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From: Albert Yang <yangzh0906@thundersoft.com>
To: arnd@arndb.de
Cc: adrian.hunter@intel.com, bst-upstream@bstai.top,
	catalin.marinas@arm.com, conor+dt@kernel.org,
	devicetree@vger.kernel.org, gordon.ge@bst.ai, krzk+dt@kernel.org,
	krzysztof.kozlowski@linaro.org,
	linux-arm-kernel@lists.infradead.org,
	linux-kernel@vger.kernel.org, linux-mmc@vger.kernel.org,
	robh@kernel.org, ulf.hansson@linaro.org, will@kernel.org,
	yangzh0906@thundersoft.com
Subject: Re: [PATCH 0/9] arm64: introduce Black Sesame Technologies C1200 SoC and CDCU1.0 board
Date: Thu, 25 Sep 2025 20:11:54 +0800	[thread overview]
Message-ID: <20250925121155.2401934-1-yangzh0906@thundersoft.com> (raw)
In-Reply-To: <20250925090412.2068216-1-yangzh0906@thundersoft.com>

On Thu, Sep 25, 2025 at 05:03:57PM +0800, Albert Yang wrote:Subject: Re: [PATCH] splitting SoC and MMC parts

Hi Arnd,

I may have missed an important detail in my previous note. If I split
out the MMC-related patches and submit only the SoC parts first, I
cannot validate the SoC on real hardware: both the kernel and the root
filesystem live on the MMC device. Without the MMC stack (DT bindings
and the controller driver), the board does not boot to userspace, so I
cannot properly verify the SoC/DT changes in isolation.

Would you prefer that I:
- keep the MMC pieces in the same series for initial bring-up; or
- validate everything locally, then send only the SoC/DT parts first and
  follow up with the MMC binding/driver as a separate series?

I’m not entirely sure which approach best matches the normal workflow,
so your guidance would be appreciated. I can proceed whichever way you
think is most appropriate.

Thanks for the review and suggestions.

Best regards,
Albert 

  reply	other threads:[~2025-09-25 12:27 UTC|newest]

Thread overview: 28+ messages / expand[flat|nested]  mbox.gz  Atom feed  top
2025-09-23  6:10 [PATCH 0/9] arm64: introduce Black Sesame Technologies C1200 SoC and CDCU1.0 board Albert Yang
2025-09-23  6:10 ` [PATCH 1/9] dt-bindings: vendor-prefixes: Add Black Sesame Technologies Co., Ltd Albert Yang
2025-09-23  6:10 ` [PATCH 2/9] dt-bindings: arm: add Black Sesame Technologies (bst) SoC Albert Yang
2025-09-23  6:10 ` [PATCH 3/9] arm64: Kconfig: add ARCH_BST for Black Sesame Technologies SoCs Albert Yang
2025-09-23  6:10 ` [PATCH 4/9] dt-bindings: mmc: add binding for BST DWCMSHC SDHCI controller Albert Yang
2025-09-23 10:13   ` Rob Herring (Arm)
2025-10-15  9:31     ` Albert Yang
2025-09-23 13:56   ` Rob Herring
2025-09-26  3:06     ` [PATCH v4 4/9] dt-bindings: mmc: Add Black Sesame Technologies DWCMSHC SDHCI Albert Yang
2025-10-15  9:09     ` [PATCH 4/9] dt-bindings: mmc: add binding for BST DWCMSHC SDHCI controller Albert Yang
2025-09-23  6:10 ` [PATCH 5/9] mmc: sdhci: add Black Sesame Technologies BST C1200 controller driver Albert Yang
2025-09-29 13:25   ` Adrian Hunter
2025-10-15  7:06     ` Albert Yang
2025-11-12 13:29   ` Jisheng Zhang
2025-09-23  6:10 ` [PATCH 6/9] mmc: sdhci: allow drivers to pre-allocate bounce buffer Albert Yang
2025-09-29 13:26   ` Adrian Hunter
2025-10-15  7:20     ` Albert Yang
2025-09-23  6:10 ` [PATCH 7/9] arm64: dts: bst: add support for Black Sesame Technologies C1200 CDCU1.0 board Albert Yang
2025-09-23  6:10 ` [PATCH 8/9] arm64: defconfig: enable BST platform and SDHCI controller support Albert Yang
2025-09-23  6:10 ` [PATCH 9/9] MAINTAINERS: add Black Sesame Technologies (BST) ARM SoC support Albert Yang
2025-09-29 13:29   ` Adrian Hunter
2025-10-15  7:30     ` Albert Yang
2025-09-25  7:06 ` [PATCH 0/9] arm64: introduce Black Sesame Technologies C1200 SoC and CDCU1.0 board Arnd Bergmann
2025-09-25  9:03   ` Albert Yang
2025-09-25 12:11     ` Albert Yang [this message]
2025-09-25 13:34       ` Ulf Hansson
2025-09-25 13:38         ` Arnd Bergmann
2025-09-26  1:48           ` Albert Yang

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