From mboxrd@z Thu Jan 1 00:00:00 1970 Return-Path: Received: (majordomo@vger.kernel.org) by vger.kernel.org via listexpand id S1758646AbcBXS3F (ORCPT ); Wed, 24 Feb 2016 13:29:05 -0500 Received: from foss.arm.com ([217.140.101.70]:46256 "EHLO foss.arm.com" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S1757075AbcBXS3B (ORCPT ); Wed, 24 Feb 2016 13:29:01 -0500 Date: Wed, 24 Feb 2016 18:28:57 +0000 From: Javi Merino To: Leo Yan Cc: Wei Xu , Rob Herring , Pawel Moll , Mark Rutland , Ian Campbell , Kumar Gala , Catalin Marinas , Will Deacon , Zhang Rui , Eduardo Valentin , kongxinwei , Punit Agrawal , linux-arm-kernel@lists.infradead.org, devicetree@vger.kernel.org, linux-kernel@vger.kernel.org, linux-pm@vger.kernel.org Subject: Re: [PATCH 3/3] arm64: dts: register Hi6220's thermal zone for power allocator Message-ID: <20160224182856.GD3006@e104805> References: <1455983529-9559-1-git-send-email-leo.yan@linaro.org> <1455983529-9559-4-git-send-email-leo.yan@linaro.org> MIME-Version: 1.0 Content-Type: text/plain; charset=utf-8 Content-Disposition: inline In-Reply-To: <1455983529-9559-4-git-send-email-leo.yan@linaro.org> User-Agent: Mutt/1.5.21 (2010-09-15) Sender: linux-kernel-owner@vger.kernel.org List-ID: X-Mailing-List: linux-kernel@vger.kernel.org On Sat, Feb 20, 2016 at 11:52:09PM +0800, Leo Yan wrote: > With profiling Hi6220's power modeling so get dynamic coefficient and > sustainable power. So pass these parameters from DT. > > Now enable power allocator wit only one actor for CPU part, so directly > use cluster0's thermal sensor for monitoring temperature. > > Signed-off-by: Leo Yan > --- > arch/arm64/boot/dts/hisilicon/hi6220.dtsi | 36 +++++++++++++++++++++++++++++++ > 1 file changed, 36 insertions(+) > > diff --git a/arch/arm64/boot/dts/hisilicon/hi6220.dtsi b/arch/arm64/boot/dts/hisilicon/hi6220.dtsi > index 50ba1b0..3608a3e 100644 > --- a/arch/arm64/boot/dts/hisilicon/hi6220.dtsi > +++ b/arch/arm64/boot/dts/hisilicon/hi6220.dtsi > @@ -6,6 +6,7 @@ > > #include > #include > +#include > > / { > compatible = "hisilicon,hi6220"; > @@ -87,6 +88,7 @@ > cooling-max-level = <0>; > #cooling-cells = <2>; /* min followed by max */ > cpu-idle-states = <&CPU_SLEEP &CLUSTER_SLEEP>; > + dynamic-power-coefficient = <311>; > }; > > cpu1: cpu@1 { > @@ -322,5 +324,39 @@ > clock-names = "thermal_clk"; > #thermal-sensor-cells = <1>; > }; > + > + thermal-zones { > + > + cls0: cls0 { > + polling-delay = <1000>; > + polling-delay-passive = <100>; > + sustainable-power = <3326>; > + > + /* sensor ID */ > + thermal-sensors = <&tsensor 2>; > + > + trips { > + threshold: trip-point@0 { > + temperature = <65000>; > + hysteresis = <1000>; As far as I know, hysteresis is ignored in the thermal subsystem right now, so you could remove it from both trip points. > + type = "passive"; > + }; > + > + target: trip-point@1 { > + temperature = <75000>; > + hysteresis = <1000>; > + type = "passive"; > + }; > + }; > + > + cooling-maps { > + map0 { > + trip = <&target>; > + contribution = <1024>; As Hikey has only one voltage domain, you only have one cpu cooling device. "contribution" is only useful when you have more than one cooling device, as it's relative to the other cooling device's contribution. You can remove contribution from here. Other than this minor stuff, it looks good to me. FWIW, Reviewed-by: Javi Merino > + cooling-device = <&cpu0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>; > + }; > + }; > + }; > + }; > }; > };