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From: keerthy <j-keerthy@ti.com>
To: Eduardo Valentin <eduardo.valentin@ti.com>
Cc: <rui.zhang@intel.com>, <linux-pm@vger.kernel.org>,
	<linux-kernel@vger.kernel.org>,
	Grant Likely <grant.likely@linaro.org>,
	Rob Herring <rob.herring@calxeda.com>,
	Rob Landley <rob@landley.net>,
	Greg Kroah-Hartman <gregkh@linuxfoundation.org>,
	<devicetree-discuss@lists.ozlabs.org>,
	<linux-doc@vger.kernel.org>
Subject: Re: [PATCH 7/7] thermal: ti-soc-thermal: add DT example for DRA752 chip
Date: Thu, 30 May 2013 14:26:53 +0530	[thread overview]
Message-ID: <51A71455.9000002@ti.com> (raw)
In-Reply-To: <1369840066-20357-8-git-send-email-eduardo.valentin@ti.com>

Hi Eduardo,

On 05/29/2013 08:37 PM, Eduardo Valentin wrote:

> Update documentation by adding an example for DRA752 on DT description.
> 
> Cc: linux-pm@vger.kernel.org
> Cc: linux-kernel@vger.kernel.org
> Cc: Grant Likely <grant.likely@linaro.org>
> Cc: Rob Herring <rob.herring@calxeda.com>
> Cc: Rob Landley <rob@landley.net>
> Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
> Cc: Zhang Rui <rui.zhang@intel.com>
> Cc: J Keerthy <j-keerthy@ti.com>
> Cc: devicetree-discuss@lists.ozlabs.org
> Cc: linux-doc@vger.kernel.org
> Cc: linux-kernel@vger.kernel.org
> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
> ---
>  Documentation/devicetree/bindings/thermal/ti_soc_thermal.txt | 12 ++++++++++++
>  1 file changed, 12 insertions(+)
> 
> diff --git a/Documentation/devicetree/bindings/thermal/ti_soc_thermal.txt b/Documentation/devicetree/bindings/thermal/ti_soc_thermal.txt
> index 1629652..1953b33 100644
> --- a/Documentation/devicetree/bindings/thermal/ti_soc_thermal.txt
> +++ b/Documentation/devicetree/bindings/thermal/ti_soc_thermal.txt
> @@ -59,3 +59,15 @@ bandgap {
>  	compatible = "ti,omap5430-bandgap";
>  	interrupts = <0 126 4>; /* talert */
>  };
> +
> +DRA752:
> +bandgap {
> +	reg = <0x4a0021e0 0xc
> +		0x4a00232c 0xc
> +		0x4a002380 0x2c
> +		0x4a0023C0 0x3c
> +		0x4a002564 0x8
> +		0x4a002574 0x50>;
> +	compatible = "ti,dra752-bandgap";


The general convention seems to be keeping it as dra7xx or dra7.
Why add specific nodes like dra752? We can always reuse for
forthcoming dra7 processors if the same address mapping and IP
is retained right?

> +	interrupts = <0 126 4>; /* talert */


The TRM does not have any term called talert. Can the comment
be /* thermal_alert */ so it is easy to figure out what it is.

> +};


Regards,
Keerthy

  reply	other threads:[~2013-05-30  9:05 UTC|newest]

Thread overview: 15+ messages / expand[flat|nested]  mbox.gz  Atom feed  top
2013-05-29 15:07 [PATCH 0/7] thermal: ti-soc-thermal: fixes and DRA752 support Eduardo Valentin
2013-05-29 15:07 ` [PATCH 1/7] thermal: ti-soc-thermal: update DT reference for OMAP5430 Eduardo Valentin
2013-05-29 15:07 ` [PATCH 2/7] thermal: ti-soc-thermal: remove external heat while extrapolating hotspot Eduardo Valentin
2013-05-29 15:07 ` [PATCH 3/7] thermal: ti-soc-thermal: freeze FSM while computing trend Eduardo Valentin
2013-06-07 19:10   ` Eduardo Valentin
2013-06-07 19:13     ` [PATCHv2 " Eduardo Valentin
2013-05-29 15:07 ` [PATCH 4/7] thermal: ti-soc-thermal: remove usage of IS_ERR_OR_NULL Eduardo Valentin
2013-05-29 15:07 ` [PATCH 5/7] thermal: ti-soc-thermal: add thermal data for DRA752 chips Eduardo Valentin
2013-06-03 20:31   ` Eduardo Valentin
2013-06-03 20:33     ` [PATCHv2 " Eduardo Valentin
2013-05-29 15:07 ` [PATCH 6/7] thermal: ti-soc-thermal: add dra752 chip to device table Eduardo Valentin
2013-05-29 15:07 ` [PATCH 7/7] thermal: ti-soc-thermal: add DT example for DRA752 chip Eduardo Valentin
2013-05-30  8:56   ` keerthy [this message]
2013-05-30 13:52     ` Eduardo Valentin
2013-06-13  2:20 ` [PATCH 0/7] thermal: ti-soc-thermal: fixes and DRA752 support Zhang Rui

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