[patch 024/108] bonding: fix multiple module load problem

Greg KH
2009-07-01T00:53:29Z

[-- Attachment #1: bonding-fix-multiple-module-load-problem.patch --]
[-- Type: text/plain, Size: 1286 bytes --]

2.6.30-stable review patch. If anyone has any objections, please let us know.

------------------

From: Stephen Hemminger <shemminger@vyatta.com>

[ Upstream commit 130aa61a77b8518f1ea618e1b7d214d60b405f10 ]

Some users still load bond module multiple times to create bonding
devices. This accidentally was broken by a later patch about
the time sysfs was fixed. According to Jay, it was broken
by:
commit b8a9787eddb0e4665f31dd1d64584732b2b5d051
Author: Jay Vosburgh <fubar@us.ibm.com>
Date: Fri Jun 13 18:12:04 2008 -0700

bonding: Allow setting max_bonds to zero

Note: sysfs and procfs still produce WARN() messages when this is done
so the sysfs method is the recommended API.

Signed-off-by: Stephen Hemminger <shemminger@vyatta.com>
Signed-off-by: Jay Vosburgh <fubar@us.ibm.com>
Signed-off-by: David S. Miller <davem@davemloft.net>
Signed-off-by: Greg Kroah-Hartman <gregkh@suse.de>

---
drivers/net/bonding/bond_sysfs.c | 1 +
1 file changed, 1 insertion(+)

--- a/drivers/net/bonding/bond_sysfs.c
+++ b/drivers/net/bonding/bond_sysfs.c
@@ -1538,6 +1538,7 @@ int bond_create_sysfs(void)
printk(KERN_ERR
"network device named %s already exists in sysfs",
class_attr_bonding_masters.attr.name);
+ ret = 0;
}

return ret;