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From: Zhang Rui <rui.zhang@intel.com>
To: Thomas Gleixner <tglx@linutronix.de>, Len Brown <lenb@kernel.org>
Cc: x86@kernel.org, linux-kernel@vger.kernel.org,
	Len Brown <len.brown@intel.com>,
	linux-pm@vger.kernel.org
Subject: Re: [PATCH 08/14] powercap/intel_rapl: Support multi-die/package
Date: Mon, 08 Apr 2019 09:35:47 +0800	[thread overview]
Message-ID: <1554687347.2178.1.camel@intel.com> (raw)
In-Reply-To: <alpine.DEB.2.21.1904052022310.1802@nanos.tec.linutronix.de>

On 五, 2019-04-05 at 20:27 +0200, Thomas Gleixner wrote:
> On Tue, 26 Feb 2019, Len Brown wrote:
> 
> > 
> > From: Zhang Rui <rui.zhang@intel.com>
> > 
> > On the new dual-die/package systems, the RAPL MSR becomes die-
> > scope.
> > Thus instead of one powercap device per physical package, now there
> > should be one powercap device for each unique die on these systems.
> > 
> > This patch introduces intel_rapl driver support for new
> > dual-die/package systems.
> This patch .... See Documentation/processs/
> 
> and this sentence is not really helpful either.
> 
> > 
> > On the hardwares that do not have multi-die,
> > topology_logical_die_id()
> > equals topology_physical_package_id(), thus there is no functional
> > change.
> Something like this:
> 
> To support this the RAPL package domain has to be identified by the
> die id
> instead of the package id. On single die CPUs the die id is the same
> as the
> physical package id.
> 
> Hmm?

Yeah, sounds much better.
Len, will you help me update the changelog or do you want me to send an
updated version to you?

thanks,
rui

> 
> > 
> > Signed-off-by: Zhang Rui <rui.zhang@intel.com>
> > Signed-off-by: Len Brown <len.brown@intel.com>
> > Acked-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
> > Cc: linux-pm@vger.kernel.org
> > ---
> >  drivers/powercap/intel_rapl.c | 4 ++--
> >  1 file changed, 2 insertions(+), 2 deletions(-)
> > 
> > diff --git a/drivers/powercap/intel_rapl.c
> > b/drivers/powercap/intel_rapl.c
> > index 6057d9695fed..8723e9ae7436 100644
> > --- a/drivers/powercap/intel_rapl.c
> > +++ b/drivers/powercap/intel_rapl.c
> > @@ -266,7 +266,7 @@ static struct rapl_domain
> > *platform_rapl_domain; /* Platform (PSys) domain */
> >  /* caller to ensure CPU hotplug lock is held */
> >  static struct rapl_package *rapl_find_package(int cpu)
> >  {
> > -	int id = topology_physical_package_id(cpu);
> > +	int id = topology_logical_die_id(cpu);
> >  	struct rapl_package *rp;
> >  
> >  	list_for_each_entry(rp, &rapl_packages, plist) {
> > @@ -1457,7 +1457,7 @@ static void rapl_remove_package(struct
> > rapl_package *rp)
> >  /* called from CPU hotplug notifier, hotplug lock held */
> >  static struct rapl_package *rapl_add_package(int cpu)
> >  {
> > -	int id = topology_physical_package_id(cpu);
> > +	int id = topology_logical_die_id(cpu);
> >  	struct rapl_package *rp;
> >  	int ret;
> >  

  reply	other threads:[~2019-04-08  1:35 UTC|newest]

Thread overview: 39+ messages / expand[flat|nested]  mbox.gz  Atom feed  top
2019-02-26  6:19 [PATCH 0/14] v2 multi-die/package topology support Len Brown
2019-02-26  6:19 ` [PATCH 01/14] x86 topology: Fix doc typo Len Brown
2019-02-26  6:20   ` [PATCH 02/14] topolgy: Simplify cputopology.txt formatting and wording Len Brown
2019-02-26  6:20   ` [PATCH 03/14] x86 smpboot: Rename match_die() to match_pkg() Len Brown
2019-02-26  6:20   ` [PATCH 04/14] x86 topology: Add CPUID.1F multi-die/package support Len Brown
2019-02-26 19:46     ` Dave Hansen
2019-02-28 15:43       ` Len Brown
2019-04-05 18:16         ` Thomas Gleixner
2019-02-26  6:20   ` [PATCH 05/14] cpu topology: Export die_id Len Brown
2019-03-07 14:45     ` Morten Rasmussen
2019-03-26 18:18       ` Len Brown
2019-02-26  6:20   ` [PATCH 06/14] x86 topology: Define topology_logical_die_id() Len Brown
2019-02-26  6:20   ` [PATCH 07/14] powercap/intel_rapl: Simplify rapl_find_package() Len Brown
2019-02-26 19:06     ` Peter Zijlstra
2019-03-26 18:27       ` Len Brown
2019-02-26  6:20   ` [PATCH 08/14] powercap/intel_rapl: Support multi-die/package Len Brown
2019-04-05 18:27     ` Thomas Gleixner
2019-04-08  1:35       ` Zhang Rui [this message]
2019-02-26  6:20   ` [PATCH 09/14] thermal/x86_pkg_temp_thermal: " Len Brown
2019-04-05 18:29     ` Thomas Gleixner
2019-04-05 18:39       ` Brown, Len
2019-04-05 18:50         ` Thomas Gleixner
2019-02-26  6:20   ` [PATCH 10/14] powercap/intel_rapl: update rapl domain name and debug messages Len Brown
2019-02-26  6:20   ` [PATCH 11/14] hwmon/coretemp: Support multi-die/package Len Brown
2019-02-26  6:20   ` [PATCH 12/14] topology: Create package_threads sysfs attribute Len Brown
2019-02-26  6:20   ` [PATCH 13/14] topology: Create core_threads " Len Brown
2019-02-26  6:20   ` [PATCH 14/14] topology: Create die_threads " Len Brown
2019-02-26 18:51 ` [PATCH 0/14] v2 multi-die/package topology support Peter Zijlstra
2019-04-12 19:32   ` Len Brown
2019-02-26 18:53 ` Peter Zijlstra
2019-03-07 14:59   ` Morten Rasmussen
2019-04-05 18:33     ` Thomas Gleixner
2019-04-12 19:52       ` Len Brown
2019-04-12 20:40         ` Brice Goglin
2019-02-26 19:05 ` Peter Zijlstra
2019-04-30  6:50   ` Len Brown
2019-04-30  9:33     ` Borislav Petkov
2019-04-30 18:46       ` Len Brown
2019-04-05 18:33 ` Thomas Gleixner

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