From mboxrd@z Thu Jan 1 00:00:00 1970 Return-Path: Received: (majordomo@vger.kernel.org) by vger.kernel.org via listexpand id S932375AbaIRRST (ORCPT ); Thu, 18 Sep 2014 13:18:19 -0400 Received: from mail-pa0-f45.google.com ([209.85.220.45]:45339 "EHLO mail-pa0-f45.google.com" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S932081AbaIRRSR (ORCPT ); Thu, 18 Sep 2014 13:18:17 -0400 Date: Thu, 18 Sep 2014 10:18:12 -0700 From: Dmitry Torokhov To: Tomeu Vizoso Cc: Caesar Wang , heiko@sntech.de, rui.zhang@intel.com, edubezval@gmail.com, Arnd Bergmann , "linux-kernel@vger.kernel.org" , linux-pm@vger.kernel.org, "linux-arm-kernel@lists.infradead.org" , "devicetree@vger.kernel.org" , linux-doc@vger.kernel.org, huangtao@rock-chips.com, cf@rock-chips.com, dianders@chromium.org, addy.ke@rock-chips.com, zyf@rock-chips.com, cjf@rock-chips.com Subject: Re: [PATCH v5 2/4] dt-bindings: document Rockchip thermal Message-ID: <20140918171809.GD14809@core.coreip.homeip.net> References: <1410926353-15674-1-git-send-email-caesar.wang@rock-chips.com> <1410926353-15674-3-git-send-email-caesar.wang@rock-chips.com> <541ADD58.7070901@rock-chips.com> MIME-Version: 1.0 Content-Type: text/plain; charset=utf-8 Content-Disposition: inline Content-Transfer-Encoding: 8bit In-Reply-To: User-Agent: Mutt/1.5.21 (2010-09-15) Sender: linux-kernel-owner@vger.kernel.org List-ID: X-Mailing-List: linux-kernel@vger.kernel.org On Thu, Sep 18, 2014 at 04:19:26PM +0200, Tomeu Vizoso wrote: > On 18 September 2014 15:25, Caesar Wang wrote: > > Tomeu, > > > > 在 2014年09月18日 17:27, Tomeu Vizoso 写道: > >> > >> On 17 September 2014 05:59, Caesar Wang > >> wrote: > >>> > >>> This add the necessary binding documentation for the thermal > >>> found on Rockchip SoCs > >> > >> Hi Caesar, > >> > >> is there any reason to not use the existing thermal bindings? You can > >> find a description in > >> Documentation/devicetree/bindings/thermal/thermal.txt and example code > >> in omap, or in the patches for Tegra recently posted by Mikko > >> Perttunen. > >> > >> Regards, > >> > >> Tomeu > > > > > > Why should I use the existing thermal bindings? > > Because otherwise, you are asking to merge duplicated code. There's a > generic way to define thermal zones, trip points, cooling devices, > etc. And also code to parse and plug them together. Why add > soc-specific code to do the same? > > > I believe omap,tegar and rockchip are the three seperate thermals driver. > > Yes, and OMAP is already using the generic bindings, and the proposed > patches for Tegra as well, and I think it would make sense for > Rockchip to also use them (unless I'm missing something). You are talking about drivers/thermal/of-thermal.c, right? Yes, I think Rockchip should be using the same generic framework if possible. Thanks. -- Dmitry