From mboxrd@z Thu Jan 1 00:00:00 1970 Return-Path: Received: (majordomo@vger.kernel.org) by vger.kernel.org via listexpand id S1751509AbbCTDJj (ORCPT ); Thu, 19 Mar 2015 23:09:39 -0400 Received: from szxga02-in.huawei.com ([119.145.14.65]:35977 "EHLO szxga02-in.huawei.com" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S1750734AbbCTDJf (ORCPT ); Thu, 19 Mar 2015 23:09:35 -0400 Message-ID: <550B8F98.3070701@hisilicon.com> Date: Fri, 20 Mar 2015 11:10:16 +0800 From: kongxinwei User-Agent: Mozilla/5.0 (Windows NT 6.1; WOW64; rv:31.0) Gecko/20100101 Thunderbird/31.5.0 MIME-Version: 1.0 To: Mark Rutland CC: "rui.zhuang@intel.com" , "edubezval@gmail.com" , "linux-pm@vger.kernel.org" , "linux-kernel@vger.kernel.org" , "linux-arm-kernel@lists.infradead.org" , "linuxarm@huawei.com" , "devicetree@vger.kernel.org" , "liguozhu@hisilicon.com" , "xuwei5@hisilicon.com" , Subject: Re: [PATCH 0/3] 96boards: add thermal senor support to hikey board References: <1426751849-10604-1-git-send-email-kong.kongxinwei@hisilicon.com> <20150319135946.GG18473@leverpostej> In-Reply-To: <20150319135946.GG18473@leverpostej> Content-Type: text/plain; charset="UTF-8" Content-Transfer-Encoding: 8bit X-Originating-IP: [10.46.101.210] X-CFilter-Loop: Reflected Sender: linux-kernel-owner@vger.kernel.org List-ID: X-Mailing-List: linux-kernel@vger.kernel.org hi Mark Rutland: 在 2015/3/19 21:59, Mark Rutland 写道: > On Thu, Mar 19, 2015 at 07:57:26AM +0000, kongxinwei wrote: >> The Linaro connect introduce 96boards series in Hong Kong,The HiKey board >> is the first board to be certified 96Boards Consumer Edition compatible. >> This board is based on the HiSilicon SoC. you can get more information >> from https://www.96boards.org. >> >> The hisilicon SoC contains thermal module, this thermal module has 4 sensors, >> >> - sensor 0: local sensor; >> - sensor 1: remote sensor for ACPU cluster 1; >> - sensor 2: remote sensor for ACPU cluster 2; >> - sensor 3: remote sensor for GPU; >> >> It can obtain this device temperature by operating this hardware. The new >> sensor driver satisfies thermal framework and to realize the ACPU ,GPU and >> so on to cool function. >> >> kongxinwei (3): >> thermal: hisilicon: add new hisilicon thermal sensor driver >> dts: hi6220: enable thermal sensor for hisilicon SoC >> dt-bindings: Document the hi6220 thermal sensor bindings >> >> .../bindings/thermal/hisilicon-thermal.txt | 51 ++ >> arch/arm64/boot/dts/hisilicon/hi6220.dtsi | 153 ++++++ >> drivers/thermal/Kconfig | 8 + >> drivers/thermal/Makefile | 1 + >> drivers/thermal/hisi_thermal.c | 531 +++++++++++++++++++++ > > Mainline does not have a hi6220 dtsi. > > Which tree is this against? > > What are your dependencies? > > Mark. > Hikey board code are being upstreamed by our team.If hi6220 dtsi be accepted, this patch is ok. Xinwei > . >