Re: [PATCH 1/2] mtd: spi-nor: winbond: Add support for w25q01jv

[Miquel Raynal <miquel.raynal@bootlin.com>]

Hello Pratyush,

>>  static const struct spi_nor_otp_ops winbond_nor_otp_ops = {
>>  	.read = spi_nor_otp_read_secr,
>>  	.write = spi_nor_otp_write_secr,
>> @@ -334,6 +413,9 @@ static int winbond_nor_late_init(struct spi_nor *nor)
>>  {
>>  	struct spi_nor_flash_parameter *params = nor->params;
>>  
>> +	if (params->n_dice > 1)
>> +		params->ready = winbond_multi_die_ready;
>> +
>
> Is this true for all multi-die Winbond flashes, and going to hold true
> for future ones? If not, I suppose this should go in the flash-specific
> fixup hook. Do it in either the flash-specific late_init hook, or in the
> post_sfdp hook, I have no strong opinions.

So, after talking to Winbond, it appears that we can reduce the scope of
this fixup to the following parts which are impacted:
- W25Q0{1,2}JV
- W25H0{1,2}JV
- W25Q0{1,2}NW
- W35T0{1,2}NW
Future chips being fixed in hardware.

I'll probably use the post_sfdp flash-specific hook as you suggest.

Thanks,
Miquèl