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Date: Mon, 7 Apr 2014 18:02:18 -0500
From: Felipe Balbi <balbi@ti.com>
To: Randy Dunlap <rdunlap@infradead.org>
CC: Apelete Seketeli <apelete@seketeli.net>, <linux-doc@vger.kernel.org>,
        Rob Landley <rob@landley.net>, Jiri Kosina <jkosina@suse.cz>,
        David Fries <David@Fries.net>,
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        Ben Hutchings <ben@decadent.org.uk>,
        Lars-Peter Clausen <lars@metafoo.de>, <linux-kernel@vger.kernel.org>,
        Felipe Balbi <balbi@ti.com>, USB list <linux-usb@vger.kernel.org>
Subject: Re: [RESEND PATCH v2] documentation: docbook: document process of
 writing an musb glue layer
Message-ID: <20140407230218.GA28921@saruman.home>
Reply-To: <balbi@ti.com>
References: <20140405183636.GO22445@amegan>
 <20140405184205.GP22445@amegan>
 <534322B9.30605@infradead.org>
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Hi,

On Mon, Apr 07, 2014 at 03:12:09PM -0700, Randy Dunlap wrote:
> On 04/05/2014 11:42 AM, Apelete Seketeli wrote:
> > Document the process of writing an musb glue layer by taking the
> > Ingenic JZ4740 glue layer as an example, as it seems more simple than
> > most glue layers due to the basic feature set of the JZ4740 USB device
> > controller.
> >=20
> > Signed-off-by: Apelete Seketeli <apelete@seketeli.net>
>=20
> Hi,
>=20
> You should be cc-ing the musb maintainer and the USB mailing list (so now=
 done).
>=20
> Felipe should probably be the person to merge this unless he wants me
> to do it...

I'll merge it, just resend once -rc1 is out. Thanks

--=20
balbi

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