Re: [PATCH] bonding: fix multiple module load problem

David Miller
2009-06-11T12:44:46Z

From: Stephen Hemminger <shemminger@vyatta.com>
Date: Tue, 9 Jun 2009 23:07:54 -0700

> Some users still load bond module multiple times to create bonding
> devices. This accidentally was broken by a later patch about
> the time sysfs was fixed. According to Jay, it was broken
> by:
> commit b8a9787eddb0e4665f31dd1d64584732b2b5d051
> Author: Jay Vosburgh <fubar@us.ibm.com>
> Date: Fri Jun 13 18:12:04 2008 -0700
>
> bonding: Allow setting max_bonds to zero
>
> Note: sysfs and procfs still produce WARN() messages when this is done
> so the sysfs method is the recommended API.
>
> Signed-off-by: Stephen Hemminger <shemminger@vyatta.com>

Applied, and queued up for -stable, thanks!