[PATCH 0/2] mtd: spi-nor: winbond: Add support for flashes with several dies

Miquel Raynal
2024-12-24T16:47:55Z

Some Winbond devices are made of up smaller stacked dies, like for
instance W25Q01JV which is a 1G-bit serial flash memory made of two
512M-bit dies, and W25Q02JV which is made of four of them. Internally,
the dies can either be in the active state (only one at a time), the
others being in the idle state. Problem: there are commands impacting
all 4 dies, for which we monitor the state of the chip reading the
status register, but the status register only gives the status of the
active die. It was observed a possible internal deviation of up to 200us
between each die when doing similar operations, which can lead to
races. This series aims at supporting these chips properly.

---
Miquel Raynal (2):
mtd: spi-nor: winbond: Add support for w25q01jv
mtd: spi-nor: winbond: Add support for w25q02jv

drivers/mtd/spi-nor/winbond.c | 87 +++++++++++++++++++++++++++++++++++++++++++
1 file changed, 87 insertions(+)
---
base-commit: cfb48994051444aa6b620e48898f95ea91d193c5
change-id: 20241223-winbond-6-12-rc1-nor-volatile-bit-ffa03c566b92

Best regards,
--
Miquel Raynal <miquel.raynal@bootlin.com>