Re: [PATCH 1/3] dt-bindings: Document the hi3660 thermal sensor bindings

[Wei Xu <xuwei5@hisilicon.com>]

Hi Tao,

On 2017/6/20 4:40, Tao Wang wrote:
> This adds documentation of device tree bindings for the
> thermal sensor controller of hi3660 SoC.
> 
> Signed-off-by: Tao Wang <kevin.wangtao@hisilicon.com>
> ---
>  .../devicetree/bindings/thermal/hi3660-thermal.txt |   17 +++++++++++++++++
>  1 file changed, 17 insertions(+)
>  create mode 100644 Documentation/devicetree/bindings/thermal/hi3660-thermal.txt
> 
> diff --git a/Documentation/devicetree/bindings/thermal/hi3660-thermal.txt b/Documentation/devicetree/bindings/thermal/hi3660-thermal.txt
> new file mode 100644
> index 0000000..c034670
> --- /dev/null
> +++ b/Documentation/devicetree/bindings/thermal/hi3660-thermal.txt
> @@ -0,0 +1,17 @@
> +* Temperature Sensor on hisilicon hi3660 SoC
> +
> +** Required properties :
> +
> +- compatible: "hisilicon,thermal-hi3660".

It is better to put the SoC name before the function string.

BR,
Wei

> +- reg: physical base address of thermal sensor and length of memory mapped
> +  region.
> +- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description.
> +
> +Example :
> +
> +	tsensor: tsensor {
> +		compatible = "hisilicon,thermal-hi3660";
> +		reg = <0x0 0xfff30000 0x0 0x1000>;
> +		#thermal-sensor-cells = <1>;
> +		status = "ok";
> +	 };
>