. We can update that separately.
>
> --
> viresh
>
> Viresh Kumar (2):
> dt-bindings: thermal: Allow multiple devices to share cooling map
> arm64: dts: hi6220: Add all CPUs in cooling maps
>
> Documentation/devicetree/bindings/thermal/thermal.txt | 11 +++--------
> arch/arm64/boot/dts/hisilicon/hi6220.dtsi | 9 ++++++++-
> 2 files changed, 11 insertions(+), 9 deletions(-)
>

Thanks!
Applied both to the hisilicon dt tree.

Best Regards,
Wei