Re: SMP/cc Cluster description [was Linux/Pro]

Alan Cox
2001-12-06T00:36:08Z

> So either way, you wind up with SMP on one die. (You can't make chips TOO
> much smaller because it becomes less economical to cut the wafer up that
> small. Harvesting and connecting the chips at finer granularity increases

Except for VIA (where they cant really make them much smaller) the
mainstream x86 dies are _gigantic_