Re: [PATCH 0/9] arm64: introduce Black Sesame Technologies C1200 SoC and CDCU1.0 board

Albert Yang
2025-09-25T12:27:22Z

On Thu, Sep 25, 2025 at 05:03:57PM +0800, Albert Yang wrote:Subject: Re: [PATCH] splitting SoC and MMC parts

Hi Arnd,

I may have missed an important detail in my previous note. If I split
out the MMC-related patches and submit only the SoC parts first, I
cannot validate the SoC on real hardware: both the kernel and the root
filesystem live on the MMC device. Without the MMC stack (DT bindings
and the controller driver), the board does not boot to userspace, so I
cannot properly verify the SoC/DT changes in isolation.

Would you prefer that I:
- keep the MMC pieces in the same series for initial bring-up; or
- validate everything locally, then send only the SoC/DT parts first and
follow up with the MMC binding/driver as a separate series?

I’m not entirely sure which approach best matches the normal workflow,
so your guidance would be appreciated. I can proceed whichever way you
think is most appropriate.

Thanks for the review and suggestions.

Best regards,
Albert